TI TMS37F158

TMS37F158
www.ti.com
SCBS877 – MAY 2012
CONTROLLER ENTRY DEVICE WITH INTEGRATED DST80 AUTHENTICATION, EEPROM,
AND LF IMMOBILIZER INTERFACE
Check for Samples: TMS37F158
FEATURES
1
•
•
•
Wide Supply Voltage Range: 2.0 V to 3.6 V
Ultra-Low Power Consumption
– CPU Active Mode: 200 μA/MHz at 2.2 V
– Standby Mode (LPM3): 0.7 μA
– Off Mode (LPM4): 0.1 μA
– Power Down Mode: 60 nA
Microcontroller System and Peripherals
– 16-Bit RISC Architecture, 125-ns Instruction
Cycle Time
– Wake-Up From Standby Mode in <6 μs
– Basic Clock Module Configurations
– Single External Resistor
– 32-kHz Crystal
– High-Frequency Crystal
– Resonator
– External Clock Source
– 16-Bit Timer_A With Three
Capture/Compare Registers
– 8KB + 256B Flash Memory
– 256B RAM
– 150-Byte EEPROM
– Serial Onboard Programming, No External
Programming Voltage Needed
– Programmable Code Protection by Security
Fuse
– 80-Bit DST80 Security Authentication
Coprocessor
– 12 I/O Ports
– Integrated Push-Button Logic
•
Low-Frequency (LF) Immobilizer Interface
– Integrated Batteryless Immobilizer Interface
– Half-Duplex (HDX) Immobilizer
Communication Achieves up to 4-in (10-cm)
Read Range
– Special Selective Addressing Mode Allows
Reliable Learn-In Sequence
– 80-Bit Authentication Key Length
– Up to 8-kbit/s Uplink Data Rate
– 5/3-Byte Challenge/Response Algorithm
– Fast Authentication Within 42 ms
– Fast Mutual Authentication Within 65 ms
– 150-Byte EEPROM
– 124-Byte Available EEPROM User
Memory
– 32-Bit Unique Serial Number
– High EEPROM Security and Flexibility
– Write-Only Authentication Keys
– Pages Are Irreversibly Lockable and
Protectable
– Protected Pages Programmable Only
Through Mutual Authentication
– Battery Check and Charge Functions
– Each User Page is Lockable
– Resonant Frequency: 134.2 kHz
– Integrated Resonant Frequency Trimming
DESCRIPTION
The TMS37F158 Controller Entry Device (CED80) combines an ultra-low-power 16-bit RISC microcontroller with
the proven TI DST80 immobilizer interface and a sophisticated power management system. It is the ideal device
for any remote control or remote keyless entry application. The embedded DST80 low-frequency (LF)immobilizer
interface offers a high level of security through its hardware encryption and mutual authentication with 80-bit
security key length. The immobilizer interface is always accessible and operates without the need for a battery.
The low-power microcontroller MSP430 core offers a 16-bit RISC architecture, 8KB program memory, battery
charge and check functions, and 12 user-accessible I/O ports.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TMS37F158
SCBS877 – MAY 2012
www.ti.com
The CED80 manages the immobilizer communication and push-button interaction. During sleep state, the device
enters a special low-power mode with only 60 nA of current consumption. By sensing the pressing of a push
button, the device wakes up and controls an external UHF transmitter or UHF transceiver. Security keys and
rolling codes can be stored in the integrated EEPROM memory. This memory is accessible over the LF interface
without support from the battery in the keyfob or by the internal microcontroller if the battery is functional. The
CED80 offers a special battery-charge mode; to achieve faster charging, it is recommend to add a charging
amplifier device on the base station side. The external resonant circuit with an LF coil and a resonant capacitor
can be trimmed to the correct resonant frequency with the integrated trimming capability, which eliminates part
tolerances.
The small DBT 30-pin package together with only a few external components results in cost-efficient design.
Ordering Information (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
ORDERABLE PART NUMBER
TSSOP – DBT
TMS37F158LGIDBTRG4
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DBT PACKAGE
(TOP VIEW)
TDAT
TEN
EOB
NPOR
PUSH
BUSY
P2.3
P2.4
P1.0
P1.1
P1.2
P1.4
P1.5
P1.6
P1.7
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
TCLK
RF
VCL
GND
VBAT
VBATI
P2.2
P2.0
RESET
XIN
XOUT
VSS
P2.5
VCC
TEST
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TMS37F158
TMS37F158
www.ti.com
SCBS877 – MAY 2012
Functional Block Diagram
XIN
XOUT
Oscillator
ACLK
Comp_A
Clock
System
DMA
Controller
3 Channel
Bus
Control
Logic
8MHz
CPU
incl. 16
Registers
POR
SMCLK
P1.x
P2.x
I/O Port
P1
7 I/Os
I/O Port
P2
5 I/Os
I/O Port
P3
4 Internal
I/Os
LF
Controller
Internal
EEPROM
SPI
Interface
External
LF
Interface
Authentication
Coprocessor
MAB
MDB
Analog Frontend
Flash
RAM
8KB
+
256B
256B
Timer_A3
3 CC
Registers
USART0
Watchdog
JTAG
Interface
15,16 Bit
Car side
UART,
SPI Mode
Key fob side
Current
Measurement
Load Drivers
GIO
UHF Transceiver
or
UHF Receiver
CC11x1-Q1
SPI
Interface
GIO
Optional for
battery charge
LF
Base Station
TMS3705-Q1
UHF Transmitter or
UHF Transceiver
CC11x1-Q1
UHF
antenna
Up to 13 ft (4 m)
cable length
Charging
Amplifier
LF Immobilizer
Antenna
Embedded
Processor
SPI
1D LF
Antenna
Controller
Entry Device
Push
Buttons
(Immobilizer and
Microcontroller)
CED80
LED
GIO
System Supply
Power Supply
Figure 1. Application Diagram
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Product Folder Link(s): TMS37F158
3
TMS37F158
SCBS877 – MAY 2012
www.ti.com
CX1
CX2
XTAL
VBATI
XOSC
Antenna
Matching
Network
XOSC
RF_N
RF_P
RBIAS
SCLK
UHF Transmitter
or UHF Transceiver
CC11x1-Q1
RBIAS
JTAG TEST Interface
SI
SO / GDO1
CSn
GND
VBATI
VBATI
RST
TEST
TCK
TMS
TDI
TDO
VCC
47k
P1.2
NRST
P2.0
P2.2
VBAT
TEST
P2.3
XIN
470
XOUT
ROSC
P2.5
P1.0
P1.1
P1.4
P1.5
P1.6
P1.7
MICROCONTROLLER
VCC
P2.4
CBATI
VSS
Note:
R1 to R6, D1 to D6,
RVbati can be integrated
in ROM version
P3.2
P3.3
P3.6
CLKA/M
PUSH
SPI_CLK
NPOR
Important Values
RL = 1 M
Rvbati = 100 k
LR = 2.66 mH
CR = 470 pF
CL = 220 nF
SPI_SOMI
D1 .. D6
P3.1
R1 .. R6
SPI_SIMO
RVbati
BUSY
VBATI
RF1
EOB
CED 80 FRONT END
LR
VBAT
CR
BAT
VCL
CBAT
TEST I/F
CL
GND
TDAT
TCLK
TEN
VCL
RL
Figure 2. Application Schematic
4
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TMS37F158
TMS37F158
www.ti.com
SCBS877 – MAY 2012
Operating Characteristics
PART NUMBER
TMS37F158ADBTIRG4
Features
Immobilizer plus microcontroller with integrated power management
DST80 authentication logic
80-bit key length, 4-byte or 5-byte challenge, 3-byte signature
DST80 encryption time
Mutual authentication: 65 ms
Fast authentication: 42 ms
Microcontroller
16-bit RISC ultra-low power based on MSP430F123 core
Supply voltage (VBAT)
2.0 V to 3.6 V
Active current consumption
200 μA (VCC = 2.2 V, fosc = 1 MHz)
Standby current consumption
60 nA (typ) (with PUSH logic)
Transponder
Transmission principle
HDX (half duplex telegram protocol)
Operating frequency
134.2 kHz
Integrated resonant frequency trimming capability via LF or test interface
Security
Challenge/response, mutual authentication
Downlink
100% AM, PPM bit coding with 2 kbit/s (typ)
Uplink
FSK modulation with 7.9 kbit/s (typ)
EEPROM memory
150 bytes
EEPROM endurance
200 000 cycles (TA = 25°C) (min)
Clock reference for microcontroller
Resonant circuit can be used as clock reference for the microcontroller
Battery check
Two free programmable voltage levels: 2.0 V to 3.6 V with 0.1-V steps
Battery charge
Integrated battery-charge functionality
Key learn-in
Special selective addressing to provide secure learn-in procedure
124-byte free available EEPROM user memory
32-bit unique serial number
Microcontroller
Memory
8KB program memory , 256-byte RAM
User data flash memory
256-byte information memory
Flash program and erase endurance
100 000 cycles (typ)
Flash data retention
100 years (min)
Program, erase, read supply voltage
2.7 V (min)
I/O ports
12
Operating temperature
-40 to 85°C
Package
30-pin TSSOP (DBT)
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Product Folder Link(s): TMS37F158
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PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2012
PACKAGING INFORMATION
Orderable Device
TMS37F158LGIDBTRG4
Status
(1)
ACTIVE
Package Type Package
Drawing
TSSOP
DBT
Pins
Package Qty
Eco Plan
30
TBD
(2)
Lead/
Ball Finish
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
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