SN74BCT760-EP OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS www.ti.com SCBS817B – JULY 2006 – REVISED SEPTEMBER 2006 FEATURES • • • • • • • • • (1) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Open-Collector Version of 'BCT244 Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015 Available In Plastic Small-Outline (DW) Package DW PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION/ORDERING INFORMATION The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. The device is characterized for operation over the full military temperature range of –55°C to 125°C. ORDERING INFORMATION PACKAGE (1) TA –55°C to 125°C (1) SOIC – DW ORDERABLE PART NUMBER Tape and reel SN74BCT760MDWREP TOP-SIDE MARKING BCT760MEP Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X H Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated SN74BCT760-EP OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS www.ti.com SCBS817B – JULY 2006 – REVISED SEPTEMBER 2006 LOGIC SYMBOL(1) 1 EN 1OE 2 18 4 16 6 14 8 12 1Y1 1A1 1Y2 1A2 1Y3 1A3 1Y4 1A4 19 EN 2OE 11 9 13 7 15 5 17 3 2Y1 2A1 2A2 2Y2 2A3 2Y3 2A4 (1) 2Y4 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. LOGIC DIAGRAM (POSITIVE LOGIC) 1 1OE 1A1 2 18 4 16 6 14 8 12 1A2 1Y1 1Y2 1Y3 1A3 1Y4 1A4 19 2OE 11 9 13 7 15 5 17 3 2A1 2A2 2A3 2A4 2 Submit Documentation Feedback 2Y1 2Y2 2Y3 2Y4 SN74BCT760-EP OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS www.ti.com SCBS817B – JULY 2006 – REVISED SEPTEMBER 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V II Input current range –30 5 mA VO Voltage range applied to any output in the disabled or power-off state –0.5 5.5 V VO Voltage range applied to any output in the high state –0.5 VCC V 96 mA Operating free-air temperature range (3) –55 125 °C Storage temperature range –65 150 °C Current into any output in the low state Tstg (1) (2) (3) UNIT Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The negative input voltage rating may be exceeded if the input clamp current rating is observed. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. Recommended Operating Conditions MIN NOM MAX 4.5 5 5.5 UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage 0.8 V VOH High-level output voltage 5.5 V IIK Input clamp current –18 mA IOL Low-level output current 48 mA TA Operating free-air temperature 125 °C MAX UNIT –1.2 V 2 V V –55 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 4.5 V, II = –18 mA VOL VCC = 4.5 V, IOL = 48 mA II VCC = 5.5 V, IIH MIN TYP (1) 0.55 V VI = 7 V 0.1 mA VCC = 5.5 V, VI = 2.7 V 20 µA IIL VCC = 5.5 V, VI = 0.5 V –1 mA IOH VCC = 4.5 V, VOH = 5.5 V 0.1 mA ICC (1) TEST CONDITIONS VCC = 5.5 V, Outputs open 0.38 Outputs high 21 33 Outputs low 48 76 OE disabled 6 10 mA Ci VCC = 5 V, VI = 2.5 V or 0.5 V 6 pF Co VCC = 5 V, VI = 2.5 V or 0.5 V 10 pF All typical values are at VCC = 5 V, TA = 25°C. Submit Documentation Feedback 3 SN74BCT760-EP OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS www.ti.com SCBS817B – JULY 2006 – REVISED SEPTEMBER 2006 Switching Characteristics FROM (INPUT) PARAMETER tPLH tPHL tPLH tPHL (1) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C TO (OUTPUT) Any A Y OE Y VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX (1) MIN TYP MAX MIN MAX 6.3 8 9.5 6.3 11.1 2.1 4.3 6.5 2.1 7.7 8.6 13 15.2 8.6 18.7 3.2 6.2 8.9 3.2 10.4 For conditions shown as MIN or MAX, use the appropriate values specified under recommended operating conditions. SN74BCT760MDWREP Operating Life Derating Chart 1000 Wirebond Voiding Fail Mode Years estimated life 100 Electromigration Fail Mode 10 1 0.1 100 110 120 130 140 150 160 170 180 Continuous Tj (°C) 4 A. See datasheet for absolute maximum ratings and minimum recommended operating conditions. B. Silicon operating life design goal is 10 years at 10°C junction temperature (does not include package interconnect life). C. Enhanced plastic product disclaimer applies. Submit Documentation Feedback UNIT ns ns SN74BCT760-EP OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS www.ti.com SCBS817B – JULY 2006 – REVISED SEPTEMBER 2006 PARAMETER MEASUREMENT INFORMATION VCC RL From Output Under Test Test Point CL (see Note A) LOAD CIRCUIT FOR OPEN-COLLECTOR OUTPUTS 3V 1.5 V Input 1.5 V 0V tPHL tPLH VOH In-Phase Output 1.5 V 1.5 V VOL tPLH tPHL Out-of-Phase Output VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. CL includes probe and jig capacitance. B. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%. C. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuits and Voltage Waveforms Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74BCT760MDWREP ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/06672-01XE ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN74BCT760-EP : SN74BCT760 • Catalog: • Military: SN54BCT760 NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog • Military - QML certified for Military and Defense Applications Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74BCT760MDWREP Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 10.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.0 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74BCT760MDWREP SOIC DW 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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