VISHAY SUB75N06-08

SUP/SUB75N06-08
Vishay Siliconix
N-Channel 60-V (D-S), 175_C MOSFET
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (W)
ID (A)
60
0.008
75a
D
TO-220AB
TO-263
G
DRAIN connected to TAB
G
D S
Top View
G D S
S
SUB75N06-08
Top View
N-Channel MOSFET
SUP75N06-08
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Unit
VGS
"20
V
Gate-Source Voltage
75a
TC = 25_C
Continuous Drain Current
(TJ = 175_C)
ID
TC = 125_C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche
Energyb
L = 0.1 mH
IDM
240
IAR
60
EAR
PD
TA = 25_C (TO-263)d
Operating Junction and Storage Temperature Range
280
A
mJ
250c
TC = 25_C (TO-220AB and TO-263)
Power Dissipation
55
3.7
W
TJ, Tstg
–55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
PCB Mount
Junction-to-Ambient
Junction-to-Case
(TO-263)d
Free Air (TO-220AB)
40
RthJA
RthJC
62.5
_C/W
C/W
0.6
Notes
a. Package limited.
b. Duty cycle v 1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
Document Number: 70283
S-05111—Rev. F, 10-Dec-01
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SUP/SUB75N06-08
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
60
VGS(th)
VDS = VGS, ID = 250 mA
2.0
3.0
4.0
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 60 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
ID(on)
V
VDS = 60 V, VGS = 0 V, TJ = 125_C
50
VDS = 60 V, VGS = 0 V, TJ = 175_C
150
VDS = 5 V, VGS = 10 V
120
VGS = 10 V, ID = 30 A
Drain-Source On-State Resistancea
Forward Transconductancea
rDS(on)
gfs
mA
m
A
0.007
0.008
VGS = 10 V, ID = 30 A, TJ = 125_C
0.012
VGS = 10 V, ID = 30 A, TJ = 175_C
0.016
VDS = 15 V, ID = 30 A
nA
30
W
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
270
Total Gate Chargec
Qg
85
Gate-Source Chargec
Qgs
28
Gate-Drain Chargec
Qgd
26
Turn-On Delay Timec
td(on)
20
40
tr
95
200
65
120
20
60
Rise Timec
Turn-Off Delay Timec
Fall Timec
td(off)
4800
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDS = 30 V, VGS = 10 V, ID = 75 A
VDD = 30 V, RL = 0.47 W
ID ^ 75 A, VGEN = 10 V, RG = 2.5 W
tf
910
pF
120
nC
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current
IS
75
Pulsed Current
ISM
240
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
A
IF = 75 A , VGS = 0 V
trr
IRM(REC)
Qrr
IF = 75 A, di/dt = 100 A/ms
m
1.0
1.3
V
67
120
ns
6
8
A
0.2
0.48
mC
Notes
a. Pulse test: pulse width v 300 msec, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Document Number: 70283
S-05111—Rev. F, 10-Dec-01
SUP/SUB75N06-08
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
250
200
VGS = 10, 9, 8 V
7V
200
150
I D – Drain Current (A)
I D – Drain Current (A)
6V
150
100
5V
50
100
TC = 125_C
50
25_C
4V
–55_C
0
0
0
2
4
6
8
0
10
1
2
VDS – Drain-to-Source Voltage (V)
Transconductance
5
6
7
On-Resistance vs. Drain Current
0.010
TC = –55_C
100
25_C
80
0.008
r DS(on) – On-Resistance ( Ω )
g fs – Transconductance (S)
4
VGS – Gate-to-Source Voltage (V)
120
125_C
60
40
20
0
VGS = 10 V
0.006
VGS = 20 V
0.004
0.002
0.000
0
20
40
60
80
100
0
20
40
VGS – Gate-to-Source Voltage (V)
60
80
100
120
ID – Drain Current (A)
Capacitance
Gate Charge
20
7000
V GS – Gate-to-Source Voltage (V)
6000
C – Capacitance (pF)
3
Ciss
5000
4000
3000
2000
Coss
Crss
1000
0
VDS = 30 V
ID = 75 A
16
12
8
4
0
0
10
20
30
40
50
VDS – Drain-to-Source Voltage (V)
Document Number: 70283
S-05111—Rev. F, 10-Dec-01
60
0
25
50
75
100
125
150
175
Qg – Total Gate Charge (nC)
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SUP/SUB75N06-08
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.5
100
2.0
I S – Source Current (A)
r DS(on) – On-Resistance ( Ω )
(Normalized)
VGS = 10 V
ID = 30 A
1.5
1.0
TJ = 150_C
TJ = 25_C
10
0.5
0.0
–50
1
–25
0
25
50
75
100
125
150
175
0.3
TJ – Junction Temperature (_C)
0.6
0.9
1.2
1.5
VSD – Source-to-Drain Voltage (V)
THERMAL RATINGS
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
500
100
I D – Drain Current (A)
I D – Drain Current (A)
100
60
40
10 ms
Limited
by rDS(on)
80
100 as
1 ms
10
TC = 25_C
Single Pulse
20
0
10 ms
100 ms
dc
1
0
25
50
75
100
125
150
175
0.1
TC – Case Temperature (_C)
1
10
VDS – Drain-to-Source Voltage (V)
100
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–5
10–4
10–3
10–2
10–1
1
3
Square Wave Pulse Duration (sec)
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2-4
Document Number: 70283
S-05111—Rev. F, 10-Dec-01