HMC283LM1 v04.1201 LINEAR & POWER AMPLIFIERS - SMT 6 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Typical Applications Features The HMC283LM1 is ideal for: SMT mmWave Package • Millimeterwave Point-to-Point Radios Psat Output Power: +21 dBm • LMDS High Gain: 21 dB • SATCOM No External Matching Required Functional Diagram General Description The HMC283LM1 is a Medium Power Amplifier (MPA) in a SMT leadless chip carrier package covering 17 to 40 GHz. The LM1 is a true surface mount broadband millimeterwave package offering low loss & excellent I/O match preserving MMIC chip performance. Utilizing a GaAs PHEMT process, the device offers 20 dB gain and +21 dBm ouput power from a bias supply of +3.5V @ 300mA. As an alternative to chipand-wire hybrid assemblies the HMC283LM1 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. The amplifier may be used as a frequency doubler. A built-in-test pad (Vdet) allows monitoring of microwave output power. All data is with the non-hermetic, epoxy sealed LM1 packaged MPA device mounted in a 50 ohm test fixture. Electrical Specifi cations, TA = +25° C, Vdd= +3.5V*, ldd = 300 mA Parameter Min. Frequency Range Gain Typ. Max. Min. 17 - 40 15 Gain Variation over Temperature 20 0.05 Typ. Max. 21 - 30 17 0.07 GHz 22 0.05 dB 0.07 dB/°C Input Return Loss 6 10 6 12 Output Return Loss 4 7 4 8 dB Reverse Isolation 30 40 35 45 dB Output Power for 1 dB Compression (P1dB) 14 18 14 18 dBm Saturated Output Power (Psat) 17 21 17 21 dBm Output Third Order Intercept (IP3) 22 27 21 27 dBm 10 dB Noise Figure 10 Supply Current (Idd) 300 330 300 dB 330 *Vdd = +3.5V, adjust Vgg = Vgg1, Vgg2 between -2.0 to +0.4V to achieve Idd = 300 mA typical. 6-2 Units For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com mA HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Broadband Gain & Return Loss Gain vs. Temperature 30 30 25 25 15 5 6 20 S11 S21 S22 0 -5 15 +25 C +85 C -40 C 10 -10 -15 5 -20 -25 0 10 15 20 25 30 35 16 40 18 20 22 FREQUENCY (GHz) 32 34 36 38 40 42 Input Return Loss vs. Temperature 0 0 -10 -5 RETURN LOSS (dB) REVERSE ISOLATION (dB) 30 FREQUENCY (GHz) Reverse Isolation vs. Temperature +25 C +85 C -40 C -20 -30 -40 -10 -15 +25 C +85 C -40 C -20 -50 -25 -60 16 18 20 22 24 26 28 30 32 34 36 38 40 16 42 18 20 22 24 26 28 30 32 34 36 38 40 42 FREQUENCY (GHz) FREQUENCY (GHz) P1dB and Psat @ 25 °C Output Return Loss vs. Temperature 0 25 23 Psat RETURN LOSS (dB) OUTPUT P1dB & Psat (dBm) 24 26 28 LINEAR & POWER AMPLIFIERS - SMT 10 GAIN (dB) RESPONSE (dB) 20 21 19 17 P1dB -5 -10 +25 C +85 C -40 C -15 15 -20 13 16 18 20 22 24 26 28 30 32 FREQUENCY (GHz) 34 36 38 40 16 18 20 22 24 26 28 30 32 34 36 38 40 42 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6-3 HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Power Compression @ 20 GHz P1dB vs. Temperature 24 Pout (dBm), GAIN (dB), PAE (%) 25 +25 C -40 C +85 C 21 19 17 15 13 16 20 24 28 32 36 20 16 12 8 0 -10 40 Pout Gain PAE 4 -8 -6 -4 FREQUENCY (GHz) -2 0 2 4 6 10 Power Compression @ 28 GHz 24 Pout (dBm), GAIN (dB), PAE (%) 25 23 21 19 17 +25 C -55 C +85 C 15 13 16 18 20 22 24 26 28 30 32 34 36 38 20 16 12 8 Pout Gain PAE 4 0 -10 40 -8 -6 -4 FREQUENCY (GHz) 0 2 4 6 8 10 6 8 10 Power Compression @ 39 GHz Output IP3 vs. Temperature 24 20 28 38 -40 °C 29.0 28.0 31.0 +25 °C 28.5 27.5 28.5 +85 °C 27.5 26.0 24.5 Pout (dBm), GAIN (dB), PAE (%) Temperature All levels in dBm -2 INPUT POWER (dBm) Frequency (GHz) 20 16 12 Pout Gain PAE 8 4 0 -10 -8 -6 -4 -2 0 2 4 INPUT POWER (dBm) 6-4 8 INPUT POWER (dBm) Psat vs. Temperature Psat (dBm) LINEAR & POWER AMPLIFIERS - SMT 6 OUTPUT P1dB (dBm) 23 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Absolute Maximum Ratings +5Vdc Drain Bias Current (Idd) 400 mA Gate Bias Voltage (Vgg1, Vgg2) -2.0 to +0.4 Vdc Gate Bias Current (Igg) 4.0 mA RF Input Power (RFIN)(Vdd = +3.5 Vdc) +8 dBm Channel Temperature 175 °C Continuous Pdiss (T = 85 °C) (derate 16 mW/°C above 85 °C) 1.44 W Thermal Resistance (channel to ground paddle) 62.5 °C/W Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C 6 LINEAR & POWER AMPLIFIERS - SMT Drain Bias Voltage (Vdd) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Pin Function 1 GND 2 Vdd 2. PLATING: GOLD OVER NICKEL 3 GND 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4 RF OUT 5 VDET 6 Vgg2 7 Vgg1 8 RF IN NOTES: 1. MATERIAL: PLASTIC 4. ALL TOLERANCES ARE ± 0.005 [± 0.13]. 5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND. 6. • INDICATES PIN 1 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6-5 HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Evaluation PCB LINEAR & POWER AMPLIFIERS - SMT 6 LM1 Evaluation PCB The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground (GSG) probes for testing. Suggested probe pitch is 400um (16 mils). Alternatively, the board can be mounted in a metal housing with 2.4 mm coaxial connectors. Evaluation Circuit Board Layout Design Details Layout Technique Micro Strip to CPWG Material Rogers 4003 with 1/2 oz. Cu Dielectric Thickness 0.008” (0.20 mm) Microstrip Line Width 0.018” (0.46 mm) CPWG Line Width 0.016” (0.41 mm) CPWG Line to GND Gap 0.005” (0.13 mm) Ground Via Hole Diameter 0.008” (0.20 mm) C1 100 pF Capacitor, 0402 Pkg. C2 33,000 pF Capacitor, 1206 Pkg. R1 1,000 Ohm Resistor, 0402 Pkg. R2 100 Ohm Resistor, 0402 Pkg. LM1 Package Mounted to Evaluation PCB 6-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Suggested LM1 PCB Land Pattern Tolerance: ± 0.003” (± 0.08 mm) LINEAR & POWER AMPLIFIERS - SMT 6 Amplifi er Application Circuit Recommended Component Values C1 100 pF C2 33,000 pF R1 1,000 Ohm R2 100 Ohm Note: Vgg1 and Vgg2 may be connected to a common Vgg feed. For optimal stable operation, it is recommended that a voltage divider network be employed as shown above with Vgg set to achieve ldd = 300 mA typical. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6-7 HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Recommended SMT Attachment Technique Preparation & Handling of the LM1 Millimeterwave Package for Surface Mounting LINEAR & POWER AMPLIFIERS - SMT 0 TEMPERATURE ( C) 6 The HMC LM1 package was designed to be compatible with high volume surface mount PCB assembly processes. The LM1 package requires a specific mounting pattern to 225 allow proper mechanical attachment and to optimize electrical 200 performance at millimeterwave frequencies. The PCB layout 175 pattern can be found on each LM1 product data sheet. It can also be provided as an electronic drawing upon request from 150 Hittite Sales & Application Engineering. 125 Follow these precautions to avoid permanent damage: Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. LM1 devices should remain in their original packaging until component placement to ensure no contamination or damage to RF, DC & ground contact areas. 100 75 50 25 0 1 2 3 4 5 6 7 8 TIME (min) Static Sensitivity: Follow ESD precautions to protect against Recommended solder reflow profile ESD strikes. for HMC LM1 SMT package General Handling: Handle the LM1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoid damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid. Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is not recommended. Conductive epoxy attachment is not recommended. Solder Paste Solder paste should be selected based on the user’s experience and should be compatible with the metallization systems used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes. Solder Paste Application Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies. Solder Reflow The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder reflow profile is suggested above. Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies. The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the location of the device. Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off. The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand a peak temperature of 2350C for 15 seconds. Verify that the profile will not expose the device to temperatures in excess of 2350C. Cleaning A water-based flux wash may be used. 6-8 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC283LM1 v04.1201 SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz Alternate Applications: Frequency Multiplier Performance 5 6 2 -1 -4 10 dBm 15 dBm 18 dBm -7 -10 10 15 20 25 30 35 40 OUTPUT FREQUENCY (GHz) Voltage Detector, Built-In-Test (B.I.T.) 1.6 2 1.4 1.8 DETECTED VOLTAGE INTO 10K RESISTOR (Volts) DETECTED VOLTAGE INTO 10K RESISTOR (Volts) By connecting the Vdet port to a 10k Ohm resistor and monitoring the voltage, a B.I.T. circuit can be created to monitor changes in the device output power. This circuit is extremely well compensated for temperature variations as shown in the first plot. The detected voltage does change with frequency and the second plot shows its variation. 1.2 1 0.8 0.6 0.4 -55 C +85 C 0.2 1.6 18 GHz 22 GHz 28 GHz 38 GHz 1.4 1.2 LINEAR & POWER AMPLIFIERS - SMT CONVERSION LOSS (dB) HMC283LM1 can also perform as a frequency multiplier. This is accomplished by biasing Vg1 into its pinchoff region - typically -1V to -2V. By adjusting the Vg1 bias, the device will operate as a doubler or tripler. Vg2 may also be adjusted to minimize the levels of unwanted harmonics. The plot shows the performance of HMC283 operated as a doubler with Vg1 = -1V and the remaining gate voltages (Vg2, 3, 4) set to -0.15V. In this condition the amplifier draws 310mA at 3.5V drain bias (Vdd) and provides +5dB to -5dB conversion loss dependent upon the output frequency. 1 0.8 0.6 0.4 0.2 +25 C 0 0 10 12 14 16 18 OUTPUT POWER (dBm) 20 22 10 12 14 16 18 20 22 OUTPUT POWER (dBm) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 6-9