TI LM2623MM

LM2623
www.ti.com
SNVS188G – MAY 2004 – REVISED DECEMBER 2005
LM2623 General Purpose, Gated Oscillator Based, DC/DC Boost Converter
Check for Samples: LM2623
FEATURES
DESCRIPTION
•
•
•
The LM2623 is a high efficiency, general purpose,
step-up DC-DC switching regulator for batterypowered and low input voltage systems. It accepts an
input voltage between .8 and 14 volts and converts it
into a regulated output voltage between 1.24 and 14
volts. Efficiencies up to 90% are achievable with the
LM2623.
1
2
•
•
•
•
•
•
•
•
•
•
•
Good Efficiency Over a Very Wide Load Range
Very Low Output Voltage Ripple
Small, VSSOP-8 Package (Half the Footprint of
Standard 8 pin SOIC Package)
1.09 mm Package Height
Up to 2 MHz Switching Frequency
.8V to 14V Operating Voltage
1.1V Start-up Voltage
1.24V - 14V Adjustable Output Voltage
Up to 2A Load Current at Low Output Voltages
0.17Ω Internal MOSFET
Up to 90% Regulator Efficiency
80 µA Typical Operating Current (into VDD Pin
of Supply)
<2.5µA Specified Supply Current In Shutdown
4mm x 4mm Thermally Enhanced WSON
Package Option
In order to adapt to a number of applications, the
LM2623 allows the designer to vary the output
voltage, the operating frequency (300kHz to 2 MHz)
and duty cycle (17% to 90%) to optimize the part's
performance. The selected values can be fixed or can
vary with battery voltage or input to output voltage
ratio. The LM2623 uses a very simple, on/off
regulation mode to produce good efficiency and
stable operation over a wide operating range. It
normally regulates by skipping switching cycles when
it reaches the regulation limit (Pulse Frequency
Modulation).
Note: Please read the Non-Linear Effect and
Choosing The Correct C3 Capacitor sub-sections of
the Design Procedure section of this data sheet, so
that any challenges with designing with this part can
be taken into account before a board design/layout is
finalized.
APPLICATIONS
•
•
•
•
•
•
•
Cameras, Pagers and Cell Phones
PDAs, Palmtop Computers, GPS Devices
White LED Drive, TFT or Scanned LCDs
Flash Memory Programming
Hand-Held Instruments
1, 2, 3 or 4 Cell Alkaline Systems
1, 2 or 3 Cell Lithium-ion Systems
For Alternative Solutions, See Also:
LM2622, LM2731, LM2733, and LM2621.
LM2700,
Typical Application Circuit
D1
L1
4.7PH
R3
150k
3A
C3
V IN
2 Cells
4.7pF
+ C1
22PF
8
SW
3
BOOT
FREQ
EN
LM2623
1
V DD
PGND
FB
7
5V
2
6
C2
100PF
tan
t
RF1
300k
4
SGND
5
RF2
100k
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
LM2623
SNVS188G – MAY 2004 – REVISED DECEMBER 2005
www.ti.com
Connection Diagram
Figure 1. WSON Package
Top View
Figure 2. VSSOP-8 (DGK) Package
Top View
Pin Description
WSON-14 Pin
VSSOP-8 Pin
1
Name
NC
2, 3
1
PGND
4
2
EN
5
3
FREQ
6
4
Function
No Connect
Power Ground (WSON Pins 2 & 3 must be shorted together).
Active-Low Shutdown Input
Frequency Adjust. An external resistor connected between this pin
and a voltage source sets the switching frequency of the LM2623.
FB
Output Voltage Feedback
7
NC
No Connect
8
NC
No connect
9
5
SGND
Signal Ground
10
6
VDD
11
7
BOOT
12, 13
8
SW
Drain of the Internal MOSFET Power Switch. (WSON Pins 12 & 13
must be shorted together).
14
NC
No Connect
DAP
DAP
To be soldered to board for enhanced thermal dissipation. To be
electrically isolated/floating.
Power Supply for Internal Circuitry
Bootstrap Supply for the Gate Drive of Internal MOSFET Power
Switch
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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SNVS188G – MAY 2004 – REVISED DECEMBER 2005
ABSOLUTE MAXIMUM RATINGS
(1) (2)
−0.5 V to 14.5V
SW Pin Voltage
−0.5V to 10V
BOOT, VDD, EN and FB Pins
FREQ Pin
100µA
TJmax (3)
150°C
−65°C to +150°C
Storage Temperature Range
Lead Temp. (Soldering, 5 sec)
Power Dissipation (TA=25°C)
ESD Rating
(1)
(2)
(3)
(4)
260°C
(3)
500mW
(4)
2kV
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated operating conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is Pdmax = (Tjmax - TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. For Pin 8 (SW) the ESD rating is 1.0
kV.
OPERATING CONDITIONS
(1)
VDD Pin
3V to 5V
FB, EN Pins
0 to VDD
BOOT Pin
0 to 10V
−40°C to +85°C
Ambient Temperature (TA)
(1)
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated operating conditions.
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LM2623
SNVS188G – MAY 2004 – REVISED DECEMBER 2005
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ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range of
−40°C to +85°C. Unless otherwise specified: VDD= VOUT= 3.3V.
Symbol
Parameter
Condition
VDD_ST
Start-Up Supply Voltage 25°C
ILOAD = 0mA
VIN_OP
Minimum Operating Supply
Voltage (once started)
ILOAD = 0mA
VFB
FB Pin Voltage
VOUT_MAX
Maximum Output Voltage
η
Efficiency
Typ
Min
(1)
0.65
1.24
1.2028
Max
Units
1.1
V
.8
V
1.2772
V
14
VIN = 3.6V; VOUT = 5V; ILOAD =
500mA
87
VIN = 2.5V; VOUT = 3.3V; ILOAD =
200mA
87
V
%
D
Switch Duty Cycle
IDD
Operating Quiescent Current
(2)
FB Pin > 1.3V; EN Pin at VDD
17
%
ISD
Shutdown Quiescent Current
(3)
ICL
IC
RDS_ON
MOSFET Switch On Resistance
θJA
Thermal Resistance
DGK Package, Junction to
Ambient (4)
240
°C/W
θJA
Thermal Resistance
WSON Package, Junction to
Ambient (4) (5)
40
°C/W
θJA
Thermal Resistance
WSON Package, Junction to
Ambient (4) (6)
56
°C/W
80
110
µA
VDD, BOOT and SW Pins at 5.0V;
EN Pin <200mV
0.01
2.5
µA
Switch Peak Current Limit
LM2623A
2. 85
Switch Peak Current Limit
LM2623
2.2
A
1.2
A
0.17
0.26
Ω
Enable Section
VEN_LO
EN Pin Voltage Low
(7)
VEN_HI
EN Pin Voltage High
(7)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
4
0.15VDD
0.7VDD
V
V
VDD tied to Boot and EN pins. Frequency pin tied to VDD through 121K resistor. VDD_ST = VDD when startu-up occurs. VIN is VDD + D1
voltage (usually 10-50 mv at start-up)
This is the current into the VDD pin.
This is the total current into pins VDD, BOOT, SW and FREQ.
The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is Pdmax = (Tjmax - TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Junction to ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forthe in the JEDEC standard JESD51-17. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 3 x 2
array of thermal vias. The ground plane on the board is 50mm x 50 mm. Thickness of copper layers are 36mm/18mm/18mm/36mm
(1.5oz/10z/1oz/1.5ox). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. (The DAP is soldered.) Fore more
information on WSON thermal topics, as well as WSON mounting and soldering specifications please refer to (SNOA401) Application
Note 1187 : Leadless Leadframe Package (LLP).
Exposed DAP soldered to an exposed 1sq. inch area of 1 oz. copper. Thermal resistance can be decreased by using more copper are
to dissipate heat.
When the EN pin is below VEN_LO, the regulator is shut down; when it is above VEN_HI, the regulator is operating.
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SNVS188G – MAY 2004 – REVISED DECEMBER 2005
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency
vs
VIN
VOUT = 5.0V
95.0
1.2365
10mA
1.236
1.2355
85.0
V FB (V)
Efficiency (%)
90.0
80.0
75.0
600mA
1.2345
1.2335
300mA
65.0
V DD = 3.3V
1.235
1.234
70.0
60.0
1.8
VFB
vs
Temperature
1.233
2.1 2.4 2.7 3.0 3.3
1.2325
-40
3.6 3.9 4.2 4.5
-25
-10
5
Vin
Figure 3.
300k
1.5
Start-Up Voltage
Frequency (Mhz)
50
65
80
Maximum Start Up Voltage vs
Temperature
1.30
0
225k
75k
35
Figure 4.
Frequency
vs
VIN
2
20
TEMPERATURE (ºC)
150
1
0.5
1.20
0
1.100
1.00
0
0.90
0
0
1.2
1.7
2.2
2.7
3.2
3.7
0.800
-50
4.2
0
50
100
Temperatur
e
Vin (V)
Figure 5.
Figure 6.
Typical RDS(ON) vs
Temperature
Typical Current Limit vs
Temperature
0.300
3.000
2.900
0.250
2.800
Current Limit
Rds on
0.200
0.150
2A
0.100
1A
2.700
2.600
2.500
2.400
2.300
2.200
0.050
2.100
0.000
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
2.000
Temperature (ºC)
Figure 7.
- - - 0 10 20 30 40 50 60 70 80
40 30 20 10
Temperature (ºC)
Figure 8.
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LM2623
SNVS188G – MAY 2004 – REVISED DECEMBER 2005
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DETAILED DESCRIPTION
OPERATING PRINCIPLE
The LM2623 is designed to provide step-up DC-DC voltage regulation in battery-powered and low-input voltage
systems. It combines a step-up switching regulator, N-channel power MOSFET, built-in current limit, thermal
limit, and voltage reference in a single 8-pin VSSOP package Figure 9. The switching DC-DC regulator boosts an
input voltage between .8V and 14V to a regulated output voltage between 1.24V and 14V. The LM2623 starts
from a low 1.1V input and remains operational down to below .8V.
This device is optimized for use in cellular phones and other applications requiring a small size, low profile, as
well as low quiescent current for maximum battery life during stand-by and shutdown. A high-efficiency gatedoscillator topology offers an output of up to 2A at low output voltages.
Additional features include a built-in peak switch current limit, and thermal protection circuitry.
Figure 9. Functional Diagram
GATED OSCILLATOR CONTROL SCHEME
The on/off regulation mode of the LM2623, along with its ultra-low quiescent current, results in good efficiency
over a very wide load range. The internal oscillator frequency can be programmed using an external resistor to
be constant or vary with the battery voltage. Adding a capacitor to program the frequency allows the designer to
adjust the duty cycle and optimize it for the application. Adding a resistor in addition to the capacitor allows the
duty cycle to dynamically compensate for changes to the input/output voltage ratio. We call this a Ratio Adaptive
Gated Oscillator circuit. See the Application Notes for sample application circuits. Using the correct RC
components to adjust the oscillator allows the part to run with low ripple and high efficiency over a wide range of
loads and input/output voltages.
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SNVS188G – MAY 2004 – REVISED DECEMBER 2005
Figure 10. Typical Step-Up Regulator Waveforms
PULSE FREQUENCY MODULATION (PFM)
Pulse Frequency Modulation is typically accomplished by switching continuously until the voltage limit is reached
and skipping cycles after that to just maintain it. This results in a somewhat hysteretic mode of operation. The
coil stores more energy each cycle as the current ramps up to high levels. When the voltage limit is reached, the
system usually overshoots to a higher voltage than required, due to the stored energy in the coil (see Figure 10).
The system will also undershoot somewhat when it starts switching again because it has depleted all the stored
energy in the coil and needs to store more energy to reach equilibrium with the load. Larger output capacitors
and smaller inductors reduce the ripple in these situations. The frequency being filtered, however, is not the basic
switching frequency. It is a lower frequency determined by the load, the input/output voltage and the circuit
parameters. This mode of operation is useful in situations where the load variation is significant. Power managed
computer systems, for instance, may vary from zero to full load while the system is on and this is usually the
preferred regulation mode for such systems.
CYCLE TO CYCLE PFM
When the load doesn't vary over a wide range (like zero to full load), ratio adaptive circuit techniques can be
used to achieve cycle to cycle PFM regulation and lower ripple (or smaller output capacitors). The key to success
here is matching the duty cycle of the circuit closely to what is required by the input to output voltage ratio. This
ratio then needs to be dynamically adjusted for input voltage changes (usually caused by batteries running
down). The chosen ratio should allow most of the energy in each switching cycle to be delivered to the load and
only a small amount to be stored. When the regulation limit is reached, the overshoot will be small and the
system will settle at an equilibrium point where it adjusts the off time in each switching cycle to meet the current
requirements of the load. The off time adjustment is done by exceeding the regulation limit during each switching
cycle and waiting until the voltage drops below the limit again to start the next switching cycle. The current in the
coil never goes to zero like it frequently does in the hysteretic operating mode of circuits with wide load variations
or duty cycles that aren't matched to the input/output voltage ratio. Optimizing the duty cycle for a given set of
input/output voltages conditions can be done by using the circuit values in the Application Notes.
LOW VOLTAGE START-UP
The LM2623 can start-up from voltages as low as 1.1 volts. On start-up, the control circuitry switches the Nchannel MOSFET continuously until the output reaches 3 volts. After this output voltage is reached, the normal
step-up regulator feedback and gated oscillator control scheme take over. Once the device is in regulation, it can
operate down to below .8V input, since the internal power for the IC can be boot-strapped from the output using
the Vdd pin.
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LM2623
SNVS188G – MAY 2004 – REVISED DECEMBER 2005
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SHUT DOWN
The LM2623 features a shutdown mode that reduces the quiescent current to less than a specified 2.5uA over
temperature. This extends the life of the battery in battery powered applications. During shutdown, all feedback
and control circuitry is turned off. The regulator's output voltage drops to one diode drop below the input voltage.
Entry into the shutdown mode is controlled by the active-low logic input pin EN (pinh- 2). When the logic input to
this pin is pulled below .15Vdd, the device goes into shutdown mode. The logic input to this pin should be above
.7Vdd for the device to work in normal stepup mode.
INTERNAL CURRENT LIMIT AND THERMAL PROTECTION
An internal cycle-by-cycle current limit serves as a protection feature. This is set high enough (2.85A typical,
approximately 4A maximum) so as not to come into effect during normal operating conditions. An internal thermal
protection circuit disables the MOSFET power switch when the junction temperature (TJ) exceeds about 160°C.
The switch is re-enabled when TJ drops below approximately 135°C.
DESIGN PROCEDURE
NON-LINEAR EFFECT
The LM2623 is very similar to the LM2621. The LM2623 is based on the LM2621, except for the fact that the
LM2623 takes advantage of a non-linear effect that allows for the duty cycle to be programmable. The C3
capacitor is used to dump charge on the FREQ pin in order to manipulate the duty cycle of the internal oscillator.
The part is being tricked to behave in a certain manner, in the effort to make this Pulse Frequency Modulated
(PFM) boost switching regulator behave as a Pulse Width Modulated (PWM) boost switching regulator.
CHOOSING THE CORRECT C3 CAPACITOR
The C3 capacitor allows for the duty cycle of the internal oscillator to be programmable. Choosing the correct C3
capacitor to get the appropriate duty cycle for a particular application circuit is a trial and error process. The nonlinear effect that C3 produces is dependent on the input voltage and output voltage values. The correct C3
capacitor for particular input and output voltage values cannot be calculated. Choosing the correct C3
capacitance is best done by trial and error, in conjunction with the checking of the inductor peak current to make
sure your not too close to the current limit of the device. As the C3 capacitor value increases, so does the duty
cycle. And conversely as the C3 capacitor value decreases, the duty cycle decreases. An incorrect choice of the
C3 capacitor can result in the part prematurely tripping the current limit and/or double pulsing, which could lead
to the output voltage not being stable.
SETTING THE OUTPUT VOLTAGE
The output voltage of the step-up regulator can be set by connecting a feedback resistive divider made of RF1
and RF2. The resistor values are selected as follows:
RF1 = RF2 * [(VOUT/ 1.24) −1]
A value of 50k to 100k is suggested for RF2. Then, RF1 can be selected using the above equation.
VDD SUPPLY
The Vdd supply must be between 3 to 5 volts for the LM2623. This voltage can be bootstrapped from a much
lower input voltage by simply connecting the VDD pin to VOUT. In the event that the VDD supply voltage is not a
low ripple voltage source (less than 200 millivolts), it may be advisable to use an RC filter to clean it up.
Excessive ripple on VDD may reduce the efficiency.
SETTING THE SWITCHING FREQUENCY
The switching frequency of the oscillator is selected by choosing an external resistor (R3) connected between VIN
and the FREQ pin. See the graph titled "Frequency vs VIN” in the Typical Performance Characteristics section of
the data sheet for choosing the R3 value to achieve the desired switching frequency. A high switching frequency
allows the use of very small surface mount inductors and capacitors and results in a very small solution size. A
switching frequency between 300kHz and 2MHz is recommended.
8
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SNVS188G – MAY 2004 – REVISED DECEMBER 2005
OUTPUT DIODE SELECTION
A Schottky diode should be used for the output diode. The forward current rating of the diode should be higher
than the peak input current, and the reverse voltage rating must be higher than the output voltage. Do not use
ordinary rectifier diodes, since slow switching speeds and long recovery times cause the efficiency and the load
regulation to suffer. Table 1 shows a list of the diode manufacturers.
WSON PACKAGE DEVICES
The LM2623 is offered in the 14 lead WSON surface mount package to allow for increased power dissipation
compared to the VSSOP-8. For details of the thermal performance as well as mounting and soldering
specifications, refer to (SNOA401) Application Note AN-1187.
Table 1. Suggested Manufacturers List
Inductors
Capacitors
Diodes
Coilcraft
Tel: (800) 322-2645
Fax: (708) 639-1469
Sprague/ Vishay
Tel: (207) 324-4140
Fax: (207) 324-7223
Motorola
Tel: (800) 521-6274
Fax: (602) 244-6609
Coiltronics
Tel: (407) 241-7876
Fax: (407) 241-9339
Kemet
Tel: (864) 963-6300
Fax: (864) 963-6521
International Rectifier (IR)
Tel: (310) 322-3331
Fax: (310) 322-3332
Pulse Engineering
Tel: (619) 674-8100
Fax: (619) 674-8262
Nichicon
Tel: (847) 843-7500
Fax: (847) 843-2798
General Semiconductor
Tel: (516) 847-3222
Fax: (516) 847-3150
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PACKAGE OPTION ADDENDUM
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1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM2623ALD/NOPB
Package Type Package Pins Package
Drawing
Qty
ACTIVE
WSON
NHE
14
1000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
2623A
(4/5)
LM2623AMM
NRND
VSSOP
DGK
8
1000
TBD
Call TI
Call TI
-40 to 85
S46A
LM2623AMM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
S46A
LM2623AMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
S46A
LM2623LD/NOPB
ACTIVE
WSON
NHE
14
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
2623AB
LM2623LDX/NOPB
ACTIVE
WSON
NHE
14
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
2623AB
LM2623MM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
S46B
LM2623MMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
S46B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
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1-Nov-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2623ALD/NOPB
WSON
NHE
14
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM2623AMM
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2623AMM/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2623AMMX/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2623LD/NOPB
WSON
NHE
14
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM2623LDX/NOPB
WSON
NHE
14
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM2623MM/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2623MMX/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2623ALD/NOPB
WSON
NHE
14
1000
213.0
191.0
55.0
LM2623AMM
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2623AMM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2623AMMX/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
LM2623LD/NOPB
WSON
NHE
14
1000
213.0
191.0
55.0
LM2623LDX/NOPB
WSON
NHE
14
4500
367.0
367.0
35.0
LM2623MM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LM2623MMX/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NHE0014A
LDA14A (REV A)
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