EDI PP40

PP
SINGLE - PHASE FULL WAVE BRIDGE
6.0 AMPERES HEAT SINK MOUNTING
3.0 AMPERES FOR P.C BOARD MOUNTING
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SERIES
PRV/leg
50V
100V
200V
400V
600V
800V
1000V
Type No.
PP05
PP10
PP20
PP40
PP60
PP80
PP100
ELECTRICAL CHARACTERISTICS PER LEG
(at TA =25 C Unl es s Oth erw ise Spe ci fie d)
Max.Forward V oltage Drop, VF =1.2 V @ I F =
Max. DC Reverse Current
o
@ PRV and 25 C, IR
Max. Peak Surge Current,IFSM (8.3 ms)
2.0
Amp
10.0
A
100
Amp
Ambient Operating Temperature Range, TA
-55 to +150
o
Storage Temperature Range,TSTG
-55 to +150
o
Thermal Resistance (Total Bridge), R0 j-c
6.0 typ.
C
C
o
C/W
NOTE:
Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250 OC.
EDI reserves the right to change these specifications at any time without notice.
PP
IF(AV) . AVERAGE FORWARD CURRENT (AMP)
Figure 1
PP SERIES CURRENT DERATING
8
A
6
BRIDGE OUTPUT
RES IND LOADS
4
B
2
0
0
20
40
60
80
100
120
140
160
O
TEMPERATURE ( C)
A=CASE TEMPERATURE, HEAT SINK MOUNTED
B=AMBIENT TEMPERATURE
Figure 3
POWER DISSIP ATION
CURRENT
0.1 SEC
1.0 SEC
PT(AV). TOTAL AVERAGE POWER DISSIPATION (WATTS)
Figure 2
NON-REPETITIVE SURGE
% MAXIMUM SURGE
100
75
50
25
0
1
2
3
4
5 6 7 8 9 10
20
30
40 50 60
CYCLES(60 Hz)
15
12
9
6
3
BRIDGE OUTPUT
RES .- IND . LOADS
0
0
2
4
6
8
IF(AV). AVERAGE FORWARD CURRENT (AMP)
PP SERIES MECH. OUTLINE
A
+
D
AC
LTR
B
A
AC
C
_
E
INCHES
MILLIMETERS
10.44-11.20
A
B
.411-.441
.137-.167DIA
3.48-4.24DIA
C
.590-.610
14.99-15.49
D
E
F
.038-.042
.750MIN
.300MAX
.97-1.07
19.05MIN
7.62MAX
F
NOTE: 1. A thin film of silicone thermal compound is recommended between the bridge
case and mounting surface for improved thermal conduction.
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
* YONKERS. NEW YORK 10710 914-965-4400
Ee-mail:[email protected] * Wwebsite: http://www.edidiodes.com
* FAX 914-965-5531
* 1-800-678-0828