TPD5E003 www.ti.com SLVSBQ6A – DECEMBER 2012 – REVISED JANUARY 2013 Five Channel Space Saving ESD Protection Device Check for Samples: TPD5E003 FEATURES APPLICATIONS • • • • • 1 • • • • • • • • Provides System Level ESD Protection for Low-Voltage IO Interface IEC 61000-4-2 Level 4 – ±15kV (Contact discharge) – ±15kV (Air-gap discharge) Typical IO Capacitance 7pF (VIO = 2.5V) DC Breakdown Voltage 6V (Min) Low Leakage Current 100nA (Max) Low ESD Clamping Voltage Industrial Temperature Range: –40°C to 125°C IEC 61000-4-5 (Surge): 40 W (8/20 µs Pulse) Small, Easy-to-Route DPF Package SIM Card Side Keys Audio Interface Memory Card DPF 1 6 2 5 3 4 1 mm x 1 mm x 0.4mm (0.35-mm pitch) DESCRIPTION The TPD5E003 is a five channel ESD protection device. It offers ±15KV IEC contact and ±15KV air-gap ESD protection. It features five identical ESD clamping diodes that could be used for either five unidirectional (0V to 5V) I/O lines or four bidirectional (-5V to 5V) I/O lines. The lower IO capacitance is suitable for a wide range of applications. Typical application areas include audio lines (mic, earphone, and speakerphone), SD interface, and keypad, or other buttons. ORDERING INFORMATION TA –40°C to 125°C (1) (2) PACKAGE 5000 (1) (2) Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TPD5E003DPFR 9Q Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated TPD5E003 SLVSBQ6A – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. APPLICATION/FUNCTIONAL BLOCK DIAGRAM PIN FUNCTIONS PIN NAME DPF PIN TYPE I/O 1, 3, 4, 5, 6 I/O GND 2 GND DESCRIPTION ESD Protected channel Ground ABSOLUTE MAXIMUM RATINGS MIN MAX 5.5 V Operating temperature range -40 125 °C Storage temperature -55 150 °C IEC 61000-4-2 contact ESD ±15 kV IEC 61000-4-2 air-gap ESD ±15 kV IO voltage tolerance UNIT IPP, peak pulse current (tp = 8/20μs) 3 A PPP, peak pulse power (tp = 8/20μs) 40 W ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITION MIN TYP MAX UNIT VRWM Reverse stand-off voltage II = 0.1 µA 5.0 V ILEAK Leakage Current Pin 1, 3, 4, 5, or 6 = 5V, Pin 2 = 0V 10 100 nA VClamp Clamp voltage with ESD strike IPP = 6A, TLP, Dx pin to GND, TA = 25 °C 13 15.6 V RDYN Dynamic resistance CIO IO capacitance VBR Break-down voltage 2 IPP = 10 A, TLP, Dx pin to GND, TA = 25 °C 16.3 19.5 V ITLP = 6A to 10 A, Dx pin to GND, TA = 25 °C 0.8 1 Ω ITLP = 6A to 10 A, GND to Dx pin, TA = 25 °C 0.3 0.4 Ω 5.6 7 8.4 pF 8 10 12 pF 6.0 7 8.5 V VIO = 2.5V, 1 MHz, TA = 25 °C VIO = 0V, 1 MHz, TA = 25 °C IIO = 1 mA Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD5E003 TPD5E003 www.ti.com SLVSBQ6A – DECEMBER 2012 – REVISED JANUARY 2013 APPLICATION INFORMATION D1 D3 1 D1 6 D4 2 D2 3 1 6 No Connect 5 5 D2 5-Channel Configuration N 2 D5 4 D3 3 D4 4 4-Channel Configuration Figure 1. Application Diagram The TPD5E003 offers 5 identical unidirectional ESD protection channels. To use all 5 channels, the recommended configuration is shown in Figure 1. The TPD5E003 can also be used as 4 identical bidirectional ESD protection channels. To do so, pin 5 would be connected to ground, with pin 1, 3, 4, and 6 connected to the I/O to be protected. In the bidirectional configuration, IO capacitance is reduced by half and the breakdown voltage is doubled. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD5E003 3 TPD5E003 SLVSBQ6A – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com TYPICAL CHARACTERISTICS 4.0 Current (A) Capacitance (pF) 16 12 8 4 45 Current Power 40 3.5 35 3.0 30 2.5 25 2.0 20 1.5 15 1.0 10 0.5 5 0 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 ±5 5.0 VBIAS (V) Power (W) 4.5 20 0 5 10 15 20 25 30 35 40 45 50 Time ( s) C002 C001 Figure 2. Capacitance vs DC Bias Voltage 24 450 Current Power 21 Figure 3. Surge Plot (tp = 8/20μs), Pin Dx to GND 30 400 20 350 18 12 200 9 150 6 100 3 50 10 Current(A) 250 Power (W) Current (A) 300 15 0 ±10 ±20 0 0 0 ±5 5 10 15 20 25 30 35 40 45 ±30 50 Time ( s) ±15 C003 ±10 ±5 0 5 10 15 20 Voltage (V) Figure 4. Surge Plot (tp = 8/20μs), Pin GND to Dx 30 35 C004 Figure 5. 30 Amps TLP Plot 1.0 70 0.8 60 0.6 50 Amplitude (V) 0.4 Current (mA) 25 0.2 0.0 ±0.2 ±0.4 40 30 20 10 ±0.6 0 ±0.8 ±1.0 ±10 ±2 ±1 0 1 2 3 4 5 6 Voltage (V) 8 ±15 0 15 30 45 60 75 90 105 120 135 150 165 180 Time (ns) C005 Figure 6. DC SWEEP V-I Curve 4 7 C006 Figure 7. IEC 61000-4-2 Clamping Voltage, +8kV Contact Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD5E003 TPD5E003 www.ti.com SLVSBQ6A – DECEMBER 2012 – REVISED JANUARY 2013 TYPICAL CHARACTERISTICS (continued) 10 0 Amplitude (V) ±10 ±20 ±30 ±40 ±50 ±60 ±70 ±15 0 15 30 45 60 75 90 105 120 135 150 165 180 Time (ns) C007 Figure 8. IEC 61000-4-2 Clamping Voltage, –8kV Contact Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD5E003 5 TPD5E003 SLVSBQ6A – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com REVISION HISTORY Changes from Original (December 2012) to Revision A Page • Added IO voltage tolerance to the ABSOLUTE MAXIMUM RATINGS table. ...................................................................... 2 • Added MAX values to parameters in the ELECTRICAL CHARACTERISTICS table. .......................................................... 2 6 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD5E003 PACKAGE OPTION ADDENDUM www.ti.com 7-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) TPD5E003DPFR ACTIVE Package Type Package Pins Package Qty Drawing X2SON DPF 6 5000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) CU NIPDAU MSL Peak Temp Samples (3) (Requires Login) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD5E003DPFR Package Package Pins Type Drawing X2SON DPF 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 5000 180.0 9.5 Pack Materials-Page 1 1.16 B0 (mm) K0 (mm) P1 (mm) 1.16 0.63 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 7-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD5E003DPFR X2SON DPF 6 5000 180.0 180.0 30.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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