LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator Check for Samples: LM2936 FEATURES 1 • 2 • • • • • • • • • • • Ultra Low Quiescent Current (IQ ≤ 15 μA for IO = 100 μA) Fixed 3.0V, 3.3V or 5.0V with 50 mA Output ±2% Initial Output Tolerance ±3% Output Tolerance Over Line, Load, and Temperature Dropout Voltage Typically 200 mV @ IO = 50 mA Reverse Battery Protection −50V Reverse Transient Protection Internal Short Circuit Current Limit Internal Thermal Shutdown Protection 40V Operating Voltage Limit 60V Operating Voltage Limit for LM2936HV Shutdown Pin Available with LM2936BM Package DESCRIPTION The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby mode. With less than 15 μA quiescent current at a 100 μA load, the LM2936 is ideally suited for automotive and other battery operated systems. The LM2936 retains all of the features that are common to low dropout regulators including a low dropout PNP pass device, short circuit protection, reverse battery protection, and thermal shutdown. The LM2936 has a 40V maximum operating voltage limit, a −40°C to +125°C operating temperature range, and ±3% output voltage tolerance over the entire output current, input voltage, and temperature range. The LM2936 is available in a TO-92 package, SOIC-8 and SOT–223 surface mount packages, and a PFM surface mount power package. Typical Application * Required if regulator is located more than 2″ from power supply filter capacitor. ** Required for stability. See Electrical Characteristics for required values. Must be rated over intended operating temperature range. Effective series resistance (ESR) is critical, see curve. Locate capacitor as close as possible to the regulator output and ground pins. Capacitance may be increased without bound. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM2936 SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com Connection Diagrams Figure 1. PFM Top View See Package Number NDP0003B Figure 2. SOT-223 Top View See Package Number DCY0004A Figure 3. 8-Pin SOIC (D) Top View See Package Number D0008A Figure 4. 8-Pin SOIC (D) Top View See Package Number D0008A Figure 5. TO-92 Bottom View See Package Number LP0003A Figure 6. 8-Pin VSSOP (DGK) Top View See Package Number DGK0008A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) +60V, −50V Input Voltage (Survival) ESD Susceptibility (3) 2000V Power Dissipation (4) Internally limited Junction Temperature (TJmax) 150°C −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 10 sec.) (1) (2) (3) (4) 2 260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating ratings. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. Human body model, 100 pF discharge through a 1.5 kΩ resistor. The maximum power dissipation is a function of TJmax, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2936 will go into thermal shutdown. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 Operating Ratings −40°C to +125°C Operating Temperature Range Maximum Operating Input Voltage - LM2936 +40V Maximum Operating Input Voltage - LM2936HV only +60V Maximum Shutdown Pin Voltage - LM2936BM only 0V to 40V TO-92 (LP0003A) θJA 195°C/W VSSOP-8 (DGK0008A) θJA 200°C/W SOIC-8 (D0008A) θJA 140°C/W SOIC-8 (D0008A) θJC 45°C/W PFM (NDP0003B) θJA 136°C/W PFM (NDP0003B) θJC 6°C/W SOT-223 (DCY0004A) θJA 149°C/W SOT-223 (DCY0004A) θJC 36°C/W Electrical Characteristics for LM2936–3.0 VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range Min Typical Max (1) Units 2.910 3.000 3.090 V 10 30 mV 2.940 3.000 3.060 2.910 3.000 3.090 V IO = 100 μA, 8V ≤ VIN ≤ 24V 15 20 μA IO = 10 mA, 8V ≤ VIN ≤ 24V 0.20 0.50 mA IO = 50 mA, 8V ≤ VIN ≤ 24V 1.5 2.5 mA 9V ≤ VIN ≤ 16V 5 10 6V ≤ VIN ≤ 40V, IO = 1 mA 10 30 100 μA ≤ IO ≤ 5 mA 10 30 5 mA ≤ IO ≤ 50 mA 10 30 0.05 0.10 0.20 0.40 V 120 250 mA Parameter Conditions (1) (2) LM2936HV–3.0 Only Output Voltage 5.5V ≤ VIN ≤ 48V, 100 µA ≤ IO ≤ 50 mA Line Regulation 6V ≤ VIN ≤ 60V, IO = 1mA (3) All LM2936–3.0 Output Voltage Quiescent Current Line Regulation Load Regulation Dropout Voltage 4.0V ≤ VIN ≤ 26V, 100 µA ≤ IO ≤ 50 mA (3) IO = 100 μA IO = 50 mA Short Circuit Current VO = 0V Output Impedance IO = 30 mAdc and 10 mArms, f Output Noise Voltage 65 450 10 Hz–100 kHz Ripple Rejection Vripple = 1Vrms, fripple = 120 Hz −40 Reverse Polarity Transient Input Voltage RL = 500Ω, T = 1 ms −50 Output Voltage with Reverse Polarity Input VIN = −15V, RL = 500Ω Maximum Line Transient RL = 500Ω, VO ≤ 3.30V, T = 40ms 60 Output Bypass Capacitance (COUT) ESR COUT = 22µF 0.1mA ≤ IOUT ≤ 50mA 0.3 mV V mΩ = 1000 Hz Long Term Stability mV 500 μV 20 mV/1000 Hr −60 dB −80 V 0.00 −0.30 V V 8 Ω Shutdown Input − LM2936BM–3.0 Only (1) (2) (3) Datasheet min/max specification limits are ensured by design, test, or statistical analysis. Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm. To ensure constant junction temperature, pulse testing is used. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 3 LM2936 SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com Electrical Characteristics for LM2936–3.0 (continued) VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range Parameter Conditions Min Typical Max (1) Units 0 0.010 V 2.00 1.1 (1) (2) Output Voltage, VOUT Output Off, VSD=2.4V, RLOAD = 500Ω Shutdown High Threshold Voltage, VIH Output Off, RLOAD = 500Ω Shutdown Low Threshold Voltage, VIL Output On, RLOAD = 500Ω 1.1 Shutdown High Current, IIH Output Off, VSD = 2.4V, RLOAD = 500Ω 12 μA Quiescent Current Output Off, VSD = 2.4V, RLOAD = 500Ω Includes IIH Current 30 μA V 0.60 V Electrical Characteristics for LM2936–3.3 VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range Min Typical Max (1) Units 3.201 3.300 3.399 V 10 30 mV 3.234 3.300 3.366 3.201 3.300 3.399 V IO = 100 μA, 8V ≤ VIN ≤ 24V 15 20 μA IO = 10 mA, 8V ≤ VIN ≤ 24V 0.20 0.50 mA IO = 50 mA, 8V ≤ VIN ≤ 24V 1.5 2.5 mA 9V ≤ VIN ≤ 16V 5 10 6V ≤ VIN ≤ 40V, IO = 1 mA 10 30 100 μA ≤ IO ≤ 5 mA 10 30 5 mA ≤ IO ≤ 50 mA 10 30 IO = 100 μA 0.05 0.10 IO = 50 mA 0.20 0.40 V 120 250 mA Parameter Conditions (1) (2) LM2936HV–3.3 Only Output Voltage 5.5V ≤ VIN ≤ 48V, 100 µA ≤ IO ≤ 50 mA Line Regulation 6V ≤ VIN ≤ 60V, IO = 1mA (3) All LM2936–3.3 Output Voltage Quiescent Current Line Regulation Load Regulation Dropout Voltage 4.0V ≤ VIN ≤ 26V, 100 µA ≤ IO ≤ 50 mA (3) 65 mV mV V Short Circuit Current VO = 0V Output Impedance IO = 30 mAdc and 10 mArms, f = 1000 Hz 450 Output Noise Voltage 10 Hz–100 kHz 500 μV 20 mV/1000 Hr −60 dB −80 V Long Term Stability Ripple Rejection Vripple = 1Vrms, fripple = 120 Hz −40 Reverse Polarity Transient Input Voltage RL = 500Ω, T = 1 ms −50 Output Voltage with Reverse Polarity Input VIN = −15V, RL = 500Ω Maximum Line Transient RL = 500Ω, VO ≤ 3.63V, T = 40ms 60 Output Bypass Capacitance (COUT) ESR COUT = 22µF 0.1mA ≤ IOUT ≤ 50mA 0.3 0.00 mΩ −0.30 V V 8 Ω 0.010 V Shutdown Input − LM2936BM–3.3 Only Output Voltage, VOUT (1) (2) (3) 4 Output Off, VSD=2.4V, RLOAD = 500Ω 0 Datasheet min/max specification limits are ensured by design, test, or statistical analysis. Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm. To ensure constant junction temperature, pulse testing is used. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 Electrical Characteristics for LM2936–3.3 (continued) VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range Parameter Conditions Min Typical 2.00 1.1 (1) (2) Max (1) Units Shutdown High Threshold Voltage, VIH Output Off, RLOAD = 500Ω V Shutdown Low Threshold Voltage, VIL Output On, RLOAD = 500Ω 1.1 Shutdown High Current, IIH Output Off, VSD = 2.4V, RLOAD = 500Ω 12 μA Quiescent Current Output Off, VSD = 2.4V, RLOAD = 500Ω Includes IIH Current 30 μA 0.60 V Electrical Characteristics for LM2936–5.0 VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range Parameter Conditions Min Typical Max (1) Units 4.85 5.00 5.15 V 15 35 mV 4.90 5.00 5.10 4.85 5.00 5.15 (1) (2) LM2936HV–5.0 Only Output Voltage 5.5V ≤ VIN ≤ 48V, 100 µA ≤ IO ≤ 50 mA Line Regulation 6V ≤ VIN ≤ 60V, IO = 1mA (3) All LM2936–5.0 Output Voltage Quiescent Current Line Regulation Load Regulation Dropout Voltage 5.5V ≤ VIN ≤ 26V, 100 µA ≤ IO ≤ 50 mA (3) V IO = 100 μA, 8V ≤ VIN ≤ 24V 9 15 μA IO = 10 mA, 8V ≤ VIN ≤ 24V 0.20 0.50 mA IO = 50 mA, 8V ≤ VIN ≤ 24V mA 1.5 2.5 9V ≤ VIN ≤ 16V 5 10 6V ≤ VIN ≤ 40V, IO = 1 mA 10 30 100 μA ≤ IO ≤ 5 mA 10 30 5 mA ≤ IO ≤ 50 mA 10 30 0.05 0.10 0.20 0.40 V 120 250 mA IO = 100 μA IO = 50 mA 65 mV mV V Short Circuit Current VO = 0V Output Impedance IO = 30 mAdc and 10 mArms, f = 1000 Hz 450 Output Noise Voltage 10 Hz–100 kHz 500 μV 20 mV/1000 Hr −60 dB −80 V Long Term Stability Ripple Rejection Vripple = 1Vrms, fripple = 120 Hz −40 Reverse Polarity Transient Input Voltage RL = 500Ω, T = 1 ms −50 Output Voltage with Reverse Polarity Input VIN = −15V, RL = 500Ω Maximum Line Transient RL = 500Ω, VO ≤ 5.5V, T = 40ms 60 Output Bypass Capacitance (COUT) ESR COUT = 10µF 0.1mA ≤ IOUT ≤ 50mA 0.3 0.00 mΩ −0.30 V V 8 Ω 0.010 V Shutdown Input − LM2936BM–5.0 Only Output Voltage, VOUT Output Off, VSD=2.4V, RLOAD = 500Ω Shutdown High Threshold Voltage, VIH Output Off, RLOAD = 500Ω (1) (2) (3) 0 2.00 1.1 V Datasheet min/max specification limits are ensured by design, test, or statistical analysis. Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm. To ensure constant junction temperature, pulse testing is used. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 5 LM2936 SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com Electrical Characteristics for LM2936–5.0 (continued) VIN = 14V, IO = 10 mA, TJ = 25°C, unless otherwise specified. Boldface limits apply over entire operating temperature range Parameter Conditions Min (1) Typical Max (1) Units 0.60 V (2) Shutdown Low Threshold Voltage, VIL Output On, RLOAD = 500Ω 1.1 Shutdown High Current, IIH Output Off, VSD = 2.4V, RLOAD = 500Ω 12 μA Quiescent Current Output Off, VSD = 2.4V, RLOAD = 500Ω Includes IIH Current 30 μA 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 Typical Performance Characteristics Maximum Power Dissipation (TO-92) Dropout Voltage Figure 7. Figure 8. Dropout Voltage Quiescent Current Figure 9. Figure 10. Quiescent Current Quiescent Current Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 7 LM2936 SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Quiescent Current Quiescent Current Figure 13. Figure 14. LM2936–5.0 COUT ESR LM2936–3.0 COUT ESR 50 8 Figure 15. Figure 16. LM2936–3.3 COUT ESR Peak Output Current Figure 17. Figure 18. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Peak Output Current LM2936–5.0 Current Limit Figure 19. Figure 20. LM2936–5.0 Line Transient Response LM2936–5.0 Output at Voltage Extremes Figure 21. Figure 22. LM2936–5.0 Ripple Rejection LM2936–5.0 Load Transient Response Figure 23. Figure 24. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 9 LM2936 SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) 10 LM2936–5.0 Low Voltage Behavior LM2936–5.0 Output Impedance Figure 25. Figure 26. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 APPLICATIONS INFORMATION Unlike other PNP low dropout regulators, the LM2936 remains fully operational to 40V. Owing to power dissipation characteristics of the available packages, full output current cannot be ensured for all combinations of ambient temperature and input voltage. As an example, consider an LM2936Z–5.0 operating at 25°C ambient. Using the formula for maximum allowable power dissipation given in (1), we find that PDmax = 641 mW at 25°C. Including the small contribution of the quiescent current to total power dissipation the maximum input voltage (while still delivering 50 mA output current) is 17.3V. The LM2936Z–5.0 will go into thermal shutdown if it attempts to deliver full output current with an input voltage of more than 17.3V. Similarly, at 40V input and 25°C ambient the LM2936Z–5.0 can deliver 18 mA maximum. Under conditions of higher ambient temperatures, the voltage and current calculated in the previous examples will drop. For instance, at the maximum ambient of 125°C the LM2936Z–5.0 can only dissipate 128 mW, limiting the input voltage to 7.34V for a 50 mA load, or 3.5 mA output current for a 40V input. The junction to ambient thermal resistance θJA rating has two distinct components: the junction to case thermal resistance rating θJC; and the case to ambient thermal resistance rating θCA. The relationship is defined as: θJA = θJC + θCA. For the SOIC-8 and PFM surface mount packages the θJA rating can be improved by using the copper mounting pads on the printed circuit board as a thermal conductive path to extract heat from the package. On the SOIC-8 package the four ground pins are thermally connected to the backside of the die. Adding approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the θJA rating to approximately 110°C/W. If this extra pad are is placed directly beneath the package there should not be any impact on board density. On the PFM package the ground tab is thermally connected to the backside of the die. Adding 1 square inch of 2 oz. copper pad area directly under the ground tab will improve the θJA rating to approximately 50°C/W. While the LM2936 has an internally set thermal shutdown point of typically 160°C, this is intended as a safety feature only. Continuous operation near the thermal shutdown temperature should be avoided as it may have a negative affect on the life of the device. While the LM2936 maintains regulation to 60V, it will not withstand a short circuit above 40V because of safe operating area limitations in the internal PNP pass device. Above 60V the LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this device in a design where the input operating voltage may exceed 40V, or where transients are likely to exceed 60V. SHUTDOWN PIN The LM2936BM has a pin for shutting down the regulator output. Applying a Logic Level High (>2.0V) to the Shutdown pin will cause the output to turn off. Leaving the Shutdown pin open, connecting it to Ground, or applying a Logic Level Low (<0.6V) will allow the regulator output to turn on. (1) The maximum power dissipation is a function of TJmax, θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2936 will go into thermal shutdown. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 11 LM2936 SNOSC48N – JUNE 2000 – REVISED MARCH 2013 www.ti.com Equivalent Schematic Diagram Figure 27. 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 LM2936 www.ti.com SNOSC48N – JUNE 2000 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision M (March 2013) to Revision N • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM2936 13 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2936BM-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6B3.3 LM2936BM-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6B5.0 LM2936BMX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6B3.3 LM2936BMX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293 6B5.0 LM2936BMX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6B5.0 LM2936DT-3.0 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM2936D T-3.0 LM2936DT-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D T-3.0 LM2936DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D T-3.3 LM2936DT-5.0 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM2936D T-5.0 LM2936DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D T-5.0 LM2936DTX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D T-3.0 LM2936DTX-3.3 ACTIVE TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM2936DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D T-3.3 LM2936DTX-5.0 NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM2936D T-5.0 LM2936DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM2936D T-5.0 LM2936HVBMA-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H BM3.3 LM2936HVBMA-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2936H BM3.3 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2936HVBMA-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H BM5.0 LM2936HVBMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2936H BM5.0 LM2936HVBMAX3.3 NRND SOIC D 8 2500 TBD Call TI Call TI 2936H BM3.3 LM2936HVBMAX3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 2936H BM3.3 LM2936HVBMAX5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 2936H BM5.0 LM2936HVMA-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H M-5.0 LM2936HVMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2936H M-5.0 LM2936HVMAX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 2936H M-5.0 LM2936HVMAX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2936H M-5.0 LM2936M-3.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6M-3 LM2936M-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM293 6-3.3 LM2936M-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6-3.3 LM2936M-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM293 6M-5 LM2936M-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 LM293 6M-5 LM2936MM-3.0 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 KBC LM2936MM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KBC LM2936MM-3.3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 KBB LM2936MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KBB LM2936MM-5.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KBA Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 1-Nov-2013 Status (1) LM2936MMX-3.3/NOPB Package Type Package Pins Package Drawing Qty ACTIVE VSSOP DGK 8 3500 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KBB (4/5) LM2936MMX-5.0 NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 KBA LM2936MMX-5.0/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KBA LM2936MP-3.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM2936MP-3.3 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 KABA LM2936MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KABA KACA LM2936MP-5.0 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 KAAA LM2936MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KAAA LM2936MPX-3.0 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 KACA LM2936MPX-3.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KACA LM2936MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KABA LM2936MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KAAA LM2936MX-3.3 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293 6-3.3 LM2936MX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM293 6-3.3 LM2936MX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293 6M-5 LM2936MX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 LM293 6M-5 LM2936Z-3.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 125 LM2936 Z-3 LM2936Z-3.3/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 125 LM2936 Z-3.3 LM2936Z-5.0/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM293 6Z-5 LM2936Z-5.0/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM293 6Z-5 Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 1-Nov-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) LM2936Z-5.0/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM2936Z-5.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type Op Temp (°C) Device Marking (4/5) LM293 6Z-5 -40 to 125 LM293 6Z-5 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2936BMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936BMX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936BMX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936DTX-3.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM2936DTX-5.0 TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM2936HVBMAX3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936HVBMAX3.3/NOP B SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936HVBMAX5.0/NOP B SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936HVMAX-5.0 LM2936HVMAX-5.0/NOP B LM2936MM-3.0 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2936MM-5.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MMX-5.0 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-3.3 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-3.0 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MX-3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936MX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 *All dimensions are nominal Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2936BMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936BMX-5.0 SOIC D 8 2500 367.0 367.0 35.0 LM2936BMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936DTX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM2936DTX-5.0 TO-252 NDP 3 2500 367.0 367.0 35.0 LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM2936HVBMAX3.3 SOIC D 8 2500 367.0 367.0 35.0 LM2936HVBMAX3.3/NOP B SOIC D 8 2500 367.0 367.0 35.0 LM2936HVBMAX5.0/NOP B SOIC D 8 2500 367.0 367.0 35.0 LM2936HVMAX-5.0 SOIC D 8 2500 367.0 367.0 35.0 LM2936HVMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936MM-3.0 VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM2936MMX-5.0 VSSOP DGK 8 3500 367.0 367.0 35.0 LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-3.3 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MPX-3.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MX-3.3 SOIC D 8 2500 367.0 367.0 35.0 LM2936MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936MX-5.0 SOIC D 8 2500 367.0 367.0 35.0 LM2936MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 3 MECHANICAL DATA NDP0003B TD03B (Rev F) www.ti.com MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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