TI TL1591

TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
•
•
•
•
•
P OR PS PACKAGE
(TOP VIEW)
15-MHz Sampling Rate
30-ns Acquisition Time
Diode-Bridge Switch
25-MHz Bandwidth
Low-Voltage Supply
ANLG VCC
ANLG IN
ANLG GND
ANLG OUT
description
1
8
2
7
3
6
4
5
DGTL VCC
DGTL IN
DGTL GND
SUB GND
The TL1591 is a monolithic integrated sample-and-hold circuit that uses the BiFET process with
Schottky-barrier diodes and is designed for use with CCD area imagers. This device consists of an ultra-fast
input-buffer amplifier, a digital-controlled diode-bridge switch, and a high-impedance output buffer amplifier. The
electronic switch is controlled by an LS-TTL-compatible logic input.
functional block diagram
4
ANLG IN
2
A1
A2
ANLG OUT
A3
7
DGTL IN
C1
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these
high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in
conductive foam. In a circuit, unused inputs should always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices and Assemblies available from Texas Instruments.
Copyright  1994, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to VCC
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 25°C to 80°C
Storage temperature range, TSTG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 80°C
POWER RATING
P
1000 mW
8.0 mW/°C
560 mW
PS
725 mW
5.8 mW/°C
406 mW
recommended operating conditions
Supply voltage, VCC
High-level input voltage, VIH
MIN
NOM
MAX
4.75
5
5.5
2
UNIT
V
V
Low-level input voltage, VIL
0.8
V
Peak-to-peak input voltage, VI(PP)
0.8
V
80
°C
Operating free-air temperature, TA
– 25
electrical characteristics over ranges of supply voltage and operating free-air temperature (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP‡
MAX
UNIT
– 1.5
V
20
µA
– 0.4
mA
VIK
VO(PP)
Input clamp voltage
IIH
IIL
High-level input current
IO
ICC
Output current
ri
Input resistance
10
kΩ
ro
Output resistance
50
Ω
Peak-to-peak output voltage
1.1
VCC = 5.5 V,
VCC = 5.5 V,
Low-level input current
VIH = 2.7 V
VIL = 0.4 V
– 0.28
V
0.6
Supply current
VCC = 5.5 V
15
mA
20
mA
operating characteristics
PARAMETER
MIN
Linearity
Av
Voltage amplification
Sample-to-hold offset error
MAX
0.7%
2%
0.8
0.9
15
Sample-mode offset error
– 150
V/V
mV
mV
Hold-mode feedthrough
– 50
dB
Hold-mode droop
100
µV/µs
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
– 50
UNIT
50
‡ All typical values are at VCC = 5 V, TA = 25°C.
2
TYP‡
TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
dynamic characteristics (see Figure 1)
PARAMETER
MIN
TYP†
MAX
UNIT
Acquisition time, 0.6 V to 2%
18
ns
Acquisition time, 0.6 V to 1%
31
ns
Hold-mode settling time
35
ns
Sampling-mode bandwidth
25
Sampling rate
† All typical values are at VCC = 5 V and TA = 25°C.
MHz
15
MHz
PARAMETER MEASUREMENT INFORMATION
Sample-to-Hold
Transient
Sample-and-Hold
Output
(see Note A)
Analog
Input
Signal
(see Note B)
Sample
Command
Hold More
Voltage Droop
Aperture
Uncertainty
(error band)
Hold
Command
Sampling
Switch
Closes
Sample Switch
Opens
Sample-to-Hold
Offset Error
Aperture
Uncertainty
Time
Sample-Control Pulse
Figure 1. Sample-Hold Definitions
NOTES: A. Hold-mode settling time is the time from the hold command transistion until the output has settled within a specified error band around
the final value.
B. Acquisition time is the time required, after the closing of the sampling switch, for the hold capacitor to charge to a full-scale voltage
change and then remain within a specified error band around the final value.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
PARAMETER MEASUREMENT INFORMATION
VCC
33 µF
TL1591
1
ANLG VCC
33 µF
Analog
Input
50 Ω
DGTL VCC
2
8
7
50 Ω
50 Ω
3
Analog
Output
50 Ω
975 Ω
330 µF
6
ANLG GND
DGTL GND
ANLG OUT
SUB GND
4
5
53 Ω
Figure 2. Test Circuit
4
50 Ω
DGTL IN
ANLG IN
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Command Input
(sampling pulse)
TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
TYPICAL CHARACTERISTICS
5
4
Sample/Hold Accuracy – %
3
2
1
20
30
40
50
0
–1
–2
–3
–4
– 5
Command Duration – ns
Figure 3. Sample/Hold Accuracy Versus Command Duration
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
MECHANICAL DATA
P(R-PDIP-T8)
PLASTIC DUAL-IN-LINE PACKAGE
0.400 (10,20)
MAX
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0°– 15°
0.100 (2,54) TYP
0.014 (0,36)
0.008 (0,20)
0.021 (0,53)
0.015 (0,38)
4040082/A–10/93
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TL1591
SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS
SOCS026B – SEPTEMBER 1989 – REVISED JUNE 1994
MECHANICAL DATA
PS/R-PDSO-G8
PLASTIC SMALL-OUTLINE PACKAGE
6,50
5,90
8
5
1
4
8,20
7,40
5,60
5,00
2,00 MAX
Seating Plane
0,10
0°– 10°
0,05 MIN
0,40
1,27
0,20
0,10
0,95
0,55
0,25 M
4040063/A–10/93
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
8-Apr-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
TL1591CP
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
TL1591CPSLE
OBSOLETE
SO
PS
8
TBD
Call TI
Call TI
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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