TI CD4009UBPWRE4

Data sheet acquired from Harris Semiconductor
SCHS020C − Revised October 2003
The CD4009UB and CD4010B types are
supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead
dual-in-line plastic packages (E suffix), 16-lead
small-outline packages (M, M96, MT, and NSR
suffixes), and 16-lead thin shink small-outline
packages (PW and PWR suffixes).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
89264UKB3T
OBSOLETE
CFP
WR
16
TBD
Call TI
Call TI
-55 to 125
CD4009UBE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4009UBE
CD4009UBEE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4009UBE
CD4009UBF
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4009UBF
CD4009UBF3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4009UBF3A
CD4009UBM
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4009UBM
CD4009UBME4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4009UBM
CD4009UBMG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4009UBM
CD4009UBMT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4009UBM
CD4009UBMTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4009UBM
CD4009UBMTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4009UBM
CD4009UBPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM009UB
CD4009UBPWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM009UB
CD4009UBPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM009UB
CD4010BE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4010BE
CD4010BEE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4010BE
CD4010BF
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4010BF
CD4010BF3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4010BF3A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CD4010BM
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BM96
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BM96E4
ACTIVE
SOIC
D
16
TBD
Call TI
Call TI
-55 to 125
CD4010BM96G4
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
-55 to 125
CD4010BM
CD4010BME4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BMG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BMT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BMTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BMTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010BM
CD4010BNSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010B
CD4010BNSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010B
CD4010BNSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4010B
CD4010BPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM010B
CD4010BPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM010B
CD4010BPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM010B
CD4010BPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM010B
CD4010BPWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM010B
CD4010BPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM010B
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4009UB, CD4009UB-MIL, CD4010B, CD4010B-MIL :
• Catalog: CD4009UB, CD4010B
• Automotive: CD4010B-Q1, CD4010B-Q1
• Military: CD4009UB-MIL, CD4010B-MIL
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
CD4009UBPWR
TSSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
8.0
12.0
Q1
PW
16
2000
330.0
12.4
6.9
5.6
1.6
W
Pin1
(mm) Quadrant
CD4010BM96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD4010BNSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4010BPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4009UBPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
CD4010BM96
SOIC
D
16
2500
333.2
345.9
28.6
CD4010BNSR
SO
NS
16
2000
367.0
367.0
38.0
CD4010BPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
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