GULFSEMI BY448GP

BY448GP
SINTERED GLASS JUNCTION
PLASTIC RECTIFIER
VOLTAGE:1500V
CURRENT: 2.0A
FEATURE
DO-15/DO-204AC
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.1µA
MECHANICAL DATA
Terminal:Plated axial leads solderable per
MIL-STD 202E, method 208C
Case:Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity:color band denotes cathode
Mounting position:any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated,
for capacitive load, derate current by 20%)
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
Half sine-wave superimposed on rated load
Maximum Instantaneous Forward Voltage
at 3.0A
Maximum full load reverse current full cycle
Average at 55°C
Maximum DC Reverse Current
at rated DC blocking voltage
Typical Reverse Recovery Time
Typical Thermal Resistance
Ta =25°C
Ta =150°C
(Note 1)
(Note 2)
Storage and Operating Junction Temperature
SYMBOL
BY448GP
units
Vrrm
Vrms
Vdc
1650
1150
1650
V
V
V
If(av)
2.0
A
Ifsm
30.0
A
Vf
1.60
V
Ir(av)
100.0
µA
Ir
5.0
150.0
Trr
Rth(ja)
1000
100
µA
µA
nS
K/W
Tstg, Tj
-65 to +175
°C
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Thermal Resistance from Junction to Ambient on PC board with spacing 25mm
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES BY448GP
1
1
Rev.A1
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