EVERLIGHT EHP-A21LM31H

EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Data Sheet
Features
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Applications
Feature of the device: Small package
with high efficiency
Typical color temperature: 3050 K.
Typical view angle: 115°
Typical light flux output: 22 lm @ 150mA.
ESD protection.
Soldering methods: SMT
Grouping parameter: Brightness,
Forward Voltage and Chromaticity.
Optical efficiency: 42 lm/W.
Moisture Sensitivity Level: 2A
Color rendering Index: 80(typ.)
Thermal resistance
(Junction to Heat sink): 40 °C /W
The product itself will remain within RoHS
compliant version.
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Design and effect illumination
Interior automotive lighting
(e.g. dashboard backlighting)
Room lighting (e.g. luminaries, spotlights)
Reading light (aircraft, car, bus)
Signal and symbol luminaries
Marker lights (e.g. steps, exit ways, etc.)
Architectural illumination
Materials
Items
Description
Encapsulating Resin
Silicone resin
Electrodes
Ag plating copper alloy
Die attach
Silver paste
Chip
InGaN
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Dimensions
Notes.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ± 0.25mm.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Maximum Ratings (T Soldering=25ºC)
Parameter
Symbol
Rating
Unit
DC Operating Current
IF
180
mA
Pulsed Forward Current(1)
IPF
200
mA
ESD
2000
V
Tj
125
°C
Operating Temperature
Top.
-40 ~ +85
°C
Storage Temperature
Tstge.
-40 ~ +100
°C
Power Dissipation
Pd
0.5
W
Junction To Heat-Sink Thermal Resistance
Rth
40
°C /W
ESD Sensitivity
Junction Temperature
Electro-Optical Characteristics (T Soldering=25ºC)
Parameter
Symbol
Min
Typ.
Max
Unit
Brightness(2)
Фv
----
22
----
lm
Forward Voltage(3)
VF
----
3.55
----
V
Color
Temperature(4)
CCT
----
3050
----
K
Condition
IF=150mA
Note.
1. tp ≦100μs, Duty cycle = 0.25
2. Luminous Flux measurement tolerance: ±10%.
3. Forward Voltage measurement tolerance: ± 0.1V.
4. X, Y coordination for white light bin areas refer to EHP-A08-AX08 series White and Warm White
Binning (DSE-A08-001).
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Brightness Bin Table
Group
E
F
J
K
Bin
Min
Typ.
Max
3
11
130
----
140
----
4
12
140
----
150
4
----
5
13
150
----
160
4
5
----
6
21
160
----
180
5
6
----
8
22
180
----
200
1
8
----
10
31
200
----
225
2
10
----
13
32
225
----
250
3
13
----
17
41
250
----
275
4
17
----
20
42
275
----
300
5
20
----
23
51
300
----
350
1
23
----
27
52
350
----
400
2
27
----
33
1
400
----
500
3
33
----
39
2
500
----
600
4
39
----
45
3
600
----
750
5
45
----
52
4
750
----
1000
1
52
----
60
5
1000
----
1300
2
60
----
70
31
70
----
75
32
75
----
80
33
80
----
85
41
85
----
90
42
90
----
95
43
95
----
100
51
100
----
110
52
110
----
120
53
120
----
130
Bin
Min
Typ.
Max
1
1.5
----
2
3
3
Group
N
R
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Forward Voltage Bin Table
Group
U1
U2
U3
U4
Bin
Min
Typ.
Max
1
2.95
----
3.05
2
3.05
----
3.15
2.05
3
3.15
----
3.25
----
2.15
1
3.25
----
3.35
2.15
----
2.25
2
3.35
----
3.45
3
2.25
----
2.35
3
3.45
----
3.55
1
2.35
----
2.45
1
3.55
----
3.65
2
2.45
----
2.55
2
3.65
----
3.75
3
2.55
----
2.65
3
3.75
----
3.85
1
2.65
----
2.75
1
3.85
----
3.95
2
2.75
----
2.85
2
3.95
----
4.05
3
2.85
----
2.95
3
4.05
----
4.15
1
4.15
----
4.25
2
4.25
----
4.35
3
4.35
----
4.45
Bin
Min
Typ.
Max
1
1.75
----
1.85
2
1.85
----
1.95
3
1.95
----
1
2.05
2
Group
V1
V2
V3
V4
V5
Group
O
R
Bin
Min
Typ.
Max
1
4.5
----
5.0
2
5.0
----
5.5
3
5.5
----
6.0
4
6.0
----
6.5
5
6.5
----
7.0
6
7.0
----
7.5
7
7.5
----
8.0
1
8.0
----
9.0
2
9.0
----
10.0
3
10.0
----
11.0
4
11.0
----
12.0
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
White Binning Structure
Warm White
0.48
3250K
3500K
0.44
3800K
4500K
0.40
S4
T4
T5
S5
S6
Q5
R5
R6
Q7
P7
M6
N6
P6
Q6
N7
M4
M5
N5
P5
R4
2850K 2670K
N4
P4
Q4
4100K
CIE-Y
3050K
M7
R7
T6
S7
0.36
T7
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
CIE-X
Note.
This datasheet is a product series datasheet with a list of all possible rankings for the entire Everlight high
power portfolio. It does not specify exact bins available for any particular package. Please contact a
member of your regional Everlight branch to receive specific binning, exact order codes and individual
datasheets for a particular high power LED.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Typical Electro-Optical Characteristics Curves
Forward Voltage vs Forward Current,
Tsoldering=25ºC
1.0
3.8
0.8
3.6
Forward Voltage(V)
Relative Luminous Intenstiy
Relative Spectral Distribution,
IF=150mA, Tsoldering=25ºC
0.6
0.4
0.2
0.0
400
500
600
700
3.4
3.2
3.0
2.8
2.6
800
0
50
Wavelength(nm)
1.2
150
Forward Current (mA)
Relative Luminous Intensity
180
1.0
0.8
0.6
0.4
0.2
120
90
60
30
0
50
100
200
Forward Current Derating Curve,
Derating based on TjMAX=125°C
1.4
0
150
Forward Current(mA)
Relative Luminous Intensity vs Forward
Current, Tsoldering=25ºC
0.0
100
150
Forward Current(mA)
200
0
20
40
60
80
100
ο
Soldering Temperature ( C)
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Typical Representative Spatial Radiation Pattern
1.0
Relative Luminous Intensity
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-80
-60
-40
-20
0
20
40
60
80
Degree (2θ)
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5∘.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Flux
HUE: Color Rank
REF: Rank of Forward Voltage
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ±0.1mm.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
Note.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ±0.1mm.
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant
Label
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Reliability Data
Stress Test
Stress Condition
Stress Duration
Solderability
Tsol=260℃, 10sec
1 times
Reflow
Tsol=260℃, 5sec, 6min
3 times
H:+100℃ 20min.
'∫ 20sec.
'L:- 10℃ 20min.
200 Cycles
Temperature Cycle
H:+100℃ 15min.
'∫ 5min.
'L:- 40℃ 15min.
200 Cycles
High Temperature/Humidity
Reverse Bias
Ta=85℃ , RH=85%
1000hours
High Temperature/Humidity
Operation
Ta=85℃ , RH=85%, IF=120mA
1000hours
High Temperature Storage
Ta=85℃
1000hours
Low Temperature Storage
Ta=-40℃
1000hours
Ta=25℃, IF=150mA
1000hours
Ta=55℃, IF=150mA
1000hours
Ta=85℃, IF=120mA
1000hours
Low Temperature Operation
Life
Ta=-40℃, IF=150mA
1000hours
Power Temperature Cycle
H:+100℃ 15min.
'∫ 5min.
'L:- 40℃ 15min.
IF=120mA,2min on/off
200cycles
Thermal
Shock
High Temperature Operation
Life #1
High Temperature Operation
Life #2
High Temperature Operation
Life #3
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<50%
*VF: FORWARD VOLTAGE DIFFERENCE<20%
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Precautions For Use
Over-current-proof
Although the EHP-A21 series has a conductive ESD protection mechanism, customer must
not use the device in reverse and should apply resistors for extra protection. Otherwise,
slight voltage shifts may cause significant current change resulting in burn out failure.
1. Storage
i.
Do not open the moisture proof bag before the devices are ready to use.
ii.
Before the package is opened, LEDs should be stored at temperatures less than 30℃
and humidity less than 90%.
iii.
LEDs should be used within a year.
iv.
After the package is opened, LEDs should be stored at temperatures less than 30℃and
humidity less than 60%.
v.
LEDs should be used within 168 hours (7 days) after the package is opened.
vi.
If the moisture absorbent material (silicone gel) has faded away or LEDs have
exceeded the storage time, baking treatment should be implemented based on the
following conditions: pre-curing at 60±5℃ for 24 hours.
2. Thermal Management
i.
For maintaining the high flux output and achieving reliability, EHP-A21 series LEDs
should be mounted on a metal core printed circuit board (MCPCB) or other kinds of
heat sink with proper thermal connection to dissipate approximately 0.5W of thermal
energy at 150mA operation.
ii.
Heat dissipation or thermal conduction design is strongly recommended on PCB or
MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2.
iii.
Sufficient thermal management must be implemented. Otherwise, the junction
temperature of die may exceed over the limit at high current driving conditions and the
LEDs’ lifetime may be decrease dramatically.
iv.
For further thermal management suggestions, please consult the Everlight Design
Guide or local representatives for assistance.
v.
Special thermal designs are also recommended to take in outer heat sink design, such
as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal
conductive adhesive, etc.
vi.
Sufficient thermal management must be conducted, or the die junction temperature will
be over the limit under large electronic driving and LED lifetime will decrease critically.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
3. Proper Handling
To avoid contamination of materials, damage of internal components, and shortening
of LED lifetime, do not subject LEDs to conditions as those listed below.
Bare Hand
When handling the product, do not apply
direct pressure on the resin.
Pick and Place Nozzle for Surface
Mount Assembly.
Avoid directly contacting with nozzle.
Tweezers
Do not touch the resin to avoid scratching
or other damage.
During Module Assembly
Do not stack the modules together, it
could damage the resin or scratch the
lens.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
4. Soldering Iron
i. For Reflow Process
a. EHP-A21 series are suitable for SMT process.
b. Curing of glue in oven according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
ii. For Manual Soldering Process
a. For prototype builds or small series production runs it is possible to place and solder the
LED by hand.
b. Dispense thermal conductive glue or grease on the substrates and follow its curing
specifications. Gently press LED housing to closely connect LED and substrate.
c. It is recommended to hand solder the leads with a solder tip temperature of 280°C for
less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of
two seconds or more.
d. Take caution and be aware that damaged products are often a result of improper hand
soldering technique.
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EHP-A21/LM31H-PU5/TR
High Power LED – 0.5W
Revision History
Page
Subjects(major change in previous version)
Date of change
1. Revise DC Operating Current and add Increases the specification
3,4,7
2. Change binning information
20-Jul-2009
3. Revise T Ambient to T Soldering
3
Update brightness value
27-Jul-2009
„ Prepared date:
20-Jul-2009
„ Device No.:
DHE-0000326
„ Created by:
Jessie Chueh
„ Rev.:
3
For product information and a complete list of distributors, please go to our
web site: www.everlight.com
Everlight Electronics Co., Ltd. and the logo are trademarks of Everlight
Electronics Co., Ltd. in the Taiwan and other countries. Data subject to
change.
Copyright © 2005-2009 Everlight Electronics Co., Ltd.. All rights reserved.
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