EXCELICS EMP110-Q5

EMP110-Q5
5.8 – 8.0 GHz Surface-Mounted PA
UPDATED: 04/24/2008
FEATURES
•
•
•
•
5.8 – 8.0 GHz Operating Frequency Range
27 dBm Output Power at 1dB Compression
18.0 dB Typical Small Signal Gain
-40dBc OIMD3 @Each Tone Pout 17dBm
APPLICATIONS
•
•
Point-to-point and point-to-multipoint radio
Military Radar Systems
Caution! ESD sensitive device.
ELECTRICAL CHARACTERISTICS (Ta = 25 °C, 50 ohm, VDD=7V, IDQ=400mA)
SYMBOL
F
P1dB
Gss
OIMD3
Input RL
Output RL
PARAMETER/TEST CONDITIONS
MIN
TYP
MAX
UNITS
8.0
GHz
Operating Frequency Range
5.8
Output Power at 1dB Gain Compression
25.5
27.0
dBm
Small Signal Gain
Output 3rd Order Intermodulation Distortion
@∆f=10MHz, Each Tone Pout 17dBm
15.0
18.0
dB
-40
-37
dBc
Input Return Loss
-10
dB
Output Return Loss
-5
dB
Idss
Saturate Drain Current
VDD
Power Supply Voltage
VDS =3V, VGS =0V
490
1
Rth
Thermal Resistance
Tb
Operating Base Plate Temperature
620
750
7
8
V
o
22
-35
mA
C/W
+85
ºC
ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION2,3
SYMBOL
CHARACTERISTIC
CONTINUOUS
VDS
Drain to Source Voltage
8V
VGS
Gate to Source Voltage
-4 V
IDD
Drain Current
Idss
IGSF
Forward Gate Current
9mA
PIN
Input Power
TCH
Channel Temperature
150°C
TSTG
Storage Temperature
-65/150°C
PT
Total Power Dissipation
@ 3dB compression
5.2W
1. Rth is mounting dependent. Measured result when used with Excelics recommended evaluation board.
2. Operating the device beyond any of the above rating may result in permanent damage.
3. Bias conditions must also satisfy the following equation VDS*IDS < (TCH –THS)/RTH; where THS = ambient temperature
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Page 1 of 3
May 2008
EMP110-Q5
5.8 – 8.0 GHz Surface-Mounted PA
UPDATED: 04/24/2008
CHIP OUTLINE AND PIN ASSIGNMENT
0.197±0.002
0.197±0.002
EMP110
-Q5
0.042
0.034
0.016
0 REF
0.008
0 REF
0.049 MAX
0.197±0.002
0 REF
0 REF
16
20
0.164
15
1
11
5
10
6
0.026±0.002
0.012±0.002
Additional Notes:
1) Ground Plane must be soldered to PCB RF ground
2) All dimensions are in inches
3) Refer to Excelics application notes on QFNs for further guidelines
4) Pin Assignment:
Vd1
RFin
Vd2
EMP110
-Q5
Vd2
Vd1
16
20
15
RFout
1
RFout
RFin
5
11
10
Vg
Pin
1, 2, 4, 5
3
6
7, 8, 9, 10, 11, 12, 14, 15
13
16
17, 18, 19
20
6
Vg
Assignment
NC
RFin
Vg
NC
RFout
Vd2
NC
Vd1
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Page 2 of 3
May 2008
EMP110-Q5
5.8 – 8.0 GHz Surface-Mounted PA
UPDATED: 04/24/2008
Recommended Circuit Schematic:
d
d
22uF
0.1uF
0.1uF
Vd1
NC
RFin
NC
NC
RFout
NC
NC
NC
NC
Vg
22uF
Vd2
EMP110
-Q5
NC
Vg
NC NC NC
22uF
NC NC NC NC
0.1uF
Notes:
1) External bypass capacitors should be placed as close to the package as possible.
2) Dual biasing sequence required:
a. Turn-on Sequence: Apply Vg = -2.5V, followed by Vd = 7V, lastly increase Vg until required Idq
b. Turn-off Sequence: Turn off Vd, followed by Vg
3) Demonstration board available upon request.
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Page 3 of 3
May 2008