Embedded Power for Business-Critical Continuity Rev.2.16.09_147 PTHxx010Y of 5 PTHxx010Y 3.3/5/12 Vin Single Output Total Power: # of Outputs: 27W Single Special Features • VTT bus termination output (output the system VREF) • 15 A output current • 3.3, 5 or 12 Vdc input voltage • DDR and QDR compatible • ON/OFF inhibit (for VTT standby) • Under-voltage lockout • Operating temperature range: -40 °C to +85 °C • Efficiencies up to 91% • Output overcurrent protection (non-latching, auto-reset) • Point-of-Load-Alliance (POLA) compatible • Available RoHS compliant • 2 Year Warranty Specifications Input Input voltage range: PTH03010Y PTH05010Y PTH12010Y 2.95 - 3.65 Vdc 4.5 - 5.5 Vdc 10.8 - 13.2 Vdc Input current: No load 10 mA Remote ON/OFF: Positive logic Undervoltage lockout: PTH03010Y Vin increasing Vin decreasing 2.45 V typ., 2.80 V max. 2.20 V min., 2.40 V typ. PTH05010Y Vin increasing Vin decreasing 4.30 V typ., 4.45 V max. 3.40 V min., 3.70 V typ. PTH12010Y Vin increasing Vin decreasing 9.5 V typ., 10.4 V max. 8.80 V min., 9.0 V typ. PTH03010Y & PTH05010Y PTH12010Y 470 µF Input capacitance: (See Note 3) 560 µF All specifications are typical at nominal input, Vref = 1.25 V, full load at 25˚C unless otherwise stated. Cin, Co1 and Co2 = typical value Safety • UL/cUL CAN/CSA-C22.2 No. 60950, File No. E174104 • • TÜV Product Service (EN60950) Certificate No. B 04 06 38572 044 CB Report and Certificate to IEC60950, Certificate No. US/8292/UL Embedded Power for Business-Critical Continuity Rev.2.16.09_147 PTHxx010Y of 5 Output Output current: (over � VREF range) (See Note 1) Tracking range for VREF: PTH03010Y and PTH05010Y PTH12010Y 0.55 - 1.8 Vdc Tracking tolderance to VREF (VTT - VREF) (over line, load & temperature) Ripple and noise: ±15 A ± 12 A -10 mV to + 10 mV 20 MHz bandwidth Load transient response: (See Note 4) 20 mV pk-pk 30 ���������������� µs settling time Overshoot/undershoot 30 mV typ. Output capacitance: Non-ceramic values (See Notes 4 & 5) PTH03010Y PTH05010Y PTH12010Y 470 ����������������������� µF typ., 8,200 µF max. 470 ����������������������� µF typ., 8,200 µF max. 940 ����������������������� µF typ., 6,600 µF max. Ceramic values (See Note 4) PTH03010Y PTH05010Y PTH12010Y 200 ��������������������� µF typ., 300 µF max. 200 ��������������������� µF typ., 300 µF max. 400 ��������������������� µF typ., 600 µF max. (See Note 6) ESR (non-ceramic) 4 mΩ min. PTH03010Y PTH05010Y PTH12010Y 88% typ. 88% typ. 85% typ. General Specifications Efficiency: lo = 10 A Insulation voltage: Switching frequency: Non-isolated PTH03010Y PTH05010Y PTH12010Y 300 - 400 kHz 300 - 400 kHz 200 - 300 kHz Approvals and standards (pending): EN60950 UL/cUL60950 Material flammability: UL94V-0 Dimensions: (L x W x H) Weight: MTBF 34.80 x 15.75 x 9.00 mm 1.370 x 0.620 x 0.354 in 3.7 g (0.13 oz) Telcordia SR-332 6,000,000 hours Operating ambient, temperature Non-operating -40 °C to +85 °C JEDEC J-STD-020C Level 3 PTH03010Y and PTH05010Y PTH12010Y 27.5 A typ. 20.0 A typ. Environmental Specifications Thermal Performance: (See Note 2) MSL (‘Z’ suffix only): -40 °C to +125 °C Protection Overcurrent threshold (auto reset): Embedded Power for Business-Critical Continuity Rev.2.16.09_147 PTHxx010Y of 5 Ordering Information Output Power (max) Input Voltage VTT Output Currents M������������� odel Numbers (8, 9) Max Efficiency (max) Range Min 27 W 2.95 - 3.65 Vdc 0.55 - 1.8 Vdc 0A ±15 A 88% PTH03010Y 27 W 4.5 - 5.5 Vdc 21.6 W 10.8 - 13.2 Vdc 0.55 - 1.8 Vdc 0A ±15 A 88% PTH05010Y 0.55 - 1.8 Vdc 0A ±12 A 85% PTH12010Y Part Number System with Options PTH05010YAST Product Family Point of Load Alliance Compatible Input Voltage 03 = 3.3 V, 05 = 5 V and 12 = 12 V Output Current 01 = 15 A Mechanical Package Always 0 Packaging Options No Suffix = Trays T = Tape and Reel (7) Mounting Option (8) D = Horizontal Through-Hole (Matte Sn) H = Horizontal Through-Hole (Sn/Pb) S = Surface-Mount (63/37 Sn/Pb pin solder material) Z = Surface-Mount (96.5/3.0/0.5 Sn/Ag/Cu pin solder material) Pin Option A = Through-Hole Std. Pin Length (0.140”) A = Surface-Mount Tin/Lead Solder Ball Output Voltage Code Y = DDR Module Notes 1 Rating is conditional on the module being soldered to a 4 layer PCB with 1 oz. copper. See the SOA curves or contact the factory for appropriate derating. 2 This control pin has an internal pull-up to the input voltage Vin. If it is left open-circuit the module will operate when input power is applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult Application Note 177. 3 An input capacitor is required for proper operation. The capacitor must be rated for a minimum of 800 mA rms of ripple current. 4 The typical value of external output capacitance value ensures that VTT meets the specified transient performance requirements for the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is consistently less than 3 A. Test conditions were 15 A/µs load step, -1.5 A to +1.5 A. 5 This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult Application Note 177 for further details. 6 This is the typical ESR for all the electrolytic (non-ceramic) output capacitance. Use 7 mΩ as the minimum when using max-ESR values to calculate. 7 Tape and reel packaging only available on the surface-mount versions. 8 To order Pb-free (RoHS compatible) surface-mount parts replace the mounting option ‘S’ with ‘Z’, e.g. PTHXX010YAZ. To order Pbfree (RoHS compatible) through-hole parts replace the mounting option ‘H’ with ‘D’, e.g. PTHXX010YAD. 9 NOTICE: Some models do not support all options. Please contact your local Emerson Network Power representative or use the on-line model number search tool at http://www.PowerConversion.com to find a suitable alternative. Embedded Power for Business-Critical Continuity Rev.2.16.09_147 PTHxx010Y of 5 PTHxx010Y Characteristic Data 14 14 12 10 Nat conv 100 LFM 200 LFM 8 6 4 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 16 12 10 Nat conv 100 LFM 200 LFM 8 6 4 2 2 0 0 0 10 20 30 40 50 60 70 80 0 10 20 AMBIENT TEMPERATURE (ºC) 30 40 50 60 70 80 AMBIENT TEMPERATURE (ºC) Figure 1 - Safe Operating Area Vin = 3.3 V, VREF = 1.25 V, Iout = 15 A (See Note A) Figure 2 - Safe Operating Area Vin = 12 V, VREF = 1.25 V, Iout = 12 A (See Note A) Vin VDDQ VREF 1k 1% 90 Vin 80 2 3 Cin (Required) 70 60 Standby GND 8 PTHxx010Y (Top View) 1k 1% 3.3V 5.0V 12.0V 10 9 1 Q1 BSS138 (Optional) 4 VTT 7 Con hf-Ceramic 6 5 + Co1 + Co2 Low-ESR (Required) Ceramic (Optional) 50 0 3 6 9 12 15 OUTPUT CURRENT (A) Figure 3 - Efficiency vs Load Current VREF = 1.25 V (See Note B) Notes A SOA curves represent the conditions at which internal components are within the Emerson Network Power derating guidelines. B Characteristic data has been developed from actual products tested at 25 °C. This data is considered typical data for the converter. Figure 4 - Standard Application VTT Termination Island EFFICIENCY (%) 100 SSTL-2 Data/ Address/ Bus Embedded Power for Business-Critical Continuity Mechanical Drawings Americas 1.370 (34.80) 0.140 (3.55) 0.125 (3.18) 0.125 (3.18) 0.375 (9.52) 0.060 (1.52) 1 8 9 10 0.060 (1.52) 0.625 (15.88) ø0.040 (1.02) 5 Places 7 0.070 (1.78) (Standoff Shoulder) Lowest Component 0.010 min. (0.25) Bottom side Clearance 6 5 4 3 5810 Van Allen Way Carlsbad, CA 92008 USA Telephone:+1 760 930 4600 Facsimile: +1 760 930 0698 Europe (UK) 0.620 0.500 (15.75) (12.70) 2 Rev.2.16.09_147 PTHxx010Y of 5 Waterfront Business Park Merry Hill, Dudley West Midlands, DY5 1LX United Kingdom Telephone:+44 (0) 1384 842 211 Facsimile: +44 (0) 1384 843 355 Asia (HK) TOP VIEW Host Board 0.354 (9.00) MAX. Dimensions in Inches (mm) Tolerances (unless otherwise specified) 2 Places ± 0.030 (± 0.76) 3 Places ± 0.010 (± 0.25) SIDE VIEW 14/F, Lu Plaza 2 Wing Yip Street Kwun Tong, Kowloon Hong Kong Telephone:+852 2176 3333 Facsimile: +852 2176 3888 For global contact, visit: Figure 5 - Plated Through-Hole www.PowerConversion.com techsupport.embeddedpower @emerson.com 1.370 (34.80) 0.125 (3.18) 0.125 (3.18) 0.375 (9.52) 0.060 (1.52) 1 0.060 (1.52) 0.625 (15.88) 9 10 0.354 (9.00) max.* 7 8 *After solder reflow on customer board Solder Ball ø0.040 (1.02) 10 Places 0.500 0.620 (12.70) (15.75) 3 4 6 5 Connectivity DC Power Embedded Computing SIDE VIEW TOP VIEW Host Board Embedded Power Monitoring Dimensions in Inches (mm) Tolerances (unless otherwise specified) 2 Places ± 0.030 (± 0.76) 3 Places ± 0.010 (± 0.25) Outside Plant Power Switching & Controls Figure 6 - Surface-Mount Pin Connections Emerson Network Power. The global leader in enabling business-critical continuity. AC Power Lowest Component 0.010 min. (0.25) Bottom side Clearance 2 While every precaution has been taken to ensure accuracy and completeness in this literature, Emerson Network Power assumes no responsibility, and disclaims all liability for damages resulting from use of this information or for any errors or omissions. Pin Connections cont. Pin No. Function Pin No. Function Pin 1 Ground Pin 6 VTT Pin 2 Vin Pin 7 Ground Pin 3 Inhibit* Pin 8 VREF Pin 4 N/C Pin 9 N/C Pin 5 Vo sense Pin 10 N/C *Denotes negative logic: Open = Normal operation Ground = Function active Precision Cooling Racks & Integrated Cabinets Services Surge Protection EmersonNetworkPower.com Emerson Network Power and the Emerson Network Power logo are trademarks and service marks of Emerson Electric Co. ©2008 Emerson Electric Co.