HOLTEK HT66F04M

HT68F03M/HT68F04M/HT66F03M/HT66F04M
1.5V Battery Flash Type
8-Bit MCU with EEPROM & DC-DC Converter
Features
MCU Features
· EEPROM Memory: 64´8
· Operating voltage: 3.0V (typ.)
· Watchdog Timer function
· Power down and wake-up functions to reduce
· Up to 8 bidirectional I/O lines
· External interrupt line shared with I/O pin
power consumption
· Five oscillators:
- External High Speed Xtal
- External 32.768kHz Xtal
- External RC
- Internal High Speed -- no ext. components
- Internal 32kHz -- no ext. components
· Multiple Timer Module for time measure, input
capture, compare match output, PWM output or
single pulse output functions
· Comparator function
· Dual Time-Base functions for generation of fixed
time interrupt signal
· Multi-mode operation: NORMAL, SLOW, IDLE and
· Low voltage reset function
SLEEP
· Low voltage detect function
· Fully integrated internal 4MHz, 8MHz and 12MHz
· Multi-channel 12-bit resolution A/D converter
· All instructions executed in one or two instruction
cycles
DC-DC converter Features
· Table read instructions
· 3.0V ± 2.5% output voltage
· 63 powerful instructions
· 0.7V start-up voltage
· Up to 8 subroutine nesting levels
· Output current up to 100mA
· Bit manipulation instruction
· High efficiency: 85% (typ.) at VOUT=3V
· Flash Program Memory: 1K´14 ~ 2K´15
· RAM Data Memory: 64´8 ~ 96´8
General Description
An extensive choice of oscillator functions is provided
including a fully integrated system oscillator which requires no external components for its implementation.
The ability to operate and switch dynamically between a
range of operating modes using different clock sources
gives users the ability to optimise microcontroller operation and minimise power consumption. The devices also
include flexible I/O programming features Time-Base
functions and a range of other features.
This series of devices are Flash Memory type 8-bit high
performance RISC architecture microcontrollers. Offering users the convenience of Flash Memory
multi-programming features, these devices also include
a wide range of functions and features, among which is
their internal DC-DC Converter allowing low voltage operation. In addition to their Flash Program Memory there
is also area of RAM Data Memory and an area of
EEPROM memory for storage of non-volatile data such
as serial numbers, calibration data etc.
The internal PFM type step-up DC-DC Converter allows
the MCU to be powered from low voltage sources, and
has the advantages of high efficiency and low ripple.
With a fixed and accurate 3.0V output voltage and extremely low 0.7V start-up voltage, these MCU devices
will be especially suitable for battery-powered applications, portable handheld equipment etc.
Analog features include a multi-channel 12-bit A/D converter and comparator functions. Multiple and extremely
flexible Timer Modules provide timing, pulse generation
and PWM generation functions. Protective features
such as an internal Watchdog Timer, Low Voltage Reset
and Low Voltage Detector coupled with excellent noise
immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments.
Rev. 1.10
1
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Selection Table
Most features are common to all devices, the main feature distinguishing them are Memory capacity, A/D Converter,
Timer Module types and stack capacity. The following table summarises the main features of each device.
Part No.
Program
Memory
Data
Memory
Data
EEPROM
I/O
Ext.
Int.
A/D
Timer
Module
Comparator
DC-DC
Converter
Stack
Package
HT68F03M
1K´14
64´8
64´8
8
1
¾
10-bit CTM´1,
10-bit STM´1
1
Ö
4
16NSOP
HT68F04M
2K´15
96´8
64´8
8
1
¾
10-bit CTM´1,
10-bit STM´1
1
Ö
8
16NSOP
HT66F03M
1K´14
64´8
64´8
8
1
12-bit´4
10-bit CTM´1,
10-bit STM´1
1
Ö
4
16NSOP
HT66F04M
2K´15
96´8
64´8
8
1
12-bit´4
10-bit CTM´1,
10-bit ETM´1,
10-bit STM´1
1
Ö
8
16NSOP
Block Diagram
The following block diagram illustrates the dual-chip structure of the devices, where an individual MCU and DC-DC
Converter devices are combined into a single package.
V D D
V O U T
H T 6 6 F 0 x
H T 6 8 F 0 x
H T 7 7 3 0
P A 0 /C + /A N 0
P A 1 /C -/A N 1 /V R E F
P A 2 /C X /[T P 0 ]/A N 2
P A 3 /IN T /T C K 1 /T P 0 /A N 3
P A 4 /T C K 0 /T P 1
L X
C E
P A 5 /[T P 0 ]/O S C 2
P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1
P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S
V S S
G N D
Internal Chip Interconnection Diagram
Note that the HT68F0x devices do not contain VREF or ANx A/D converter pins.
Rev. 1.10
2
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
L o w
V o lta g e
D e te c t
R e s e t
C ir c u it
L o w
V o lta g e
R e s e t
F la s h /E E P R O M
P r o g r a m m in g
C ir c u itr y
D C -D C
C o n v e rte r
W a tc h d o g
T im e r
8 - b it
R IS C
M C U
C o re
In te rru p t
C o n tr o lle r
E x te rn a l
R C /X ta l
O s c illa to r s
S ta c k
F la s h
P ro g ra m
M e m o ry
E E P R O M
D a ta
M e m o ry
In te rn a l R C
O s c illa to r
R A M
D a ta
M e m o ry
T im e B a s e
1 2 - B it A /D
C o n v e rte r
C o m p a ra to rs
T im e r
M o d u le s
I/O
Note that the HT68F0x devices do not contain an A/D converter.
Pin Assignment
N C
1
1 6
N C
P A 3 /IN T /T C K 1 /T P 0
2
1 5
P A 4 /T C K 0 /T P 1
P A 2 /C X /[T P 0 ]
3
1 4
P A 1 /C 4
P A 0 /C +
N C
1
1 6
N C
P A 3 /IN T /T C K 1 /T P 0 /A N 3
2
1 5
P A 4 /T C K 0 /T P 1
P A 5 /[T P 0 ]/O S C 2
P A 2 /C X /[T P 0 ]/A N 2
3
1 4
P A 5 /[T P 0 ]/O S C 2
1 3
P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1
P A 1 /C -/A N 1 /V R E F
4
1 3
P A 6 /[T C K 0 ]/[T P 1 ]/O S C 1
5
1 2
P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S
P A 0 /C + /A N 0
5
1 2
P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/R E S
V S S
6
1 1
V D D
V S S & A V S S
6
1 1
V D D
G N D
7
1 0
P W D N
G N D
7
1 0
P W D N
8
9
V O U T
L X
8
9
V O U T
L X
H T 6 8 F 0 3 M /H T 6 8 F 0 4 M
1 6 N S O P -A
& A V D D
H T 6 6 F 0 3 M
1 6 N S O P -A
N C
1
1 6
N C
P A 3 /IN T /T C K 1 /[T C K 2 ]/T P 0 /A N 3
2
1 5
P A 4 /T C K 0 /T P 1
P A 2 /C X /[T C K 2 ]/[T P 0 ]/[T P 2 B ]/A N 2
3
1 4
P A 5 /[T C K 2 ]/[T P 0 ]/T P 2 B /O S C 2
P A 1 /[T P 2 A ]/C -/A N 1 /V R E F
4
1 3
P A 6 /[T C K 0 ]/[T P 1 ]/T P 2 A /O S C 1
P A 0 /[T P 2 B ]/C + /A N 0
5
1 2
P A 7 /[IN T ]/[T C K 0 ]/[T C K 1 ]/[T P 1 ]/[T P 2 A ]/R E S
V S S & A V S S
6
1 1
V D D
G N D
7
1 0
P W D N
L X
8
9
V O U T
& A V D D
H T 6 6 F 0 4 M
1 6 N S O P -A
Rev. 1.10
3
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Pin Description
HT68F03M/HT68F04M
Pin Name
Function
PA0~PA7
Port A
C-
Comparator input
C+
Comparator input
OP
I/T
O/T
PAWU
PAPU
ST
CMOS
Pin-Shared Mapping
¾
AN
¾
PA1
CPC
CPC
AN
¾
PA0
PA2
CX
Comparator output
¾
CMOS
TCK0
TM0 input
PRM
ST
¾
PA4, PA6 or PA7
TCK1
TM1 input
PRM
ST
¾
PA3 or PA7
TP0
TM0 I/O
PRM
ST
CMOS
PA3, PA5 or PA2
TP1
TM1 I/O
PRM
ST
CMOS
PA4, PA6 or PA7
INT
External Interrupt
PRM
ST
¾
PA3 or PA7
OSC1
HXT/ERC/LXT pin
CO
HXT/LXT
¾
PA6
OSC2
HXT/LXT pin
CO
¾
RES
Reset pin
CO
ST
¾
PA7
VDD
Power supply
¾
PWR
¾
¾
VSS
Ground
¾
PWR
¾
¾
LX
Switching input pin
¾
PWR
¾
¾
VOUT
DC-DC converter output pin
¾
PWR
¾
¾
¾
¾
HXT/LXT PA5
CE
DC-DC converter chip enable, active high
¾
NS
GND
Ground
¾
PWR
¾
¾
NC
Not connected
¾
¾
¾
¾
Note:
I/T: Input type
O/T: Output type
OP: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
NS: non-standard input
CMOS: CMOS output
NMOS: NMOS output
SCOM: Software controlled LCD COM
AN: Analog input pin
HXT: High frequency crystal oscillator
LXT: Low frequency crystal oscillator
Rev. 1.10
4
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
HT66F03M
Pin Name
Function
OP
I/T
O/T
ST
CMOS
Pin-Shared Mapping
PA0~PA7
Port A
PAWU
PAPU
AN0~AN3
A/D converter input
ACERL
AN
¾
PA0~PA3
VREF
A/D converter reference input
ADCR1
AN
¾
PA1
C-
Comparator input
AN
¾
PA1
C+
Comparator input
AN
¾
PA0
CX
Comparator output
¾
CMOS
PA2
TCK0
TM0 input
PRM
ST
¾
TCK1
TM1 input
PRM
ST
¾
TP0
TM0 I/O
PRM
ST
CMOS
PA3, PA5 or PA2
TP1
TM1 I/O
PRM
ST
CMOS
PA4, PA6 or PA7
INT
External interrupt
¾
ST
¾
PA3 or PA7
OSC1
HXT/ERC/LXT pin
CO
HXT/LXT
¾
PA6
OSC2
HXT/LXT pin
CO
¾
RES
Reset input
CO
ST
¾
PA7
VDD
MCU power supply
¾
PWR
¾
¾
AVDD
A/D converter power supply *
¾
PWR
¾
¾
¾
VSS
MCU ground
AVSS
A/D converter ground **
LX
Switching input pin
CPC
¾
PA4, PA6 or PA7
PA3 or PA7
HXT/LXT PA5
PWR
¾
¾
PWR
¾
¾
¾
PWR
¾
¾
VOUT
DC-DC converter output pin
¾
PWR
¾
¾
CE
DC-DC converter chip enable, active high
¾
NS
¾
¾
GND
Ground
¾
PWR
¾
¾
NC
Not connected
¾
¾
¾
¾
Note:
I/T: Input type
O/T: Output type
OP: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
NS: non-standard input
CMOS: CMOS output
NMOS: NMOS output
SCOM: Software controlled LCD COM
AN: Analog input pin
HXT: High frequency crystal oscillator
LXT: Low frequency crystal oscillator
*: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded together
internally with VDD.
**: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally
with VSS.
Rev. 1.10
5
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
HT66F04M
Pin Name
Function
OP
I/T
O/T
ST
CMOS
Pin-Shared Mapping
PA0~PA7
Port A
PAWU
PAPU
AN0~AN3
A/D converter input
ACERL
AN
¾
PA0~PA3
VREF
A/D converter reference input
ADCR1
AN
¾
PA1
C-
Comparator input
AN
¾
PA1
C+
Comparator input
AN
¾
PA0
CX
Comparator output
¾
CMOS
PA2
TCK0
TM0 input
PRM
ST
¾
PA4, PA6 or PA7
TCK1
TM1 input
PRM
ST
¾
PA3 or PA7
TCK2
TM2 input
PRM
ST
¾
PA3, PA5 or PA2
TP0
TM0 I/O
PRM
ST
CMOS
PA3, PA5 or PA2
TP1
TM1 I/O
PRM
ST
CMOS
PA4, PA6 or PA7
TP2A
TM2 I/O
PRM
ST
CMOS
PA6, PA1 or PA7
TP2B
TM2 I/O
PRM
ST
CMOS
PA5, PA0 or PA2
INT
External interrupt
¾
ST
¾
PA3 or PA7
OSC1
HXT/ERC/LXT pin
CO
HXT/LXT
¾
PA6
OSC2
HXT/LXT pin
CO
¾
RES
Reset input
CO
ST
¾
PA7
VDD
MCU power supply
¾
PWR
¾
¾
CPC
¾
HXT/LXT PA5
AVDD
A/D converter power supply *
¾
PWR
¾
¾
VSS
MCU ground
¾
PWR
¾
¾
AVSS
A/D converter ground **
PWR
¾
¾
LX
Switching input pin
¾
PWR
¾
¾
VOUT
DC-DC converter output pin
¾
PWR
¾
¾
CE
DC-DC converter chip enable, active high
¾
NS
¾
¾
GND
Ground
¾
PWR
¾
¾
NC
Not connected
¾
¾
¾
¾
Note:
I/T: Input type
O/T: Output type
OP: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
NS: non-standard input
CMOS: CMOS output
NMOS: NMOS output
SCOM: Software controlled LCD COM
AN: Analog input pin
HXT: High frequency crystal oscillator
LXT: Low frequency crystal oscillator
*: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded together internally with VDD.
**: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally
with VSS.
Rev. 1.10
6
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Functional Description
As these device packages contain multiple internal chips,
for a detailed functional description, users must refer to
the relevant individual datasheets for both the MCU and
the DC-DC Converter. The following table shows which
individual devices are inside each package.
Device
MCU
DC-DC Converter
HT68F03M
HT68F03
HT7730
HT68F04M
HT68F04
HT7730
HT66F03M
HT66F03
HT7730
HT66F04M
HT66F04
HT7730
DC-DC Converter output pin, VOUT is also not connected to the MCU power supply pin, VDD, so these
two pins should also be connected together externally. If the DC-DC Converter is used to power the
MCU, then the MCU will always have a power supply
of 3V, so care must be taken to only consult the MCU
characteristics specified at this power supply voltage.
If required, the MCU can be supplied directly on its
VDD pin by an external power source if the DC-DC
converter is not used.
When calculating the total current consumption of the
device, the internal DC specifications of the two internal chips must be consulted and the individual currents added together.
As the MCU power supply may be supplied by the
DC-DC Converter it is important to note that if the
MCU is powered down or placed into a low power
mode to conserve power, that the DC-DC Converter
will continue running and will consume a certain
amount of power. The DC-DC Converter can of
course be powered down by pulling its CE pin low,
however as its output voltage falls toward zero, the
MCU will experience a reset. The CE pin must therefore be held low for sufficient time to allow the VOUT
voltage to fall to a level where the MCU will be properly reset before being powered up again.
Multi-chip Internal Devices
Although most of the functional description material will
be located in the individual datasheets, there are some
special considerations which need to be taken into account when using multi-chip devices. These points will
be mentioned in the hardware and software consideration sections.
Multi-chip Hardware Considerations
As these single-package multi-chip devices are composed of an individual MCU and DC-DC converter
chips, using them together requires the user to take care
of some special points.
Multi-chip Programming Considerations
As there are no internal signal connections between the
two internal chips there are no real programming considerations for these devices. It is only necessary to
realise that if the MCU is switched into any of its low
power modes or executes the HALT instruction by the
application program to reduce power consumption, that
the DC-DC Converter will continue operating and therefore contribute to the overall power consumption. The
DC-DC Converter can only be powered-down manually
using its CE pin and if this is done the MCU will be reset.
· Absolute Maximum Ratings
The Absolute Maximum Ratings for the two individual
chips must be checked for discrepancies and the necessary care taken in device handling and usage.
· Power Supply
Examination of the block diagram will reveal that the
DC-DC Converter Ground pin, GND, has no internal
connection to the MCU Ground pin, VSS. For this reason these two pins must be connected externally. The
Rev. 1.10
7
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Application Circuits
HT68F03M/HT68F04M Application Circuit
0 .0 1 m F * *
0 .1 m F
V D D
R e s e t
C ir c u it
1 0 k W ~
1 0 0 k W
1 N 4 1 4 8 *
0 .1 ~ 1 m F
3 0 0 W *
R E S
V S S
O S C
C ir c u it
S e e O s c illa to r
S e c tio n
V IN
Note:
P A 0
P A 1
P A 2
P A 3
P A 4
O S C 1
O S C 2
G N D
L X
C E
V O U T
²*² Recommended component for added ESD protection.
²**² Recommended component in environments where power line noise is significant.
Rev. 1.10
8
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
HT66F03M/HT66F04M Application Circuit
0 .0 1 m F * *
0 .1 m F
V D D
R e s e t
C ir c u it
1 0 k W ~
1 0 0 k W
1 N 4 1 4 8 *
0 .1 ~ 1 m F
3 0 0 W *
R E S
V S S
O S C
C ir c u it
S e e O s c illa to r
S e c tio n
V IN
Note:
P A 0
P A 1
P A 2
P A 3
/A N
/A N
/A N
/A N
P A
0
1
2
3
4
O S C 1
O S C 2
G N D
L X
C E
V O U T
²*² Recommended component for added ESD protection.
²**² Recommended component in environments where power line noise is significant.
Rev. 1.10
9
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Package Information
16-pin NSOP (150mil) Outline Dimensions
1 6
A
9
B
8
1
C
C '
G
H
D
E
a
F
· MS-012
Symbol
Nom.
Max.
A
0.228
¾
0.244
B
0.150
¾
0.157
C
0.012
¾
0.020
C¢
0.386
¾
0.402
D
¾
¾
0.069
E
¾
0.050
¾
F
0.004
¾
0.010
G
0.016
¾
0.050
H
0.007
¾
0.010
a
0°
¾
8°
Symbol
A
Rev. 1.10
Dimensions in inch
Min.
Dimensions in mm
Min.
Nom.
Max.
5.79
¾
6.20
B
3.81
¾
3.99
C
0.30
¾
0.51
C¢
9.80
¾
10.21
D
¾
¾
1.75
E
¾
1.27
¾
F
0.10
¾
0.25
G
0.41
¾
1.27
H
0.18
¾
0.25
a
0°
¾
8°
10
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 1.10
13.0
+0.5/-0.2
2.0±0.5
16.8
+0.3/-0.2
22.2±0.2
11
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
B 0
C
D 1
P
K 0
A 0
R e e l H o le
IC
p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16.0±0.3
P
Cavity Pitch
8.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
7.5±0.1
D
Perforation Diameter
1.55
+0.10/-0.00
D1
Cavity Hole Diameter
1.50
+0.25/-0.00
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.5±0.1
B0
Cavity Width
10.3±0.1
K0
Cavity Depth
2.1±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.10
12
May 24, 2010
HT68F03M/HT68F04M/HT66F03M/HT66F04M
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Copyright Ó 2010 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.10
13
May 24, 2010