TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE FEATURES 1 • • APPLICATIONS • (1) Routes Signals for USB 1.0, 1.1, and 2.0 D1– D2– 7 6 5 D– VCC 9 4 GND S 10 3 D+ 1 2 D2+ 8 D1+ OE S 10 VCC 9 OE 8 D2+ RSW PACKAGE (BOTTOM VIEW) 1 2 7 6 D2– • RSW PACKAGE (TOP VIEW) D1+ • • • • • • VCC Operation at 3 V to 4.3 V 1.8-V Compatible Control-Pin Inputs IOFF Supports Partial Power-Down-Mode Operation – D+/D- Pins Tolerate up to 5.25V ron = 10 Ω Max Δron = 0.35 Ω Typ Cio(ON) = 7.5 pF Typ Low Power Consumption (1 µA Max) –3dB Bandwidth = 900 MHz Typ Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 8000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) ESD Performance I/O Port to GND (1) – 15000-V Human-Body Model Packaged in 10-pin TQFN (1.4 mm × 1.8 mm) D1– • • • 3 D+ 4 GND 5 D– High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only. DESCRIPTION/ORDERING INFORMATION The TS3USB30E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny µQFN package (1.8 mm × 1.4 mm) and is charaterized over the free air temperature range from –40°C to 85°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TS3USB30E SCDS255 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE TQFN – RSW (1) (2) ORDERABLE PART NUMBER Tape and reel TS3USB30ERSWR TOP-SIDE MARKING L6O Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PIN DESCRIPTION NAME DESCRIPTION OE Bus-switch enable S Select input D+, D–, Dn+, Dn– Data ports TRUTH TABLE S OE FUNCTION X H Disconnect L L D = D1 H L D = D2 BLOCK DIAGRAM D1+ D+ D2+ D1– D– D2– S OE 2 Control Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VIN Control input voltage range (3) –0.5 7 V VI/O Switch I/O voltage range (3) (4) Dn+, Dn– –0.5 VCC + 0.3 D+, D– when VCC > 0 –0.5 VCC + 0.3 D+, D– when VCC = 0 –0.5 UNIT V 5.25 IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA II/O ON-state switch current (5) ±64 mA ±100 mA 150 °C Continuous current through VCC or GND Tstg (1) (2) (3) (4) (5) Storage temperature range –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. PACKAGE THERMAL IMPEDANCE (1) θJA (1) Package thermal impedance RSW package TYP UNIT 175 °C/W The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) MIN MAX 3 4.3 VCC = 3 V to 3.6 V 1.3 VCC = 4.3 V 1.7 UNIT V V VCC = 3 V to 3.6 V 0.5 VCC = 4.3 V 0.7 V 0 VCC V –40 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E 3 TS3USB30E SCDS255 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK IIN Control inputs IOZ (3) IOFF D+ and D– ICC TEST CONDITIONS VCC = 3 V, II = –18 mA VCC = 4.3 V, 0 V, MIN TYP (2) MAX UNIT –1.2 V VIN = 0 to 4.3 V ±1 µA VCC = 4.3 V, VI = 0, VO = 0 to 3.6 V, Switch OFF ±1 µA VCC = 0 V, VI = 0, VO = 0 to 4.3 V, VIN = VCC or GND ±2 µA 1 µA 10 µA VCC = 4.3 V, II/O = 0, ΔICC (4) Control inputs VCC = 4.3 V, VIN = 2.6 V Cin Control inputs VCC = 0 V, VIN = VCC or GND Cio(OFF) VCC = 3.3 V, VI/O = 3.3 V or 0, Switch OFF Cio(ON) VCC = 3.3 V, VI/O = 3.3 V or 0, Switch ON 7.5 ron (5) VCC = 3 V, VI = 0.4, IO = –8 mA 6 Δron VCC = 3 V, VI = 0.4, IO = –8 mA 0.35 Ω ron(flat) VCC = 3 V, VI = 0 V or 1 V, IO = –8 mA 2 Ω (1) (2) (3) (4) (5) 4 Switch ON or OFF 1 pF 2 pF pF 10 Ω VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TYP (1) TEST CONDITIONS UNIT XTALK Crosstalk RL = 50 Ω, f = 240 MHz, See Figure 10 –54 dB OISO OFF isolation RL = 50 Ω, f = 240 MHz, See Figure 9 –40 dB BW Bandwidth (–3 dB) RL = 50 Ω, CL = 5 pF, See Figure 11 900 MHz (1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS MIN RL = 50 Ω, CL = 5 pF, See Figure 12 (2) (3) TYP (1) MAX tpd Propagation delay tON Line enable time, SEL to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 30 ns tOFF Line disable time, SEL to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 25 ns tON Line enable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 30 ns tOFF Line disable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 25 ns tSK(O) Output skew between center port to any other port (2) RL = 50 Ω, CL = 5 pF, See Figure 13 50 ps tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH) (2) RL = 50 Ω, CL = 5 pF, See Figure 13 20 ps tJ Total jitter (2) RL = 50 Ω, CL = 5 pF, tR = tF = 500 ps at 480 Mbps (PRBS = 215 – 1) 20 ps (1) (2) (3) 0.25 UNIT ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E 5 TS3USB30E SCDS255 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com APPLICATION INFORMATION 0 0 –10 –2 –20 Attenuation (dB) Gain (dB) –4 –6 –8 –30 –40 –50 –60 –10 –70 –12 –80 –14 100.0E+3 –90 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 100.0E+3 1.0E+6 10.0E+6 Frequency (Hz) 100.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Figure 1. Gain vs Frequency Figure 2. OFF Isolation 0 Attenuation (dB) –20 –40 –60 –80 –100 –120 100.0E+3 1.0E+6 10.0E+6 100.0E+6 Frequency (Hz) 1.0E+9 10.0E+9 0.5 0.5 0.4 0.4 0.3 0.3 Differential Signal (V) Differential Signal (V) Figure 3. Crosstalk 0.2 0.1 0.0 –0.1 –0.2 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.3 –0.4 –0.4 –0.5 –0.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.2 –9 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Time (x 10 ) (s) Figure 4. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) 6 0.4 –9 Time (x 10 ) (s) Figure 5. Eye Pattern: 480-Mbps USB Signal With Switch NC Path Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (x 10 ) (s) Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch NO Path VCC TS3USB30E 1D+ USB2.0 Controller D+ 1D– Set Top Box (STB) CPU or DSP Processor USB Connector D– 2D+ DVR or Mass Storage Controller 2D– Control S OE Figure 7. Application Diagram Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E 7 TS3USB30E SCDS255 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 VIN TEST RL CL VIN tON 50 Ω 5 pF VCC tOFF 50 Ω 5 pF VCC D 1D or 2D VOUT2 CL(2) RL S OE VSEL(1) GND (2) 50% 50% 0 tON VOE(1) (1) 1.8 V Logic RL Input (VSEL or V OE) CL(2) Switch Output (VOUT1 or V OUT2) tOFF 90% 90% VOH VOL All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r < 5 ns, tf < 5 ns. CL includes probe and jig capacitance. Figure 8. Turn-On (tON) and Turn-Off Time (tOFF) VCC Network Analyzer Channel OFF: 1D to D 50 W VOUT1 1D VSEL = VCC D Source Signal 50 W VIN 2D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-W load) VSEL S 50 W + GND DC Bias = 350 mV Figure 9. OFF Isolation (OISO) 8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VSEL = VCC VOUT2 2D 50 W Network Analyzer Setup 50 W VSEL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 10. Crosstalk (XTALK) VCC Network Analyzer 50 W VOUT1 1D Channel ON: 1D to D D Source Signal VIN VCTRL = GND 2D Network Analyzer Setup 50 W VSEL Source Power = 0 dBm (632-mV P-P at 50-W load) S GND GND DC Bias = 350 mV Figure 11. Bandwidth (BW) 400 mV Figure 12. Propagation Delay Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E 9 TS3USB30E SCDS255 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VOH VOL Pulse Skew tSK(P) VOH VOL VOH VOL Output Skew tSK(P) Figure 13. Skew Test 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E TS3USB30E www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D D + VIN Channel ON VOUT2 2D r on + VSEL IIN S VIN * VOUT2 or VOUT1 W IIN VSEL = VIH or VIL + GND Figure 14. ON-State Resistance (ron) VCC VOUT1 1D VIN D + VOUT2 2D VSEL + S OFF-State Leakage Current Channel OFF VSEL = VIH or VIL + GND Figure 15. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS VBIAS = VCC or GND VOUT2 2D VSEL = VCC or GND VIN D Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VSEL S GND Figure 16. Capacitance Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30E 11 PACKAGE OPTION ADDENDUM www.ti.com 16-Dec-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TS3USB30ERSWR ACTIVE QFN RSW Pins Package Eco Plan (2) Qty 10 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish Cu NiPdAu MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated