TI LM4308

LM4308
LM4308 Mobile Pixel Link Two (MPL-2) 18-bit CPU Display Interface
Master/Slave
Literature Number: SNLS225B
LM4308
Mobile Pixel Link Two (MPL-2) – 18-bit CPU Display
Interface Master/Slave
General Description
Features
The LM4308 device adapts a 18-bit CPU style display interfaces to a MPL-2 SLVS differential serial link for displays. Two
chip selects support a main and sub display up to and beyond
640 x 480 pixels. A mode pin configures the device as a Master (MST) or Slave (SLV). Both WRITE and READ operations
are supported. CPU interface widths below 18-bits are supported by tieing unused inputs to a static level.
The differential line drivers and receivers conform to the
JEDEC SLVS Standard. When noise is picked up as common-mode, it is rejected by the receivers. This is further
enhanced with the 50 Ohm output impedance of the drivers.
The 100 Ohm termination is integrated into the receivers.
Data integrity is insured with a 5-bit CRC field. CRC checking
is done for both WRITE and READ operations. An Error
(ERR) pin reports the occurrence of an error. A Write Only
mode is also provided.
The interconnect is reduced from 23 signals to only 4 active
signals with the LM4308 chipset easing flex interconnect design, size constraints and cost.
A low power sleep state entered when the PD* inputs are
driven low.
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18-bit i80 CPU Display Interface
Supports up to 640 x 480 VGA formats
Differential SLVS Interface
Dual displays supported
WRITE and READ operations supported
Robust Differential Physical Layer
400mVpp differential signal swing
Internal 100 Ω Termination Resistor
Low Power Consumption
5-bit CRC for data integrity
Level translation between host and display
Low Power sleep state
3.3V Tolerant Master Clock Input regardless of VDDIO
Fast Start Up Time - 1k CLK cycles
1.6V to 2.0V core / analog supply voltage
1.6V to 3.0V I/O supply voltage range
System Benefits
■
■
■
■
Small Interface
Low Power
Low EMI
Intrinsic Level Translation
Typical Application Diagram
20189601
© 2007 National Semiconductor Corporation
201896
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LM4308 Mobile Pixel Link Two (MPL-2) – 18-bit CPU Display Interface Master/Slave
September 2007
LM4308
Pin Descriptions
Pin Name
No.
of Pads
uArray
Description
No.
of Pins
LLP
I/O, Type
CPU Master
(MST)
CPU Slave
(SLV)
SLVS SERIAL BUS PINS
DDP
1
1
IO, slvs
Differential Data - Positive, Transceiver
DDN
1
1
IO, slvs
Differential Data - Negative, Transceiver
DCP
1
1
O, I, slvs
Differential Clock - Positive,
Line Driver
Differential Clock - Positive,
Receiver
DCN
1
1
O, I, slvs
Differential Clock - Negative,
Line Driver
Differential Clock - Clock,
Receiver
Low for Slave
CONFIGURATION/PARALLEL BUS PINS
M/S*
1
1
I,
LVCMOS
High for Master
TM
1
1
I,
LVCMOS
Test Mode Control Input
Tie Low
L = Normal
H = Test Mode (factory test only)
PLLCON
[1:0]
2
2
I,
LVCMOS
PLL Multiplier Input Pins
See PLLCON[1:0] - PLL Multiplier
Settings
NA
RDS[1:0]
2
2
I,
LVCMOS
NA
Receiver Drive Strength Control Input
Pins,
See RDS[1:0] - Receiver Output Drive
Strength
ERR
1
1
O,
LVCMOS
Error Output Signal
Indicates a CRC error on the READ
Payload
Error Output Signal
Reports a CRC error was detected on
the WRITE Payload
WO
1
1
I,
LVCMOS
NA
WRITE Only Control Input
L = Writes and reads enabled
H = Write Only
NA
CLOCK / POWER DOWN SIGNALS
CLK
1
1
I,
LVCMOS
CLK Input
Input is 3.3V Tolerant regardless of
VDDIO
PD*
1
1
I,
LVCMOS
Power Down Input,
L = Powered down, Low Power SLEEP state
H = active state
PARALLEL INTERFACE SIGNALS
D[17:0]
18
18
IO,
LVCMOS
CPU Data Bus Inputs / Outputs
CS1*
CS2*
2
2
I, O,
LVCMOS
Chip Select Input Pins
Chip Select Output Pins
Only one CS is allowed to be Low at a
time.
RD*
1
1
I, O,
LVCMOS
Read Enable Input,
active Low
Read Enable Output,
active Low
WR*
1
1
I, O,
LVCMOS
Write Enable Input,
active Low
Write Enable Output,
active Low
AD
1
1
I, O,
LVCMOS
Address / Data selector input
Address / Data selector output
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2
CPU Data Bus Outputs / Inputs
No.
of Pads
uArray
Description
No.
of Pins
LLP
I/O, Type
CPU Master
(MST)
CPU Slave
(SLV)
POWER/GROUND PINS
VDDA
1
1
Power
Power Supply Pin for the PLL (MST) and SLVS Interface. 1.6V to 2.0V
VSSA
1
1
Ground
Ground Pin for the PLL (MST) and SLVS Interface.
VDD
1
1
Power
Power Supply Pin for the digital core. 1.6V to 2.0V
VSS
1
*
Ground
Ground Pin for the digital core.
VDDIO
2
2
Power
Power Supply Pin for the parallel interface I/Os. 1.6V to 3.0V
VSSIO
9
*
Ground
Ground Pin for the parallel interface I/Os.
For the LLP Package, VSSIO and VSS
DAP
NA
*
1
Connect to Ground - LLP Package
Ground pin for VSSIO and VSS
Note:
I = Input, O = Output, IO = Input/Output. Do not float input pins.
PLLCON[1:0] - PLL Multiplier
Settings
RDS[1:0] - Receiver Output Drive
Strength
PLLCON1
PLLCON0
Multiplier
RDS1
RDS0
Result
L
L
8X
L
L
Use with High VDDIO operation
L
H
10X
L
H
H
L
12X
Increased drive on DATA, AD, and
CS1*/CS2* outputs
H
H
Reserved
H
L
Increased drive on WR* and RD*
H
H
All outputs, use for Low VDDIO,
Increased drive strength on all
outputs
Ordering Information
NSID
Package Type
Package ID
LM4308GR
49L MicroArray, 4.0 X 4.0 X 1.0 mm, 0.5 mm pitch
GRA49A
LM4308SQ
40L LLP, 5.0 X 5.0 X 0.8 mm, 0.4 mm pitch
SQF40A
3
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LM4308
Pin Name
LM4308
GRA Package
Derate GRA Package above 25°C
SQF Package
Derate SQF Package above 25°C
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VDDA)
Supply Voltage (VDD)
Supply Voltage (VDDIO)
LVCMOS Input/Output Voltage
CLK LVCMOS Input Voltage
SLVS Input/Output Voltage
Junction Temperature
Storage Temperature
ESD Ratings:
−0.3V to +2.2V
−0.3V to +2.2V
−0.3V to +3.6V
−0.3V to (VDDIO
+0.3V)
−0.3V to +3.3V
−0.3V to VDDA
+150°C
−65°C to +150°C
Recommended Operating
Conditions
Min Typ Max
Units
Supply Voltage
≥±2 kV
≥±200V
HBM, 1.5 kΩ, 100 pF
2.75 W
22 mW/°C
3.43 W
27 mW/°C
EIAJ, 0Ω, 200 pF
Maximum Package Power Dissipation Capacity at 25°C
VDDA to VSSA and
VDD to VSS
VDDIO to VSSIO
1.6
1.6
3.0
V
Clock Frequency
DC (Serial) Clock Frequency
Ambient Temperature
9.6
76.8
−40
30
240
85
MHz
MHz
°C
1.8
2.0
25
V
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (Notes 2, 3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
140
200
270
mV
-10
0
10
mV
150
200
250
mV
-5
0
5
mV
SLVS
VOD
Differential Output Voltage
ΔVOD
Differential Output Voltage
Match
VOS
Driver Offset Voltage
ΔVOS
Driver Offset Voltage Match
ROUT
Driver Output Impedance
100 Ω Load
(Note 9)
(Note 9)
High Output
50
Ω
Low Output
50
Ω
VOH
High Level Output Voltage
(Diff. Mode)
RT
Receiver Differential
Termination Resistor
DD (RX) Configuration or DC (SLV) (Note
8)
VIDH
Differential Input High
Threshold
RX, VCM = 35mV, 200mV and 365mV
(Note 9)
VIDL
Differential Input Low
Threshold
VCM
Receiver Common Mode
Input Range
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80
−70
RX with VID = |70mV|
35
4
360
mV
100
125
Ω
10
70
mV
-10
mV
365
mV
Parameter
Conditions
Min
Typ
Max
Units
0.7 VDDIO
VDDIO
V
GND
0.3 VDDIO
LVCMOS
VIH
Input Voltage High Level
VIL
Input Voltage Low Level
VHY
Input Hysteresis
IIH
Input Current High Level
160
LVCMOS Inputs
VIN = VDDIO
−1
CLK Input
VIN = 3.3V
VDDIO = 1.8V
(Note 10)
0
VIN = 1.8V
VDDIO = 1.8V
−1
−1
CLK Input
IIL
Input Current Low Level
VOH
Output Voltage High Level
VOL
Output Voltage Low Level
0
V
mV
+1
µA
+8
µA
0
+1
µA
0
+1
µA
IOH = −2 mA
RDS = H
VDD = 1.6 V , VDDIO = 2.0 V
0.75 VDDIO
VDDIO
V
IOH = −2 mA
RDS = L
VDD = 2.0 V , VDDIO = 3.0 V
0.8 VDDIO
VDDIO
V
IOL = 2 mA
RDS = H
VDD = 1.6V , VDDIO = 2.0 V
VSSIO
0.2 VDDIO
V
IOL = 2 mA
RDS = L
VDD = 2.0 V , VDDIO = 3.0 V
VSSIO
0.2 VDDIO
V
SUPPLY CURRENT
IDD
Total Supply Current—
Enabled
Conditions: CLK = 30MHx (8X
mode), DC = 240MHz,
DD = 480Mbps
Worse Case Data Pattern,
constant WRITE
Master
(Note 11)
VDDIO
64
µA
VDD/VDDA
18
mA
Slave
(Note 11)
VDDIO
18
mA
7
mA
Supply Current—Enabled
Bus Idle (WR* = H)
Master
Slave
IDDZ
PD
Supply Current—Disable
Power Down Modes
Power Dissipation
VDD/VDDA
VDDIO
10
µA
VDD/VDDA
8.2
mA
VDDIO
>1
µA
VDD/VDDA
2.9
mA
Master
VDDIO
PD* = L, or CLK stop V /V
DD DDA
8
µA
9
µA
Slave
PD* = L, or Auto
Sleep
VDDIO
8
µA
VDD/VDDA
9
µA
25% Bus active
Master
15
mW
Slave
6
mW
Master
14.8
mW
Idle Bus
Slave
5.2
mW
QVGA
(Note 5)
Master
195
µW
Slave
8
µW
PD*=L
Master
>0.1
µW
Slave
>0.1
µW
5
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LM4308
Symbol
LM4308
Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
PARALLEL BUS TIMING See alsoTable 2 and Figure 9
tSET
Set Up Time
tHOLD
Hold Time
tRISE
Rise Time
tFALL
Master Input, WRITE
RD* and WR* Slave
Outputs(Note 4)
CL = 15 pF,
Figure 2
Fall Time
5
ns
5
ns
VDDIO = 1.6V
RDS = H
7
ns
VDDIO = 3.0V
RDS = L
7
ns
VDDIO = 1.6V
RDS = H
7
ns
VDDIO = 3.0V
RDS = L
6
ns
SERIAL BUS TIMING
tDVBC
Data Valid before DC Clock
Master
(Note 9)
26%
74%
tDVAC
Data Valid after DC Clock
tSset
Serial Set Time
26%
74%
400
Serial Hold Time
Slave
(Note 8)
tShold
tT
Transition Time
Master
UI
ps
400
20% to 80%
UI
ps
200
ps
128
CLK
cycles
128
CLK
cycles
504
CLK
cycles
128
CLK
cycles
8
CLK
cycles
128
CLK
cycles
1,024
CLK
cycles
POWER UP TIMING
ta
DC ON High Delay
tb
DC Low Delay
tc
DC Active Delay
td
DD High Delay
te
DD Low Delay
tf
DD Differential ON
tSU
Start Up Delay
Includes PLL Lock Time
Link Start Up Sequence
ta +tb + tc + td + te + tf
POWER OFF TIMING
tO
Turn Off Delay
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(Note 7)
0.1
6
2
µs
LM4308
Recommended Input Timing Requirements
Over recommended operating supply and temperature ranges unless otherwise specified. (Note 2)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
MASTER REFERENCE CLOCK (CLK)
f
Clock Frequency
9.6
30
MHz
tCP
Clock Period
33.3
104.2
ns
CLKDC
Clock Duty Cycle
30
50
70
%
tT
Clock/Data Transition Times (Rise or Fall, 10%–90%)(Note 6)
2
>2
tCLKgap
CLK Stop Gap
4
ns
CLKcycles
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for VDDIO = 1.8V and VDD = VDDA = 1.8V and TA = 25°C.
Note 3: Current into a device pin is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to Ground unless otherwise
specified.
Note 4: Rise and Fall Time tested on the following pins only: WR* and RD*.
Note 5: Typical PD for QVGA application. Conditions: 1.8V, 25C, 19.2MHz CLK and 8X, 10% blanking, 1fps. Link is started up, 1 frame (240 x 320) is sent and
link is powered down.
Note 6: Maximum transition time is a function of clock rate and should be less than 30% of the clock period to preserve signal quality.
Note 7: Guaranteed functionally by the IDDZ parameter. See also Figure 7.
Note 8: Specification is guaranteed by design and is not tested in production.
Note 9: Specification is guaranteed by characterization and is not tested in production.
Note 10: When clock input is in overdrive ( Vin = 3.3 V ) and then stop clock is applied, it is recommended to set input clock to a low state.
Note 11: For IDD measurments a checkerboard pattern 2AAAA-15555 was used.
Timing Diagrams
20189616
FIGURE 1. Serial Data Valid & Set/Hold Times
20189618
FIGURE 2. Slave Output Rise and Fall Time (WR* and RD*)
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LM4308
Functional Description
BUS OVERVIEW
The LM4308 is a Master (SER) / Slave (DES) configurable
part that supports a 18-bit (or less) i80 CPU Display interface.
Both WRITE and READ transactions are supported. The
SLVS physical layer is purpose-built for an extremely low
power and low EMI data transmission while requiring the
fewest number of signal lines. No external line components
are required, as termination is provided internal to the SLVS
receiver. A maximum raw throughput of 480 Mbps (raw) is
possible with this chipset. The SLVS interface is designed for
use with 100Ω differential lines.
20189603
FIGURE 4. Serial Link Timing (WRITE)
Data is strobed out on the Rising edge by the Slave for a CPU
READ as shown in Figure 5. The Master monitors for the start
bit transition (High to Low) and then selects the best strobe to
sample the incoming data on. This is done to account for the
round trip delay of the interconnect and application data rate.
Since READ data is sent on one edge only, the back channel
rate (READ) is one quarter that of the WRITE rate.
20189604
FIGURE 5. Serial Link Timing (READ)
20189602
FIGURE 3. SLVS Point-to-Point Bus
SERIAL BUS PHASES
There are five bus phases on the serial bus. These are determined by the state of the DC and DD lines. The bus phases
are shown in Table 1.
SERIAL BUS TIMING
Data valid is relative to both edges for a CPU WRITE as
shown in Figure 4. Data valid is specified as: Data Valid before
Clock, Data Valid after Clock, and Skew between data lines
should be less than 500ps.
TABLE 1. Link Phases
Name
DC State
DD State
OFF (O)
GND
GND
IDLE (I)
A
H
Idle, MD(s) = Logic Low
ACTIVE (A),
Write
A
X
ACTIVE, Read Command
Read
A
TA’
Read Data
TA"
LINK-UP Master
(LU)
Phase Description
Link is Off
Post-Phase
A, I or LU
LU
A or LU
A or O
Write Payloads
LU, A, or I
A, I, or O
X
(MST)
Read Command
A, or I
A
HUH
MD Turn Around
RC
RD
A
X
(SLV)
Read Payload
TA’
TA"
A
HUH
MD Turn Around
RD
I
*
*
O
A, I, or O
Start Up
Notes on DC/DD Line State:
0 = no current (off)
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Pre-Phase
8
20189605
FIGURE 6. Serial Bus Power Up Timing
Actual start up time is clock rate dependant. The 1024 CLK
counter encompasses both the SLVS start up delay and PLL
Lock Time. At 19.2MHz operation, the link is ready for transmission after only 54 µs. Do not WRITE to either display
before the serial link start up delay has expired.
OFF PHASE
In the OFF phase, differential transmitters are turned off and
the lines are both driven to Ground. Figure 7 shows the transition of the serial bus into the OFF phase. The link may be
powered down by asserting Master and Slave PD* pins, the
Master PD* pin alone or stopping the clock . To avoid loss of
data the clock input should only be asserted after the serial
bus has been in the IDLE state for at least 100 DC clock cycles. This also applies to when Master’s PD* input is asserted.
The 100 DC clock cycles give the Slave enough time to complete any write operations received from the serial bus.
Do not asserted the Slave PD* pin alone, as this will not reset
the link properly. If the Slave PD* pin is asserted, the Master’s
PD* must also be asserted to generate a proper start up sequence.
Start Up Time vs. CLK Frequency
CLK FREQ
Start Up Delay
9.6MHz
106.7 µs
19.2MHz
53.3 µs
30MHz
34.13 µs
9
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LM4308
driven to the differential levels and the clock signal is active.
The DD lines are then pulsed from a LVCMOS Low state, then
driven to a valid differential static High state. Data transmission (WRITE) starts with a valid Low start bit on the DD signal.
SERIAL BUS START UP TIMING
The DC and DD lines are held at a LVCMOS Low state in the
Sleep state (PD* = L). When the PD* signal is switched to a
High state the DC lines are pulsed. Next the DC lines are
LM4308
20189606
FIGURE 7. Serial Bus Power Down Timing
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10
20189663
FIGURE 8. WRITE Transaction
will be transmitted on the DD signal. Since it takes 14 DC
cycles to send the serial word, a maximum load rate on the
Master input should be slower than this (16 DC cycles or
longer). This is T3 in Figure 9.
The Slave output timing is shown in the bottom of Figure 9.
Note that the SLV output timing is different than the MST input
timing, however the same information is conveyed. T5 is the
latency delay of the Slave and also the serial payload length.
Once the start bit is received, it will take this long for the SLV
output to update. First, the Data[0:17], AD and CS* bits will
update as required. One DC cycle later the WRITE signal will
transition Low for 12 DC cycles. Then the WRITE signal will
transition High and the Display will latch the data. There is a
minimum hold time of one DC cycle (T9). This hold time can
(will) be longer as the outputs hold their last state until the next
transition is received. Also note that the CS1* and CS2* signals also hold their last state until they need to change. This
would occur if a transaction is received for the other CS* signal, or if the Slave enters Power Down (PD*=L).
WRITE TRANSACTION
The WRITE transaction consists of 14 DC cycles to send the
control, data and CRC information on the DD signal. This includes the Start Bit, AD, R/W*, CS12, D[0:17], CRC bits C[0:4]
and a reserved bit (High). See Figure 8. The data payload is
sent least significant bit (LSB) first. The CS1/2 bit denotes
which Chipset pin was active. CS1/2 = HIGH designates that
CS1* is active (Low). CS1/2 = LOW designates that CS2* is
active (Low). CS1* and CS2* Low is not allowed. The AD carries the information on the AD input signal. The R/W* will be
Low for a Write transaction.
Figure 9 illustrates a WRITE transaction showing Master Input, SLVS, and Slave output timing. Table 2 lists the WRITE
timing parameters.
On the Master input, an i80 style WRITE is shown. The
ChipSelect (CS1* or CS2*) is Low. The WR* goes Low, and
Data and AD signals are sampled on the rising edge of the
WR* signal. A tight set and hold window is required as shown
by T1 and T2. A Latency delay later (T4) the SLVS start bit
11
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LM4308
other fixed I/O port application. Both WRITE and READ transactions are supported. READs require a dual access on the
Master to complete the operation.
I80 CPU INTERFACE COMPATIBILITY
The CPU Interface mode provides compatibility between an
i80 CPU Interface and a small form factor (SFF) Display or
LM4308
20189610
FIGURE 9. WRITE Waveforms
TABLE 2. i80 CPU WRITE Interface Parameters
No.
Parameter
Min
T1
MasterIN
Data and address Setup Time before Low-High Edge
5
T2
MasterIN
Data and address Hold after Low-High Edge
5
T3
MasterIN
Bus Cycle Rate
T4
Master
T5
Slave
Typ
Max
Units
ns
ns
16
DC Cycles
Master Latency
7
DC Cycles
Slave Latency
15
DC Cycles
T6
SlaveOUT Data Valid before WR* High-Low
1
DC Cycles
T7
SlaveOUT WR* Low Pulse Width
12
DC Cycles
T8
SlaveOUT Data Valid before WR* Low-High,
13
DC Cycles
T9
SlaveOUT Data Valid after WR* Low-High
1
DC Cycles
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12
20189674
FIGURE 10. READ Transaction
The READ transaction requires a dual cycle on the Master
input to complete. Once the first READ is done (RDCycle1)
the serial link is busy until the second READ (RDCycle2) is
done. The Host may do transactions to other devices between
the READs, just not to CS1* or CS2*. On the first READ, the
CS1* or CS2* line is driven low and the RD* pulses low. A
fixed Data Word of all Lows is returned and should be ignored
by the Host. The requested data will be available at the Master
after 480 DC cycles. The second READ should now be done
to collect the requested data. Upon the READ from the host,
the Master will turn ON its 18 data drivers and output the data
to the Host and then turn them off.
When the READ is received, the Data output buffers turn off
to avoid contention. After 140 DC cycles the RD* signal
switches Low. It then switches High after another 62 DC cycles and latches in the Data from the Display. The CRC is then
calculated and sent to the Master. To avoid floating the inputs
to the Display, the Slave data outputs are turned back on.
13
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LM4308
DD lines are a stable High state and that the High-to-Low
transition of the "Start" bit is seen by the Master.
The third section consists of the transfer of the read data from
the Slave to the Master. Therefore the back channel data signaling rate is ¼ of the forward channel (Master-to-Slave direction). When the Slave transmits data back to the Master,
it drives the DD line Low to indicate start of read data, followed
by the actual read data and CRC payload.
The fourth and final section (TA") occurs after the read data
has been transferred from the Slave to the Master. In the
fourth section the DD line is again turned around, such that
the Master becomes the transmitter and the Slave becomes
the receiver. The Slave drives the DD line High for 1 bit and
then turns off. The DD lines are OFF momentarily to avoid
driver contention. The Master then drives the DD line High for
1 bit time and then idles the bus until the next transaction is
sent (WRITE or another READ).
READ TRANSACTION
The READ transaction is similar to the WRITE but longer. The
full serial READ transaction is shown in Figure 10 . CRC bits
protect both the READ command sent from the Master to the
Slave (C[0:4] bits), and also the Data sent back from the Slave
to the Master (RC[0:4] bits). The READ transaction consists
of four sections.
In the first section the Master sends a READ Command to the
Slave. This command is the same as a WRITE, but the R/W
serial bit is set High and the data payload is ignored. The CRC
bits are used to ensure that the transaction is valid and prevents a false READ from being entered. The Control Input
"Write Only - WO" on the Slave must be set to WRITE & READ
mode (Low) to support READ transactions.
In the second section (TA') the DD line is turned around, such
that the Master becomes the DD Receiver and Slave becomes the DD Line Driver. The Slave will drive the DD line
High after a fixed number of DC cycles. This ensures that the
LM4308
20189671
FIGURE 11. Master Input READ Timing
20189673
FIGURE 12. Slave Output READ Timing
TABLE 3. i80 CPU READ Interface Parameters
No.
Parameter
Min
T1
MasterOUT Data and address valid after RD* High-to-Low
T2
MasterOUT Data and address valid after RD* Low-to-High
Typ
Max
Units
15
ns
0
ns
T3
MasterIN
Delay Time Between READs
500
ns
T4
MasterIN
Delay Time Until Data Available (RDcyc2)
480
ns
T5
Master
Master Latency
7
DC Cycles
T5a
Slave
Slave Latency, (not shown)
158
DC Cycles
T6
Slave
AD Set Time before RD* High-to-Low
140
DC Cycles
T7
Slave
RD* Pulse Low Width
62
DC Cycles
T8
Slave
Data Set Time
7
DC Cycles
T9
Slave
Data Hold Time
0
ns
T10
Slave
Slave Data Outputs
8
DC Cycles
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14
20189614
FIGURE 13. Timing Example - Two WRITEs to CS1*
15
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LM4308
TA, AD, and CS signals hold their last state until the next
transaction is received. This effectively extends the Hold time
after Word N’s WRITE rise. The length of this period (idle) is
determined by the time until the next transaction on the Master input. When the second write is received (Word N+1) the
Data, AD, and CS signals update as needed. Note that the
active CS signal stay low until a transaction to the other CS
is received or the Slave is put into powerdown.
SLAVE OUTPUT TIMING / DISPLAY COMPATIBILITY
Compatibility of target device’s timing requirements should be
checked. Check that the Slave WR* active low pulse is wide
enough for the target display(s). If the Slave output is too fast,
a slower DC rate should be chosen (PLL setting or CLK rate
may be adjusted). See SYSTEM CONSIDERATION section
also.
Figure 13 illustrates the timing of two writes being sent to
CS1*. Note that on the Slave output for Word N, that the DA-
LM4308
CRC provides a better coverage than a parity bit, which can
only flag one half of the possible errors. The CRC is calculated
by taking the payload and adding 5 zeros and then dividing
by a fixed number. The remainder of the calculation is the 5bit CRC field that is transmitted.
If a CRC error handling is shown in the table below. See also
Figure 14.
CYCLIC REDUNDANCY CHECK (CRC)
The CRC is used to detect errors in both WRITE and READ
transactions on the serial link. The LM4308 uses a 5-bit CRC
field to detect errors in the 22-bit payload. The Transmitting
device calculates the CRC and appends it to the payload. The
Receiver also calculates the CRC and compares it to the received CRC. If they are the same, the transmission is error
free. If they are different, the ERR pin then flags the error.
CRC Error Response
Operation
Direction
Error
Response
Write
Master-to-Slave
CRC error
Slave Flags, ERR pins remains High until
PD* cycle or Power cycle, Data is written
to the display
Read
Command
Master-to-Slave
CRC error
Slave Flags, ERR pins remains High until
PD* cycle or Power cycle, Slave does
nothing
Write
Master-to-Slave,
Slave WO = H
CRC error, Serial R/W* bit
error
(False Read)
Slave Flags, ERR pins remains High until
PD* cycle or Power cycle, Data is written
to the display (write expected)
Read Data
Slave-to-Master
CRC error
Master Flags, ERR goes High, then Low
after 2nd READ, Data = X
Read Data
Slave-to-Master
Read Data not received by
Master
Master times out, drives all Low data,
then on 2nd READ cycle ERR goes High
20189675
1 = CS1* active which is a High, and 2 = CS2* active which is a Low
FIGURE 14. CRC - ERR Output Timing
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16
20189658
FIGURE 15. Single-ended and differential SLVS waveforms
Noise that gets coupled onto both signals, is common-mode
and is rejected by the receiver. Route the traces that form the
pair together (coupled) to help ensure that noise picked up is
common. Differential noise that causes a dip in the signal but
does not enter the threshold region is also rejected. Differntial
noise margin is the minimum VOD signal minus the MAX
threshold voltage. 140mV - 70mV = 70mV minimum differential noise margin.
20189659
FIGURE 16. SLVS common-mode rejection waveform
17
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LM4308
receiver to recover. The receiver detects the differential signal
and converts it to a LVCMOS signal. Noise picked up along
the inteconnect is seen as common-mode by the receiver and
rejected. The low output impedance of the line driver and of
the termination network help to minimize couple noise also.
SLVS INTERFACE
Scalable Low Voltage Signaling is the differential interface
used for the physical layer of the serial (Data and Clock) signals. The differential signal is a 200mV (typ) swing with a
200mV offset from ground. This generates a ±200mV
(400mVpp) across the integrated termination resistor for the
LM4308
For example, if the input clock is 19.2MHz, and a 8X multiplier
is selected, DC will be 153.6 MHz. and the DD line rate is
307.2 Mbps (raw bandwidth).
LM4308 Features and Operation
POWER SUPPLIES
The VDD and VDDA (MPL-2 and PLL) must be connected to
the same potential between 1.6V and 2.0V. VDDIO powers the
logic interface and may be powered between 1.6 and 3.0V to
be compatible with a wide range of host and target devices.
POWER DOWN OUTPUT STATES
When the device is in the SLEEP state (PD*=L) the output
pins will be driven to the states shown in the table below.
BYPASS RECOMMENDATIONS
Bypass capacitors should be placed near the power supply
pins of the device. Use high frequency ceramic (surface
mount recommended) 0.1 µF capacitors. A 2.2 to 4.7 µF Tantalum capacitor is recommended near the Master VDDA pin for
PLL bypass. Connect bypass capacitors with wide traces and
use dual or larger vias to reduce resistance and inductance
of the feeds. Utilizing a thin spacing between power and
ground planes will provide good high frequency bypass above
the frequency range where most typical surface mount capacitors are less effective. To gain the maximum benefit from
this, low inductance feed points are important. Also, adjacent
signal layers can be filled to create additional capacitance.
Minimize loops in the ground returns also for improved signal
fidelity and lowest emissions.
LVCMOS MASTER INPUT PINS
CPU Interface input pins (Data, AD, CS, WR, RD) accept
voltages from -300mV to (VDDIO + 300mV). Inputs are not
High-Z with power supplies OFF. If communication between
the Host (i.e. BBP) and other devices (i.e. Memory) is required
when the display is not ON; the power to the Master must be
ON, and the Master should be in SLEEP mode (by CLK Stop
or PD*=L). In this condition, Master inputs are High Z and will
not load (or clamp) the shared bus signals. Master inputs are
not in a High Z state when Master VDDIO = 0V.
MASTER CLOCK INPUT
The Master Clock input is a special 3.3V Tolerant input pin.
This allows the clock tree to be powered from a different
VDDIO than the CPU interface from the host device.
PLLCON0
Multiplier
0
8
9.6 to 30 MHz
0
1
10
9.6 to 24 MHz
1
0
12
9.6 to 20 MHz
1
1
Reserved
Slave
Data[17:0]
Low
Slave
CS1*, CS2*, WR*,
RD*, AD
High
Slave
ERR
Low
Master
ERR
Low
SLAVE OUTPUT DRIVE STRENGTH CONTROL
The Slave Outputs have two drive strength options to support
a wide range of VDDIO operation. See RDS[1:0] - Receiver
Output Drive Strength. If the SLV VDDIO is 1.8V TYP, RDS0
and RDS1 should be set to a logic High. Depending upon application speed, RDS0 can be set to a logic Low to soften the
edge rate on the Data signals for less noise. For high VDDIO
operation (i.e. 2.8V), both RDS0 and RDS1 should be set to
a logic Low.
CLK Range
Reserved
SLAVE WRITE ONLY MODE
In some applications, only WRITE operations may be required. In this case, the Slave can be configured to only
support WRITE transactions by setting the WO configuration
input High.
PHASE-LOCKED LOOP
When the LM4308 is configured as a Master, a PLL is enabled
to generate the serial link clock. The Phase-locked loop system generates the serial data clock at several multiples of the
input clock. The DC rate is limited to 240 MHz. The PLL multiplier is set via the PLLCON[1:0] pins. Multipliers of 8X, 10X
and 12X are available.
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State in Power Down
SLEEP MODE OPTIONS
The Master can enter sleep mode by three options. The PD*
pin is driven low, the clock input is stopped, or if the power
supplies are turned off.
The simplest option is a control signal to drive the PD* input.
When PD* input is driven low, the device enters a sleep mode
and supply current is minimized. This mode also supports
high-Z Master LVCMOS inputs. The second option is with
Power ON, PD* = H, and the CLK input is stopped. The CLK
stop state is recommend to be logic Low. The Master detects
this state and enters the sleep state. The third option is to cut
power to the device. In this configuration the LVCMOS inputs
are not High-Z due to internal diodes for ESD protection.
There are also three options for the Slave to enter the sleep
state. These are: based on the MPL-2 interface, the Slave
PD* input pin, and by powering off the Slave device.
With power ON, and the Slave PD* input = H, the Slave detects the state on the MPL-2 bus and powers up or enters
sleep mode. Direct control of the Slave is also possible by the
use of its PD* input pin (relative to the Slave’s VDDIO levels).
The third option is to turn off power to the Slave. In this configuration, do not enable and activate the Master outputs
without the Slave also being ON.
UNUSED/OPEN LVCMOS PINS
Unused inputs must be tied to the proper input level — do not
float them. Unused outputs should be left open to minimize
power dissipation.
0
Signal
SLAVE
Upon application of power to the SLV device, all outputs are
turned on and held in their de-asserted states.
MASTER
Upon application of power to the MST device, the ERR output
is ON, and is logic low (normal mode).
MASTER / SLAVE CONFIGURATION
The LM4308 device can be configured to be a Master or a
Slave with the M/S* pin. For normal modes, TM (Test Mode)
input must also be Low, setting TM High enters a factory test
mode.
PLLCON1
Device
18
SYSTEM CONSIDERATIONS
DUAL SMART DISPLAY APPLICATION
A Dual Smart Display application is shown in Figure 17. The
Master (MST) resides by the host and connects to a Memory
Interface. VDDIO on the MST is set to be the same as the Host’s
port. i80 CPU Bus signals are connected as shown (Data, AD,
WR*, RD*, and CS* signals). The Master also has a SLEEP
mode to save power when the display is not required. The
Sleep state is entered when the PD* signal is driven Low. It
is also entered if the PD* signal is High and the CLK input is
gated off (held at a static state). In the Sleep state, supply
current into the Master is >1µA typical. In this state, (Power
ON, and Sleep state), the Master inputs will not load the
20189676
FIGURE 17. Dual SMART Display Application
The Slave recovers the serial signals and generates the parallel bus for the Display(s). The Slave VDDIO is set to be
compatible with the Displays employed. The Data bus signals
are bidirectional to support both WRITEs and READs. The
other signals. AD, WR*, RD*, and CS* signals are outputs
only. The connection between the Slave device and the displays should be done such that long stubs are avoided. Extra
care should be taken on the WR* and RD* signal layouts as
these signals rely on the signal edges to latch the data. The
Slave has user adjustable edge rate controls for the parallel
bus outputs. This can be used to optimize the edge rate vs
the required VDDIO magnitude. Also, independent control of
the strobe (WR* and RD*) is supported. This allows for the
strobe signal to retain sharp edges, while using softer edges
on the wide parallel data bus signals. This aids in noise reduction. The Slave also provides a ERR pin to flag any CRC
errors detected. This signal maybe routed back to the host for
monitoring, or bought out to a test point. The Slave supports
a WRITE ONLY mode (READ operation and serial bus turn
around is prevented). This mode is obtained by setting the
WO pin to a logic High. The Sleep state of the display may be
entered by driving the PD* signal to a logic Low. Outputs are
then set to their Power Down de-asserted states. Several
configuration pins are also required to be set. For a Slave, tie
M/S* = L, TM = L, and WO and RDS[1:0] to the desired setting.
If only one display is required in the application, the unused
CS output signal should be left un-connected.
In this application, WRITEs and READs for the Displays are
serialized and sent to the displays. Transaction to other devices on the shared bus (MST input) are ignored by the
Master.
19
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LM4308
shared bus, and communication between the host and other
devices may occur. If power is OFF (VDDIO = 0V), Master input
ESD diodes will clamp the bus, preventing communication on
the bus. The Master requires a system clock reference which
is typically 19.2MHz in CDMA applications. This signal is used
to generate the serial DC clock. The CLK input is multiplied
by the selected PLL multiplier to determine the serial clock
rate. In the 19.2MHz CLK and 8X application, the DC rate will
be 153.6MHz. Due to the serial transmission scheme using
both clock edges, the raw bandwidth of a WRITE is 307.3
Mbps. The Master also provides a ERR pin that reports a CRC
error on a READ transaction. The host may monitor this signal
if desired, or it may be brought out to a test point only. Several
configuration pins are also required to be set. For a Master,
tie M/S* = H, TM = L, and PLLCON[1:0] to the desired setting.
Application Information
LM4308
on the PLL Multiplier setting and also the input clock frequency. For example, a 19.2 MHz input CLK and a 8X PLLCON
[1:0] setting yields a DC frequency of 153.6 MHz. Thus it takes
∼100 ns to send the word in serial form. To allow some idle
time between transmissions (this will force a bit sync per word
if the gap is long enough in between), the load rate on the
Master input should not be faster than 16 DC cycles, or every
105 ns (9.6 MT/s) in our example to support a data pipe line.
This is sometimes referred to as the bus cycle time (time between commands). Thus the time between WRITEs on the
Master Input MUST NOT be faster than 105 ns, otherwise the
FIFO will overflow and data will be lost.
The Slave output WR* and RD* timing is a function of DC
cycles alone. The width of the WR* pulse low is TWELVE DC
cycles regardless of the pulse width applied to the Master
input. In the 19.2MHz & 8X application, the WR* pulse low will
be 78 ns. System designers need to check compatibility with
the display driver to ensure that this pulse width meets its requirement. If it is too fast, select a lower PLL Multiplier or apply
a slower input clock.
PCB LAYOUT – SERIAL SIGNALS
The LM4308 provides a swap function of SLVS DD and DC
lines depending upon the state of the M/S* pin. This facilitates
a straight through via-less SLVS interface design eliminating
the needs for via and crossovers as shown on Figure 18. It is
recommended to use separate logic symbols for the Master
and the Slave to avoid layout errors. NOTE THAT THE
PINOUT IS DIFFERENT FOR A MASTER AND SLAVE
CONFIGURED DEVICE.
SYSTEM TIMING CONSIDERATIONS
When employing the SERDES chipset in place of a parallel
bus, a few system considerations must be taken into account.
Before sending commands (i.e. initialization commands) to
the display, the SERDES must be ready to transmit data
across the link. The serial link must be powered up, and the
PLL must be locked. Also, a review of the Slave output timing
should be completed to insure that the timing parameters
provided by the Slave output meet the requirements of the
LCD driver input. Specifically, pulse width on WR* and RD*,
data valid time, and bus cycle rate should be reviewed and
checked for display compatibility. Additional details are provided next:
The serial link should be started up as follows: The chipset
should be powered. During power up, the PD* inputs should
be held Low and released once power is stable and within
specification and link transmission is desired.
Before data can be sent across the serial link, the link must
be ready for transmission. The CLK needs to be applied to
the MST, and the PLL locked. This is controlled by a keep-off
counter set for 1024 CLK cycles. After the PLL has locked and
the counter expired, transmission may now occur. For a
19.2MHz application is is less than 54µs delay. If a WRITE is
done to the display during this time, it will be lost and the display may not be properly configured. Ensure that the FIRST
WRITE to the display is done AFTER the link is ready for
transmission.
It takes 14 DC Cycles to send a 18-bit CPU Write including
the serial overhead. The DC cycle time is calculated based
20189664
FIGURE 18. SLVS Interface Layout
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20
Do not use vias in clock transmission lines, as vias can
cause impedance change and reflection.
SLVS Signals:
• Floor plan, locate Master near the connector to limit
chance of cross talk to high speed serial signals.
• Use differential routing techniques. (i.e., match the lengths
as well as the turns that each trace goes through)
• Keep the length of the two differential traces the same to
minimize the skew and phase difference.
• Route serial traces together, minimize the number of layer
changes to reduce loading.
• Use ground lines are guards to minimize any noise
coupling (guarantees distance).
• Avoid using multiple vias to reduce impedance mismatch
and inductance.
• Use a GSSGSSG pinout in connectors (Board to Board or
ZIF).
• Bypass the device with MLC surface mount devices and
thinly separated power and ground planes with low
inductance feeds.
• High current returns should have a separate path with a
width proportional to the amount of current carried to
minimize any resulting IR effects.
• Slave device - follow similar guidelines.
• see AN-1126 (BGA) and AN-1187 (LLP) also
LVCOMS Signals:
• To reduce EMI, avoid parallel runs with fast edge, large
LVCMOS swings.
• To reduce crosstalk allow enough space between traces.
It is recommended to distance the centers of two adjacent
traces at least four times the trace width. To improve
design performance, lower the distance between the trace
and the ground plane to under ~ 10 mils.
• Keep clock trace as straight as possible. Use arc-shaped
traces as an alternative to the right-angle bends.
• Do not use multiple signal layers for clock signals.
21
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LM4308
•
FLEX CIRCUIT RECOMMENDATIONS
A differential 100 Ohm transmission path will yield the best
results and be matched to the integrated differential termination resistance. Also, the interconnect should employ a coupled lines to ensure that the majority of any noise pick up is
common-(equal on both the P and N signals) so that it is rejected by the differential receiver. A GSSGSSG pinout is
recommended. Depending on external noise sources, shielding maybe required.
GROUNDING
Even though the serial Data and Clock signals are differential,
a common ground signal is still required. This provides a
common ground reference between the devices and a current
return path for the common mode current.
GENERAL GUIDELINES and RECOMMENDATIONS FOR
PCB DESIGN
LM4308
Connection Diagram microArray Package
20189619
TOP VIEW
(not to scale)
Note that the pinout of a MASTER configured device is DIFFERENT than a SLAVE configured device. The use of two
logic symbols for PCB schematic is recommended.
CPU Master Pinout
MST
1
2
3
4
5
6
7
A
AD
CS1*
PD*
DCP_M
DCN_M
DDN_M
DDP_M
B
CLK
TM
M/S*
VSSA
VDDA
PLLCON0
PLLCON1
C
WR*
CS2*
VSSIO
VSSIO
VSSIO
ERR
D17
D
VDDIO
RD*
VSSIO
VSSIO
VSSIO
D16
VDDIO
E
D0
D1
VSSIO
VSSIO
VSSIO
D14
D15
F
D2
D3
D6
VSS
D9
D11
D13
G
D4
D5
D7
VDD
D8
D10
D12
CPU Slave Pinout
SLV
1
2
3
4
5
6
7
A
AD
CS1*
PD*
DDP_S
DDN_S
DCN_S
DCP_S
B
WO
TM
M/S*
VSSA
VDDA
RDS0
RDS1
C
WR*
CS2*
VSSIO
VSSIO
VSSIO
ERR
D17
D
VDDIO
RD*
VSSIO
VSSIO
VSSIO
D16
VDDIO
E
D0
D1
VSSIO
VSSIO
VSSIO
D14
D15
F
D2
D3
D6
VSS
D9
D11
D13
G
D4
D5
D7
VDD
D8
D10
D12
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22
LM4308
Connection Diagram - LLP Package
20189652
TOP VIEW — (not to scale)
Note that the pinout of a MASTER configured device is DIFFERENT than a SLAVE configured device. The use of two logic symbols
for PCB schematic is recommended.
TABLE 4. CPU Master - Slave Pad Assignments
Pin #
Master
1
2
Slave
Pad #
AD
CLK
WO
Master
Slave
21
D12
22
D13
3
CS2*
23
D14
4
WR*
24
D15
5
RD*
25
D16
6
VDDIO
26
VDDIO
7
D0
27
D17
8
D1
28
ERR
9
D2
29
PLLCON1
10
D3
30
PLLCON0
RDS1
RDS0
11
D4
31
DDP_M
DCP_S
12
D5
32
DDN_M
DCN_S
13
D6
33
14
D7
34
15
NC
35
16
VDD
36
17
D8
37
PD*
18
D9
38
M/S*
19
D10
39
CS1*
VDDA
DCN_M
DDN_S
VSSA
DCP_M
DDP_S
20
D11
40
TM
DAP
VSSIO / VSS
DAP
VSSIO / VSS
23
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LM4308
Physical Dimensions inches (millimeters) unless otherwise noted
49L MicroArray, 0.5mm pitch
Order Number LM4308GR
NS Package Number GRA49A
40L LLP, 0.4mm pitch
Order Number LM4308SQ
NS Package Number SQF40A
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24
LM4308
Notes
25
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LM4308 Mobile Pixel Link Two (MPL-2) – 18-bit CPU Display Interface Master/Slave
Notes
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
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