FOSLINK FSP3300YD

350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
„
FEATURES
„
z
z
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No external component required
350mA constant sink current
Output short circuit protection
Low dropout voltage
Low quiescent current
Build-in thermal protection
Supply voltage range 2.7V~7V
2KV HBM ESD protection
Advanced CMOS process
SOT89 and TO252 package
The FSP3300 is a low dropout current regulator rated
for 350mA constant sink current. The low quiescent
current and low dropout voltage is achieved by
advanced CMOS process
„
PIN CONFIGURATION
(1) SOT89
GENERAL DESCRIPTION
„
APPLICATIONS
z
Power LED driver
(2) TO252
(Top View)
(Top View)
3
2
Symbol
1
2
3
„
1/7
1
2
3
OUT
GND
VDD
Name
OUT
GND
VDD
1
VDD
GND
OUT
Descriptions
Output pin, connect to load
Ground
Power supply
BLOCK DIAGRAM
2007-1-25
350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
„
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Rating
Unit
VDD
Input Voltage
2.7 to 7
V
VLEDn
Output Voltage
2.7 to 7
V
TJ
Maximum Junction Temperature
150
℃
℃
Tstg
Storage Temperature Range
-40~+150
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.
Currents are positive into, negative out of the specified terminal.
„
ELECTRICAL CHARACTERISTICS (VDD=3.7V, TA=25℃, UNLESS OTHERWISE NOTED)
Symbol
Parameter
Test Conditions
ISINK
Output Sink Current
VOUT=0.2V
Load Regulation
VOUT=0.2V to 3V
Line Regulation
VDD=3V to 6V , VOUT=0.2V
VOUTL
Output Dropout Voltage
IDD
Supply Current Consumption
Note: Output dropout voltage: 90% ×[email protected] VOUT=200mV
„
Typ.
Max.
Unit
305
350
390
5
5
mA
mA/V
mA/V
mV
µA
120
200
Apply
Pin
OUT
VDD
Recommended Operating Conditions
Symbol
VDD
IOUT
Ta
„
Min.
Parameter
Supply Voltage
Output Sink Current
Operating free-air temperature range
Min.
2.7
-40
Typ.
Max.
6
400
+85
Unit
V
mA
℃
Power Dissipation Table
θJA
Derating factor (mW/℃) Power rating (mW) Power rating (mW) Power rating (mW)
TA≤25℃
(℃/W)
TA=70℃
TA=85℃
TA≥25℃
PK
71
14.1
1763
1128
916
Note: Junction Temperature Calculation: TJ=TA+(PD×θJA).
PD: Power Dissipation, TA: Ambient temperature, θJA: Thermal Resistance-Junction to Ambient.
The θJA numbers are guidelines for the thermal performance of the device/PC-board system.
All of the above assume no ambient airflow.
Package
2/7
2007-1-25
350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
„
TYPICAL APPLICATIONS CIRCUIT
(1) Typical Application Circuit
Supply Voltage
2.7V to 7.0V
1
3
VDD
OUT
2
GND
Note:
1. The supply voltage should be larger than the forward voltage of the LED by 0.15V.
VDD≥VLEDF+0.15
In the application of VDD= VLEDF+0.15, the chip works in the max efficiency and min power dissipation
(2) Typical Application Circuit for Larger Current
Supply Voltage
4*Battery ≥6V
1
3
VDD
OUT
1
2
GND
3
VDD
OUT
2
GND
Note:
The FSP3300 can be parallel connected to get larger driver current (about 700mA) for 3W LED.
At this application, the supply voltage should be 6V at least for 3W LED. To minimize the chip power dissipation, there
should be a diode connected between supply to VDD of the chip. The forward voltage of the diode should be less than
3.3V.
„
APPLICATION INFORMATION
The maximum power dissipation on regulator:
PD(MAX)=VOUT(MAX)×IOUT(NOM)+VIN(MAX) ×IQ
VOUT(MAX =the maximum voltage on output pin
IOUT(NOM)=the nominal output current
IQ =the quiescent current the regulator consumes at
VIN(MAX =the maximum input voltage
Thermal consideration:
The FSP3300 have internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of FSP3300 prevents the device from damage due to excessive power
dissipation. When the device temperature rises to approximately 120℃, the regulator will be turned off. When power
consumption is over about 700mW (SOT89-3L package at TA=70℃), additional heat sink is required to control the
junction temperature below 120℃.
The junction temperature is: TJ=PD(θJT+θCS +θSA)+TA
PD: Dissipation power
θJT: Thermal resistance from the junction to the mounting tab of the package
θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted.
(typically, θCS≤1.0℃/W)
3/7
2007-1-25
350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink)
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink, They can be connected
with several through hole vias.
PCB θSA (℃/W)
PCB heat sink size (mm2)
„
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10
Quiescent Current vs Supply Voltage
IQ(mA)
IQ(mA)
TYPICAL PERFORMANCE CHARACTERISTICS
OUT(mA)
4/7
59
500
2
2.5
3
VIN(V)
3.5
4
0.22
0.20
0.18
0.16
0.14
0.12
0.10
20
Quiescent Current vs Temperature
30
40
50 60 70 80
Temperature(℃)
Output Current vs Out-dropout Voltage
140
120
100
80
60
40
20
0
0.01
0.1
1
10
OUT-DROPOUT(V)
2007-1-25
90 100
350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
„
ORDERING INFORMATION
FSP3300X X X
Package:
Y: SOT89
D: TO252
„
Packing:
Blank: Tube or Bulk
A: Tape & Reel
Temperature Grade:
D: -40~85℃
MARKING INFORMATION
(1) SOT89
(2) TO252
Logo
Logo
LAYMX
FSP3300
Internal Code
Date Code:
Y: Year (1=2001)
M: Month (1~9, O,N, D)
Part Number: FSP3300
5/7
Part Number
YYWWXX
Internal Code
Date Code:
YY: Year (01=2001)
WW: Nth week (01~52)
2007-1-25
350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
„
PACKAGE INFORMATION
(1) SOT89
D1
HE
E
2.7
1.7
e1
1.3
L
1.9
0.4
1.5
0.9
e
Land Patten Recommendation
(Unit :mm)
5°(2х)
8°(2х)
C
A
D
b
Symbol
A
b
b1
C
D
D1
e
e1
E
HE
L
6/7
b1
Min.
1.40
0.36
0.41
0.35
4.40
1.40
2.90
1.45
2.35
3.94
0.80
b
Dimensions In Millimeters
Nom.
1.50
0.42
0.47
0.39
4.50
1.60
3.00
1.50
2.48
Max.
1.60
0.48
0.53
0.43
4.60
1.75
3.10
1.55
2.60
4.25
1.20
Min.
0.055
0.014
0.016
0.014
0.173
0.055
0.114
0.057
0.093
0.155
0.031
Dimensions In Inches
Nom.
0.059
0.016
0.043
0.015
0.177
0.062
0.118
0.059
0.098
2007-1-25
Max.
0.063
0.018
0.051
0.017
0.181
0.069
0.122
0.061
0.102
0.167
0.047
350 MA CONSTANT-CURRENT LED DRIVER
FSP3300
(2) TO252
5.6
E
7.2
2.25
L1
2.0
D
11.0
5.6
L2
b2
1.2
b
e
Land Pattern Recommendation (Unit : mm)
e1
C
A1
C1
L
A
H
SEATING PLANE
SEE NOTE2
Notes:
1. JEDEC Outline:TO-252 AB
2. Mils suggested for positive contact at mounting
Symbol
A
A1
b
b2
C
C1
D
E
e
e1
H
L
L1
L2
7/7
Min.
2.18
1.02
5.20
0.46
0.46
5.33
6.35
9.00
0.51
0.64
1.52
Dimensions In Millimeters
Nom.
Max.
2.29
2.39
1.15
1.27
0.61TYP.
5.35
5.50
0.52
0.58
0.52
0.58
5.57
5.80
6.58
6.80
2.25BSC.
4.50BSC.
9.70
10.40
0.83
1.78
1.02
2.03
Min.
0.086
0.040
0.205
0.018
0.018
0.210
0.250
0.354
0.020
0.025
0.060
Dimensions In Inches
Nom.
0.090
0.045
0.024TYP.
0.211
0.020
0.020
0.219
0.259
0.089BSC.
0.177BSC.
0.382
0.033
0.070
2007-1-25
Max.
0.094
0.050
0.217
0.023
0.023
0.228
0.268
0.409
0.040
0.080