HYNIX HY27UF162G2B

1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
2Gb NAND FLASH
HY27UF(08/16)2G2B
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev 0.2 / Jan. 2008
1
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Document Title
2Gbit (256Mx8bit) NAND Flash Memory
Revision History
Revision No.
0.0
History
Initial Draft.
Draft Date
Remark
Jul. 03. 2007
Preliminary
Sep. 11. 2007
Preliminary
1) Add ULGA Package.
0.1
- Figures & texts are added.
2) Change tRCBSY to tRBSY
3) Change figure 13
0.2
Rev 0.2 / Jan. 2008
1) Delete Preliminary
Jan. 09. 2008
2
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
FEATURES SUMMARY
HIGH DENSITY NAND FLASH MEMORIES
STATUS REGISTER
- Cost effective solutions for mass storage applications
- Normal Status Register (Read/Program/Erase)
- Extended Status Register (EDC)
MULTIPLANE ARCHITECTURE
- Array is split into two independent planes. Parallel
Operations on both planes are available, halving
Program and erase time.
NAND INTERFACE
- x8/x16 bus width.
- Address/ Data Multiplexing
ELECTRONIC SIGNATURE
- 1st cycle : Manufacturer Code
- 2nd cycle : Device Code
- 3rd cycle : Internal chip number, Cell Type, Number of
Simultaneously Programmed Pages.
- 4th cycle : Page size, Block size, Organization, Spare
size
- Pinout compatiblity for all densities
- 5th cycle : Multiplane information
SUPPLY VOLTAGE
CHIP ENABLE DON’T CARE
- 3.3V device : Vcc = 2.7 V ~3.6 V
MEMORY CELL ARRAY
- x8 : (2K + 64) bytes x 64 pages x 2048 blocks
- x16 : (1K + 32) words x 64 pages x 2048 blocks
PAGE SIZE
- (2K + 64 spare) Bytes
- (1K + 32 spare) Words
BLOCK SIZE
- (128K + 4Kspare) Bytes
- (64K + 2Kspare) Words
PAGE READ / PROGRAM
- Random access : 25us (max.)
- Sequential access : 25ns (min.)
- Page program time : 200us (typ.)
- Multi-page program time (2 pages) : 200us (typ.)
COPY BACK PROGRAM
- Automatic block download without latency time
- Simple interface with microcontroller
HARDWARE DATA PROTECTION
- Program/Erase locked during Power transitions.
DATA RETENTION
- 100,000 Program/Erase cycles (with 1bit/528byte ECC)
- 10 years Data Retention
PACKAGE
- HY27UF(08/16)2G2B-T(P)
: 48-Pin TSOP1 (12 x 20 x 1.2 mm)
- HY27UF(08/16)2G2B-T (Lead)
- HY27UF(08/16)2G2B-TP (Lead Free)
- HY27UF082G2B-F(P)
: 63-Ball FBGA (9 x 11 x 1.0 mm)
- HY27UF082G2B-F (Lead)
- HY27UF082G2B-FP (Lead Free)
- HY27UF082G2B-UP
: 52-ULGA (12 x 17 x 0.65 mm)
- HY27UF082G2B-UP (Lead Free)
FAST BLOCK ERASE
- Block erase time: 1.5ms (typ.)
- Multi-block erase time (2 blocks) : 1.5ms (typ.)
CACHE READ
- Internal (2048 + 64) Byte buffer to improve the read
throughtput.
Rev 0.2 / Jan. 2008
3
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1.SUMMARY DESCRIPTION
Hynix NAND HY27UF(08/16)2G2B Series have 256Mx8bit with spare 8Mx8 bit capacity. The device is offered in 3.3V Vcc
Power Supply, and with x8 and x16 I/O interface Its NAND cell provides the most cost-effective solution for the solid state
mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve
valid data while old data is erased.
The device contains 2048 blocks, composed by 64 pages. A program operation allows to write the 2112-byte page in typical 200us and an erase operation can be performed in typical 1.5ms on a 128K-byte block.
Data in the page can be read out at 25ns cycle time per byte(x8). The I/O pins serve as the ports for address and data
input/output as well as command input.
This interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of
footprint. Commands, Data and Addresses are synchronously introduced using CE, WE, RE, ALE and CLE input pin. The
on-chip Program/Erase Controller automates all read, program and erase functions including pulse repetition, where
required, and internal verification and margining of data. The modify operations can be locked using the WP input. The
output pin R/B (open drain buffer) signals the status of the device during each operation. In a system with multiple memories the R/B pins can be connected all together to provide a global status signal.
The copy back function allows the optimization of defective blocks management. When a page program operation fails
the data can be directly programmed in another page inside the same array section without the time consuming serial
data insertion phase. Copy back operation automatically executes embedded error detection operation: 1 bit error
every 528byte (x8) or 1bit error out of every 264-word (x16) can be detected. Due to this feature, it is no more nor necessary nor recommended to use external 2-bit ECC to detect copy back operation errors. Data read out after copy back read
(both for single and multiplane cases) is allowed.
Even the write-intensive systems can take advantage of the HY27UF(08/16)2G2B Series extended reliability of 100K program/erase cycles by supporting ECC (Error Correcting Code) with real time mapping-out algorithm. The chip supports CE
don’t care function. This function allows the direct download of the code from the NAND Flash memory device by a microcontroller, since the CE transitions do not stop the read operation.
This device includes also extra features like OTP/Unique ID area, Read ID2 extension.
The HY27UF(08/16)2G2B Series are available in 48-TSOP1 12 x 20 mm, 63-FBGA 9 x 11mm, 52-ULGA 12 x 17 mm.
1.1 Product List
PART NUMBER
ORGANIZATION
HY27UF082G2B
x8
HY27UF162G2B
x16
Rev 0.2 / Jan. 2008
Vcc RANGE
2.7V ~ 3.6V
PACKAGE
48-TSOP1, 63-FBGA, 52-ULGA
48-TSOP1
4
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
9&&
,2a,2
&(
,2a,2[2QO\
:(
5%
5(
$/(
&/(
:3
966
Figure1: Logic Diagram
IO15 - IO8
Data Input / Outputs (x16 only)
IO7 - IO0
Data Input / Outputs
CLE
Command latch enable
ALE
Address latch enable
CE
Chip Enable
RE
Read Enable
WE
Write Enable
WP
Write Protect
R/B
Ready / Busy
Vcc
Power Supply
Vss
Ground
NC
No Connection
Table 1: Signal Names
Rev 0.2 / Jan. 2008
5
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
1$1')ODVK
7623
[
1&
1&
1&
1&
,2
,2
,2
,2
1&
1&
1&
9FF
9VV
1&
1&
1&
,2
,2
,2
,2
1&
1&
1&
1&
1&
1&
1&
1&
1&
1&
5%
5(
&(
1&
1&
9FF
9VV
1&
1&
&/(
$/(
:(
:3
1&
1&
1&
1&
1&
1$1')ODVK
7623
[
9VV
,2
,2
,2
,2
,2
,2
,2
,2
1&
1&
9FF
1&
1&
1&
,2
,2
,2
,2
,2
,2
,2
,2
9VV
Figure 2: 48TSOP1 Contact, x8 and x16 Device
$
1&
%
1&
1&
&
:3
'
$/(
9VV
&(
:(
5%
1&
5(
&/(
1&
1&
1&
(
1&
1&
1&
1&
1&
1&
)
1&
1&
1&
1&
1&
1&
*
1&
1&
1&
1&
1&
35(
+
1&
,2
1&
1&
1&
9FF
-
1&
,2
1&
9FF
,2
,2
.
9VV
,2
,2
,2
,2
9VV
1&
1&
1&
1&
/
1&
1&
1&
1&
0
1&
1&
1&
1&
Figure 3: 63FBGA Contactions, x8 Device (Top view through package)
Rev 0.2 / Jan. 2008
6
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1&
1&
&/(
966
1&
1&
1&
:(
5%
:3
1&
1&
+
-
1&
,2
966
1&
1&
.
/
1&
1&
9&&
1&
)
*
,2
966
1&
1&
1&
,2
,2
1&
'
,2
,2
&
(
1&
1&
,2
1&
1&
966
,2
1&
5(
$
%
1&
1&
1&
1&
9&&
1&
$/(
1&
&(
0
1
1&
1&
1&
Figure 4. 52-ULGA Contactions, x8 Device (Top view through package)
Rev 0.2 / Jan. 2008
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1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
1.2 PIN DESCRIPTION
Pin Name
Description
IO0-IO7
IO8-IO15(1)
DATA INPUTS/OUTPUTS
The IO pins allow to input command, address and data and to output data during read / program
operations. The inputs are latched on the rising edge of Write Enable (WE). The I/O buffer float to
High-Z when the device is deselected or the outputs are disabled.
CLE
COMMAND LATCH ENABLE
This input activates the latching of the IO inputs inside the Command Register on the Rising edge of
Write Enable (WE).
ALE
ADDRESS LATCH ENABLE
This input activates the latching of the IO inputs inside the Address Register on the Rising edge of
Write Enable (WE).
CE
CHIP ENABLE
This input controls the selection of the device.
WE
WRITE ENABLE
This input acts as clock to latch Command, Address and Data. The IO inputs are latched on the rise
edge of WE.
RE
READ ENABLE
The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is
valid tREA after the falling edge of RE which also increments the internal column address counter by
one.
WP
WRITE PROTECT
The WP pin, when Low, provides an Hardware protection against undesired modify (program / erase)
operations.
R/B
READY BUSY
The Ready/Busy output is an Open Drain pin that signals the state of the memory.
Vcc
SUPPLY VOLTAGE
The Vcc supplies the power for all the operations (Read, Write, Erase).
Vss
GROUND
NC
NO CONNECTION
Table 2: Pin Description
NOTE:
1. For x16 version only
2. A 0.1uF capacitor should be connected between the Vcc Supply Voltage pin and the Vss Ground pin to decouple
the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required
during program and erase operations.
3. An internal voltage detector disables all functions whenever VCC is below 1.8V (3.3V version) to protect the device
from any involuntary program/erase during power transitions.
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
1st Cycle
A0
A1
A2
A3
A4
A5
A6
A7
2nd Cycle
A8
A9
A10
A11
L(1)
L(1)
L(1)
L(1)
3rd Cycle
A12
A13
A14
A15
A16
A17
A18
A19
4th Cycle
A20
A21
A22
A23
A24
A25
A26
A27
5th Cycle
A28
L(1)
L(1)
L(1)
L(1)
L(1)
L(1)
L(1)
Table 3: Address Cycle Map(x8)
NOTE:
1. L must be set to Low.
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
I/O8IO15
1st Cycle
A0
A1
A2
A3
A4
A5
A6
A7
L(1)
2nd Cycle
A8
A9
A10
L(1)
L(1)
L(1)
L(1)
L(1)
L(1)
3rd Cycle
A11
A12
A13
A14
A15
A16
A17
A18
L(1)
4th Cycle
A19
A20
A21
A22
A23
A24
A25
A26
L(1)
5th Cycle
A27
L(1)
L(1)
L(1)
L(1)
L(1)
L(1)
L(1)
L(1)
Table 4: Address Cycle Map(x16)
NOTE:
1. L must be set to Low.
FUNCTION
1st CYCLE
2nd CYCLE
3rd CYCLE
4th CYCLE
READ1
00h
30h
-
-
READ FOR COPY-BACK
00h
35h
-
-
READ ID
90h
-
-
-
RESET
FFh
-
-
-
PAGE PROGRAM
80h
10h
-
-
COPY BACK PGM
85h
10h
-
-
MULTI PLANE PROGRAM
80h
11h
81h
10h
MULTI PLANE COPYBACK
PROGRAM
BLOCK ERASE
85h
11h
81h
10h
60h
D0h
-
-
MULTI PLANE
BLOCK ERASE
READ STATUS REGISTER
60h
60h
D0h
-
70h
-
-
-
RANDOM DATA INPUT
85h
-
-
-
RANDOM DATA OUTPUT
05h
E0h
-
-
READ CACHE (RANDOM)
00h
31h
-
-
READ CACHE (SEQUENTIAL)
31h
-
-
-
READ CACHE END
3Fh
-
-
-
READ EDC STATUS REGISTER
7Bh
-
-
-
Acceptable command
during busy
Yes
Yes
Table 5: Command Set
Note:
1. READ EDC STATUS REGISTER is only available on Copy Back operation.
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
CLE
ALE
CE
WE
RE
WP
MODE
H
L
L
Rising
H
X
L
H
L
Rising
H
X
H
L
L
Rising
H
H
L
H
L
Rising
H
H
L
L
L
Rising
H
H
Data Input
L
L
L(1)
H
Falling
X
Sequential Read and Data Output
L
L
L
H
H
X
During Read (Busy)
X
X
X
X
X
H
During Program (Busy)
X
X
X
X
X
H
During Erase (Busy)
X
X
X
X
X
L
Write Protect
X
X
H
X
X
0V/Vcc
Read Mode
Write Mode
Command Input
Address Input(5 cycles)
Command Input
Address Input(5 cycles)
Stand By
Table 6: Mode Selection
NOTE:
1. With the CE high during latency time does not stop the read operation
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
2. BUS OPERATION
There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input,
Data Output, Write Protect, and Standby.
Typically glitches less than 3ns on Chip Enable, Write Enable and Read Enable are ignored by the memory and do not
affect bus operations.
2.1 Command Input
Command Input bus operation is used to give a command to the memory device. Command are accepted with Chip
Enable low, Command Latch Enable High, Address Latch Enable low and Read Enable High and latched on the rising
edge of Write Enable. Moreover for commands that starts a modify operation (write/erase) the Write Protect pin must be
high. See Figure 6 and Table 13 for details of the timings requirements. Command codes are always applied on IO7:0
regardless of the bus configuration. (x8 or x16)
2.2 Address Input
Address Input bus operation allows the insertion of the memory address. Five cycles are required to input the addresses
for the 4Gbit devices. Addresses are accepted with Chip Enable low, Address Latch Enable High, Command Latch Enable
low and Read Enable High and latched on the rising edge of Write Enable. Moreover for commands that starts a modifying operation (write/erase) the Write Protect pin must be high. See Figure 7 and Table 13 for details of the timings
requirements. Addresses are always applied on IO7:0 regardless of the bus configuration (x8 or x16).
2.3 Data Input
Data Input bus operation allows to feed to the device the data to be programmed. The data insertion is serial and timed
by the Write Enable cycles. Data are accepted only with Chip Enable low, Address Latch Enable low, Command Latch
Enable low, Read Enable High, and Write Protect High and latched on the rising edge of Write Enable. See Figure 8 and
Table 13 for details of the timings requirements.
2.4 Data Output
Data Output bus operation allows to read data from the memory array and to check the status register content, the EDC
register content and the ID data. Data can be serially shifted out by toggling the Read Enable pin with Chip Enable low,
Write Enable High, Address Latch Enable low, and Command Latch Enable low. See Figure 9,10,12,13,14 and Table 13
for details of the timings requirements.
2.5 Write Protect
Hardware Write Protection is activated when the Write Protect pin is low. In this condition modifying operation does not
start and the content of the memory is not altered. Write Protect pin is not latched by Write Enable to ensure the protection even during the power up.
2.6 Standby
In Standby mode the device is deselected, outputs are disabled and Power Consumption is reduced.
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3. DEVICE OPERATION
3.1 Page Read
This operation is operated by writing 00h and 30h to the command register along with five address cycles.
Two types of operations are available: random read, serial page read. The random read mode is enabled when the
page address is changed. The 2112 bytes (x8) or 1056 words (x16) of data within the selected page are transferred to
the data registers in less than 25us(tR). The system controller may detect the completion of this data transfer (tR) by
analyzing the output of R/B pin. Once the data in a page is loaded into the data registers, they may be read out in
25ns cycle time by sequentially pulsing RE. The repetitive high to low transitions of the RE clock make the device output the data starting from the selected column address up to the last column address.
The device may output random data in a page instead of the sequential data by writing random data output command.
The column address of next data, which is going to be out, may be changed to the address which follows random data
output command. Random data output can be operated multiple times regardless of how many times it is done in a
page.
3.2 Page Program
The device is programmed by page. The number of consecutive partial page programming operation within the same
page without an intervening erase operation must not exceed 8 times. The addressing should be done on each pages
in a block. A page program cycle consists of a serial data loading period in which up to 2112bytes of data may be
loaded into the data register, followed by a non-volatile programming period where the loaded data is programmed
into the appropriate cell. The serial data loading period begins by inputting the Serial Data Input command (80h), followed by the five cycle address inputs and then serial data. The bytes other than those to be programmed do not need
to be loaded. The device supports random data input in a page.
The column address of next data, which will be entered, may be changed to the address which follows random data
input command (85h). Random data input may be operated multiple times regardless of how many times it is done in
a page. The Page Program confirm command (10h) initiates the programming process. Writing 10h alone without previously entering the serial data will not initiate the programming process. The internal write state controller automatically executes the algorithms and timings necessary for program and verify, thereby freeing the system controller for
other tasks. Once the program process starts, the Read Status Register command may be entered to read the status
register. The system controller can detect the completion of a program cycle by monitoring the R/B output, or the Status bit (I/O 6) of the Status Register. Only the Read Status command and Reset command are valid while programming
is in progress. When the Page Program is complete, the Write Status Bit (I/O 0) may be checked. The internal write
verify detects only errors for "1"s that are not successfully programmed to "0"s.
The command register remains in Read Status command mode until another valid command is written to the command register. Figure 16 details the sequence.
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.3 Multi Plane Program
Device supports multiple plane program: it is possible to program in parallel 2 pages, one per each plane.
A multiple plane program cycle consists of a double serial data loading period in which up to 4224bytes of data may be
loaded into the data register, followed by a non-volatile programming period where the loaded data is programmed
into the appropriate cell. The serial data loading period begins by inputting the Serial Data Input command (80h), followed by the five cycle address inputs and then serial data for the 1st page. Address for this page must be within 1st
plane (A<18>=0). The data of 1st page other than those to be programmed do not need to be loaded. The device
supports random data input exactly like page program operation. The Dummy Page Program Confirm command (11h)
stops 1st page data input and the device becomes busy for a short time (tDBSY). Once it has become ready again, 81h
command must be issued, followed by 2nd page address (5 cycles) and its serial data input. Address for this page
must be within 2nd plane (A<18>=1). The data of 2nd page other than those to be programmed do not need to be
loaded. Program Confirm command (10h) makes parallel programming of both pages start. User can check operation
status by R/B pin or read status register command, as if it were a normal page program; status register command is
also available during Dummy Busy time (tDBSY). In case of fail in 1st or 2nd page program, fail bit of status register
will be set: Device supports pass/fail status of each plane. Figure 21 details the sequence.
3.4 Block Erase
The Erase operation is done on a block basis. Block address loading is accomplished in there cycles initiated by an
Erase Setup command (60h). Only address A18 to A28 is valid while A12 to A17 is ignored (x8). The Erase Confirm
command (D0h) following the block address loading initiates the internal erasing process. This two step sequence of
setup followed by execution command ensures that memory contents are not accidentally erased due to external noise
conditions. At the rising edge of WE after the erase confirm command input, the internal write controller handles erase
and erase verify.
Once the erase process starts, the Read Status Register command may be entered to read the status register.
The system controller can detect the completion of an erase by monitoring the R/B output, or the Status bit (I/O 6) of
the Status Register. Only the Read Status command and Reset command are valid while erasing is in progress. When
the erase operation is completed, the Write Status Bit (I/O 0) may be checked.
Figure 20 details the sequence.
3.5 Multi Plane Erase
Multiple plane erase, allows parallel erase of two blocks, one per each memory plane.
Block erase setup command (60h) must be repeated two times, each time followed by 1st block and 2nd block address
respectively (3 cycles each). As for block erase, D0h command makes embedded operation start. Multiplane erase
does not need any Dummy Busy Time between 1st and 2nd block address insertion. Address limitation required for
multiple plane program applies also to multiple plane erase, as well as operation progress can be checked like for multiple plane program. Figure 22 details the sequence
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.6 Copy-back Program
Copy-Back program with Read for Copy-Back is configured to quickly and efficiently rewrite data stored in one page
without data reloading when the bit error is not in data stored. Since the time-consuming re-loading cycles are
removed, the system performance is improved. The benefit is especially obvious when a portion of a block is updated
and the rest of the block also needs to be copied to the newly assigned free block. Copy-Back operation is a sequential execution of Read for Copy-Back and of copy-back program with the destination page address. A read operation
with "35h" command and the address of the source page moves the whole 2112byte data into the internal data buffer.
A bit error is checked by sequential reading the data output. In the case where there is no bit error, the data do not
need to be reloaded. Therefore Copy-Back program operation is initiated by issuing Page-Copy Data-Input command
(85h) with destination page address. Actual programming operation begins after Program Confirm command (10h) is
issued. Once the program process starts, the Read Status Register command (70h) may be entered to read the status
register. The system controller can detect the completion of a program cycle by monitoring the R/B output, or the Status bit(I/O 6) of the Status Register.
When the Copy-Back Program is complete, the Write Status Bit(I/O 0) may be checked(Figure 18 & Figure 18). The
command register remains in Read Status command mode until another valid command is written to the command
register. During copy-back program, data modification is possible using random data input command (85h) as shown
in Figure19.
Copy-back program operation is allowed only within same plane.
3.7 Multi-Plane Copy-Back Program
The copy-back program is configured to quickly and efficiently rewrite data stored in one page without utilizing an
external memory. Since the time-consuming cycles of serial access and re-loading cycles are removed, the system
performance is greatly improved. The benefit is especially obvious when a portion of a block needs to be updated and
the rest of the block also need to be copied to the newly assigned free block.
The operation for performing a copy-back program is a sequential execution of page-read without serial access and
copying-program with the address of destination page. A read operation with "35h" command and the address of the
source page moves the whole 2112byte data into the internal data buffer. As soon as the device returns to Ready
state, optional data read-out is allowed by toggling RE (See Figure 23), or Copy Back command (85h) with the
address cycles of destination page may be written. The Program Confirm command (10h) is required to actually begin
the programming operation. Data input cycle for modifying a portion or multiple distant portions of the source page is
allowed as shown in Figure 23.
Most NAND devices require 2 bit external ECC only due to copy back operation while 1 bit ECC can be enough for all
other operation. Reason is that during read for copy back + copy back program sequence a bit error due to charge
loss is not checked by external error detection/correction scheme. On the contrary, 2Gbit NAND includes automatic
Error Detection Code during copy back operation: thanks to this, 2 bit external ECC is no more required, with significant advantage for customers that can always use single bit ECC. More details on EDC operation are available in section 3.8.
Rev 0.2 / Jan. 2008
14
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.8 EDC Operation
Error Detection Code check automatically starts immediately after device becomes busy for a copy back program operation (both single and multiple plane). In the x8 version EDC allows detection of 1 single bit error every 528 bytes,
where each 528byte group is composed by 512 bytes of main array and 16 bytes of spare area (see Table 20,21).
So described 528byte area is called “EDC unit”. In the x16 version EDC allows detection of 1 single bit error every 264
words, where each 264 word group is composed by 256 words of main array and 8 words of spare area (see Table
20,21). So described 264 word area is called “ EDC unit”.
To Properly use EDC, some limitations apply:
- Random data input can be used only once in copy back program or page program or multiple page program, unless
user inputs data for a whole EDC unit (or more whole EDC units).
- Any page program operation must be done on whole page basis, or on whole EDC unit (s).
EDC result can be checked only during copy back program through 7Bh (specific Read EDC register command, Table 22)
3.9 Read Status Register
The device contains a Status Register which may be read to find out whether, program or erase operation is completed,
and whether the program or erase operation is completed successfully. After writing 70h command to the command
register, a read cycle outputs the content of the Status Register to the I/O pins on the falling edge of CE or RE, whichever occurs last. This two line control allows the system to poll the progress of each device in multiple memory connections even when R/B pins are common-wired. RE or CE does not need to be toggled for updated status. Refer to table
14 for specific Status Register definitions. The command register remains in Status Read mode until further commands
are issued to it. Therefore, if the status register is read during a random data output, the read command (00h) should
be given before starting read cycles.
3.10 Read EDC Status Register
The operation is available only in copy back program and it allows the detection of errors occurred during read for copy
back. In case of multiple plane copy back, it is not possible to know which of the two read operation caused the error.
After writing 7Bh command to the command register, a read cycle outputs the content of the EDC Register to the I/O
pins on the falling edge of CE or RE, whichever occurs last.
Operation is same read status register command. Refer to below Table 22 for specific EDC Register definitions.
3.11 Read ID.
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an
address input of 00h. Five read cycles sequentially output the manufacturer code (ADh), and the device code and 3rd,
4th, 5th cycle ID, respectively. The command register remains in Read ID mode until further commands are issued to
it. Figure 24 shows the operation sequence, while tables 15 explain the byte meaning.
3.12 Reset
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state
during random read, program or erase mode, the reset operation will abort these operations. The contents of memory
cells being altered are no longer valid, as the data will be partially programmed or erased. The command register is
cleared to wait for the next command, and the Status Register is cleared to value C0h when WP is high. Refer to table
14 for device status after reset operation. If the device is already in reset state a new reset command will not be
accepted by the command register. The R/B pin goes low for tRST after the Reset command is written. Refer to Figure
27.
Rev 0.2 / Jan. 2008
15
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
3.13 Cache Read
Cache read operation allows automatic download of consecutive pages. Immediately after 1st latency end, while user
can start reading out data, device internally starts reading following page.
Start address of 1st page is at page start (A<10:0>=00h), after 1st latency time (tr) , automatic data download will
be uninterrupted. In fact latency time is 25us, while download of a page require at least 100us for x8 device. (50us for
x16device).
The Cache Read function may be issued after the Read function is complete (SR[6] is set to one). The host may enter
the address of the next page to be read from the Flash array. Data output always begins at column address 00h. If
the host does not enter an address to retrieve, the next sequential page is read. When the Cache Read function is
issued, SR[6] is cleared to zero (busy). After the operation is begun SR[6] is set to one (ready) and the host may
begin to read the data from the previous Read or Cache Read function. Issuing an additional Cache Read function
copies the data most recently read from the array into the page register. When no more pages are to be read, the
final page is copied into the page register by issuing the 3Fh command. The host may begin to read data from the
page register when SR[6]is set to one (ready). When the 31h and 3Fh commands are issued, SR[6] shall be cleared
to zero (busy) until the page has finished being copied from the Flash array.
The host shall not issue a sequential Read Cache (31h) command after the last page of the device is read.
Refer to Figure 15.
Cache Read operation must be done only block by block if system needs to avoid reading also reading from invalid
blocks.
Rev 0.2 / Jan. 2008
16
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
4. OTHER FEATURES
4.1 Data Protection & Power On/Off Sequence
The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal
voltage detector disables all functions whenever Vcc is below about 2.0V(3.3V device). WP pin provides hardware protection and is recommended to be kept at VIL during power-up and power-down. A recovery time of minimum 10us is
required before internal circuit gets ready for any command sequences as shown in Figure 28. The two-step command
sequence for program/erase provides additional software protection.
4.2 Ready/Busy.
The device has a Ready/Busy output that provides method of indicating the completion of a page program, erase,
copy-back and random read completion. The R/B pin is normally high and goes to low when the device is busy (after a
reset, read, program, erase operation). It returns to high when the internal controller has finished the operation. The
pin is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied.
Because pull-up resistor value is related to tR(R/B) and current drain during busy (Ibusy), an appropriate value can be
obtained with the following reference chart (Fig 28). Its value can be determined by the following guidance.
Rev 0.2 / Jan. 2008
17
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Parameter
Symbol
Min
Typ
Max
Unit
Valid Block
Number
NVB
2008
-
2048
Blocks
Table 7 : Valid Blocks Numbers
NOTE:
1. The 1st block is guaranteed to be a valid block at the time of shipment.
Symbol
Parameter
Value
Unit
Ambient Operating Temperature (Commercial Temperature Range)
0 to 70
℃
Ambient Operating Temperature (Industrial Temperature Range)
-40 to 85
℃
TBIAS
Temperature Under Bias
-50 to 125
℃
TSTG
Storage Temperature
-65 to 150
V
Input or Output Voltage
-0.6 to 4.6
V
Supply Voltage
-0.6 to 4.6
V
TA
VIO(2)
Vcc
Table 8: Absolute maximum ratings
NOTE:
1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute
Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and operation of
the device at these or any other conditions above those indicated in the Operating sections of this specification is
not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Refer also to the Hynix SURE Program and other relevant quality documents.
2. Minimum Voltage may undershoot to -2V during transition and for less than 20ns during transitions.
Rev 0.2 / Jan. 2008
18
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
$a$
$''5(66
5(*,67(5
&2817(5
352*5$0
(5$6(
&21752//(5
+9*(1(5$7,21
$/(
&/(
:(
&(
:3
5(
;
0ELW0ELW
1$1')ODVK
0(025<$55$<
'
(
&
2
'
(
5
&200$1'
,17(5)$&(
/2*,&
3$*(%8))(5
&200$1'
5(*,67(5
<'(&2'(5
'$7$
5(*,67(5
%8))(56
,2
Figure 5: Block Diagram
Rev 0.2 / Jan. 2008
19
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Parameter
Symbol
Test Conditions
Sequential
Read
ICC1
Program
Erase
3.3Volt
Unit
Min
Typ
Max
tRC=25ns
CE=VIL, IOUT=0mA
-
15
30
mA
ICC2
-
-
15
30
mA
ICC3
-
-
15
30
mA
Stand-by Current (TTL)
ICC4
CE=VIH,
WP=0V/Vcc
-
1
mA
Stand-by Current (CMOS)
ICC5
CE=Vcc-0.2,
WP=0V/Vcc
-
10
50
uA
Input Leakage Current
ILI
VIN=0 to Vcc (max)
-
-
± 10
uA
Output Leakage Current
ILO
VOUT =0 to Vcc (max)
-
-
± 10
uA
Input High Voltage
VIH
-
0.8xVcc
-
Vcc+0.3
V
Input Low Voltage
VIL
-
-0.3
-
0.2xVcc
V
Output High Voltage Level
VOH
IOH=-400uA
2.4
-
-
V
Output Low Voltage Level
VOL
IOL=2.1mA
-
-
0.4
V
Output Low Current (R/B)
IOL
(R/B)
VOL=0.4V
8
10
-
mA
Operating
Current
Table 9: DC and Operating Characteristics
Value
Parameter
3.3Volt
Input Pulse Levels
0V to VCC
Input Rise and Fall Times
5ns
Input and Output Timing Levels
VCC/2
Output Load (2.7V - 3.6V)
1 TTL GATE and CL=50pF
Table 10: AC Conditions
Rev 0.2 / Jan. 2008
20
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Item
Symbol
Test Condition
Min
Max
Unit
Input / Output Capacitance
CI/O
VIL=0V
-
10
pF
Input Capacitance
CIN
VIN=0V
-
10
pF
Table 11: Pin Capacitance (TA=25C, F=1.0MHz)
Parameter
Symbol
Min
Typ
Max
Unit
Program Time / Multi-Plane Program Time
tPROG
-
200
700
us
Dummy Busy Time for Two Plane Program
tDBSY
-
0.5
1
us
Number of partial Program Cycles in the same page
NOP
-
-
8
Cycles
Block Erase Time / Multi-Plane Block Erase Time
tBERS
-
1.5
2
ms
Read Cache Busy Time
tRBSY
-
3
tR
us
Table 12: Program / Erase Characteristics
Rev 0.2 / Jan. 2008
21
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Parameter
Symbol
3.3V
Min
Max
Unit
CLE Setup time
tCLS
12
ns
CLE Hold time
tCLH
5
ns
CE setup time
tCS
20
ns
CE hold time
tCH
5
ns
WE pulse width
tWP
12
ns
ALE setup time
tALS
12
ns
ALE hold time
tALH
5
ns
Data setup time
tDS
12
ns
Data hold time
tDH
5
ns
Write Cycle time
tWC
25
ns
WE High hold time
tWH
10
ns
Data Transfer from Cell to register
tR
ALE to RE Delay
tAR
10
ns
CLE to RE Delay
tCLR
10
ns
Ready to RE Low
tRR
20
ns
RE Pulse Width
tRP
12
ns
WE High to Busy
tWB
Read Cycle Time
tRC
RE Access Time
tREA
20
ns
RE High to Output High Z
tRHZ
100
ns
CE High to Output High Z
tCHZ
50
ns
CE High to Output hold
tCOH
15
ns
RE High to Output Hold
tRHOH
15
ns
RE Low to Output Hold
tRLOH
5
ns
RE High Hold Time
tREH
10
ns
Output High Z to RE low
tIR
0
ns
CE Low to RE Low
tCR
10
ns
Address to data loading time
tADL
70
ns
WE High to RE low
tWHR
60
ns
RE High to WE low
tRHW
100
ns
Device Resetting Time (Read / Program / Erase)
tRST
Write Protection time
t
WW(2)
25
100
25
ns
ns
5/10/500(1)
100
us
us
ns
Table 13: AC Timing Characteristics
NOTE:
1. If Reset Command (FFh) is written at Ready state, the device goes into Busy for maximum 5us
2. Program / Erase Enable Operation : WP high to WE High.
Program / Erase Disable Operation : WP Low to WE High.
Rev 0.2 / Jan. 2008
22
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
IO
Page Program
Block Erase
Read
Cache Read
CODING
0
Pass / Fail
Pass / Fail
NA
NA
Pass: ‘0’ Fail: ‘1’
1
NA
NA
NA
NA
-
2
NA
NA
NA
NA
-
3
NA
NA
NA
NA
-
4
NA
NA
NA
NA
-
5
Ready / Busy
Ready / Busy
Ready /
Busy
P/E/R
Controller Bit
Active: ‘0’ Idle:’1’
6
Ready / Busy
Ready / Busy
Ready /
Busy
Ready/Busy
Busy: ‘0’ Ready:’1’
7
Write Protect
Write Protect
Write
Protect
NA
Protected: ‘0’
Not Protected: ‘1’
Table 14 : Status Register Coding
DEVICE IDENTIFIER CYCLE
DESCRIPTION
1st
Manufacturer Code
2nd
Device Identifier
3rd
Internal chip number, cell Type, etc.
4th
Page Size, Block Size, Spare Size, Organization
5th
Multiplane information
Table 15: Device Identifier Coding
Part Number
Voltage
Bus
Width
1st cycle
(Manufacture Code)
2nd cycle
(Device Code)
3rd
cycle
4th
cycle
5th
cycle
HY27UF082G2B
3.3V
x8
ADh
DAh
10h
95h
44h
HY27UF162G2B
3.3V
x16
ADh
CAh
10h
D5h
44h
Table 16: Read ID Data Table
Rev 0.2 / Jan. 2008
23
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Description
IO7
IO6
IO5 IO4
IO3 IO2
1
2
4
8
Die / Package
0
0
1
1
2 Level Cell
4 Level Cell
Cell Type
0
0
1
1
8 Level Cell
16 Level Cell
1
2
4
8
Number of
Simultaneously
Programmed Pages
Interleave program
Between multiple chips
Not
Supported
Write Cache
Not
Supported
IO1 IO0
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Table 17: 3rd Byte of Device Idendifier Description
Description
Page Size
(Without Spare Area)
Spare Area Size
(Byte / 512Byte)
Serial Access Time
Block Size
(Without Spare Area)
Organization
IO7
IO6
IO5-4
IO3
IO2
1KB
2KB
4KB
8KB
0
0
1
1
8
16
50ns
30ns
25ns
Reserved
0
1
0
1
0
1
0
0
1
1
0
1
0
1
64K
128K
256K
512KB
X8
X16
IO1-0
0
0
1
1
0
1
0
1
0
1
Table 18: 4th Byte of Device Identifier Description
Rev 0.2 / Jan. 2008
24
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Description
Plane Number
Plane Size
(w/o redundant Area)
Reserved
IO7
IO6 IO5 IO4
1
2
4
8
IO3 IO2
0
0
1
1
64Mb
0
0
0
128Mb
0
0
1
256Mb
0
1
0
512Mb
0
1
1
1Gb
1
0
0
2Gb
1
0
1
4Gb
1
1
0
8Gb
1
1
1
IO1
IO0
0
0
0
1
0
1
0
Table 19: 5rd Byte of Device Idendifier Description
Rev 0.2 / Jan. 2008
25
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Table 20: Page organization in EDC units (x8)
Table 21: Page organization in EDC units (x16)
IO
Copy back Program
CODING
0
Pass/Fail
Pass: ‘0’ Fail: ‘1’
1
EDC status
NO error: ‘0’
2
EDC Validity
Invalid: ‘0’ Valid: ‘1’
3
NA
-
4
NA
-
5
Ready/Busy
Busy: ‘0’ Ready: ‘1’
6
Ready/Busy
Busy: ‘0’ Ready: ‘1’
7
Write Protect
Protected: ‘0’ Not Protected: ‘1’
Table 22: EDC Register Coding
Rev 0.2 / Jan. 2008
26
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
W&/6
W&/+
W&6
W&+
&(
W:3
:(
W$/6
W$/+
$/(
W'6
,2[
W'+
&RPPDQG
Figure 6: Command Latch Cycle
W&/6
&/(
W&6
W:&
W:&
W:&
W:&
&(
W:3
W:3
W:3
W:3
:(
W:+
W$/+
W$/6
W$/6
W:+
W$/+
W$/6
W:+
W$/+
W$/6
W:+
W$/+
W$/6
W$/+
$/(
W'+
,2[
W'+
W'6
W'6
&RO$GG
&RO$GG
W'+
W'6
5RZ$GG
W'+
W'6
5RZ$GG
W'+
W'6
5RZ$GG
Figure 7: Address Latch Cycle
Rev 0.2 / Jan. 2008
27
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W&/+
&/(
W&+
&(
W:&
W$/6
$/(
W:3
W:3
:(
W:3
W:+
W:+
W'6
W'+
,2[
W'6
W'+
',1
W'6
W'+
',1ILQDO
1RWHV',1ILQDOPHDQV%\WHV[
Figure 8: Input Data Latch Cycle
Rev 0.2 / Jan. 2008
28
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W5&
&(
W&+=
W5(+
W5($
W5($
5(
W5($
W5+=
W&2+
W5+=
W5+2+
,2[
'RXW
'RXW
'RXW
W55
5%
1RWHV7UDQVLWLRQLVPHDVXUHGDWP9IURPVWHDG\VWDWHYROWDJHZLWKORDG
7KLVSDUDPHWHULVVDPSOHGDQGQRWWHVWHGW&+=W5+=
W5+2+VWDUWVWREHYDOLGZKHQIUHTXHQF\LVORZHUWKDQ0+]
Figure 9: Sequential Out Cycle after Read (CLE=L, WE=H, ALE=L)
W&5
&(
W5&
W53
W&+=
W&2+
W5(+
5(
W5($
,2[
W5($
W5/2+
'RXW
W5+=
W5+2+
'RXW
W55
5%
1RWHV7UDQVLWLRQLVPHDVXUHGDWP9IURPVWHDG\VWDWHYROWDJHZLWKORDG
7KLVSDUDPHWHULVVDPSOHGDQGQRWWHVWHGW&+=W5+=
W5/2+LVYDOLGZKHQIUHTXHQF\LVKLJKHUWKDQ0+]
W5+2+VWDUWVWREHYDOLGZKHQIUHTXHQF\LVORZHUWKDQ0+]
Figure 10: Sequential Out Cycle after Read (EDO Type CLE=L, WE=H, ALE=L)
Rev 0.2 / Jan. 2008
29
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
W&/5
&/(
W&/6
W&/+
W&6
&(
W&+
W:3
:(
W&+=
W&2+
W&5
W:+5
5(
W'6
,2[
W'+
W,5
W5+=
W5+2+
W5($
6WDWXV2XWSXW
K
Figure 11: Status Read Cycle
W&/5
&/(
&(
W:&
:(
W:%
W$5
$/(
W5
W5&
W5+=
5(
W55
,2[
K
&RO$GG &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG
&ROXPQ$GGUHVV
5'
K
'RXW1
'RXW1
'RXW0
5RZ$GGUHVV
%XV\
Figure 12: Read1 Operation (Read One Page)
Rev 0.2 / Jan. 2008
30
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
&(
:(
W:%
W&+=
W$5
W&2+
$/(
W5
W5&
5(
W55
,2[
K
5%
&RO
&RO
$GG
$GG
&ROXPQ$GGUHVV
5RZ
$GG
5RZ
5RZ
$GG
$GG
5RZ$GGUHVV
'RXW
1
K
'RXW
1
'RXW
1
%XV\
Figure 13: Read1 Operation intercepted by CE
Rev 0.2 / Jan. 2008
31
Rev 0.2 / Jan. 2008
5%
,2[
5(
$/(
:(
&(
&/(
&ROXPQ$GGUHVV
5RZ$GGUHVV
K &RO$GG &RO$GG 5RZ$GG 5RZ$GG 5RZ$GG K
W5
W55
W$5
%XV\
W:%
'RXW1
W5&
'RXW1
W5+:
K
&RO$GG
&RO$GG
&ROXPQ$GGUHVV
(K
W:+5
W&/5
'RXW0
W5($
'RXW0
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 14 : Random Data output
32
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
$
&/(
&(
:(
$/(
5(
,2[
K
&RO
$GG
&RO
$GG
5RZ
$GG
5RZ
$GG
5RZ
$GG
K
K
'RXW1
W5
W5%6<
'RXW1
K
'RXW0
5%
$
&/(
&(
:(
$/(
5(
,2[
K
'RXW1
'RXW1
'RXW0
K
'RXW1
W5%6<
5%
'RXW1
'RXW0
)K
W5%6<
'DWD&DFKH
3DJH1
3DJH%XIIHU
3DJH1
'RXW1
'RXW1
'RXW0
W5%6<
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
3DJH1
&HOO$UUD\
3DJH1
3DJH1
3DJH1
3DJH1
Figure 15: Read Operation with Read Cache
Rev 0.2 / Jan. 2008
33
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
&(
W:&
W:&
W:&
:(
W$'/
W:%
W352*
W:+5
$/(
5(
,2[
K
&RO
$GG
&RO
$GG
6HULDO'DWD
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Figure 16: Page Program Operation
Rev 0.2 / Jan. 2008
34
Rev 0.2 / Jan. 2008
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Figure 17: Random Data In
35
Rev 0.2 / Jan. 2008
,2
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Figure 18: Copy Back Program Operation
36
Rev 0.2 / Jan. 2008
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HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Figure 19: Copy Back Program Operation with Random Data Input
37
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
&/(
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Figure 20: Block Erase Operation (Erase One Block)
Rev 0.2 / Jan. 2008
38
Rev 0.2 / Jan. 2008
5%
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Figure 21: Multiple plane page program
39
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
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Figure 22: Multiple plane erase operation
Rev 0.2 / Jan. 2008
40
Rev 0.2 / Jan. 2008
K
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Figure 23: Multi plane copyback program Operation
41
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Figure 24: Read ID Operation
Rev 0.2 / Jan. 2008
42
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
System Interface Using CE don’t care
To simplify system interface, CE signal is ignored during data loading or sequential data-reading as shown below.
So, it is possible to connect NAND Flash to a microprocessor. The only function that was removed from standard NAND
Flash to make CE don’t care read operation was disabling of the automatic sequential read function.
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Figure 26: Read Operation with CE don’t-care.
Rev 0.2 / Jan. 2008
43
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
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Figure 27: Reset Operation
9
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Figure 28: Power On and Data Protection Timing
VTH = 2.5 Volt for 3.3 Volt Supply devices
Rev 0.2 / Jan. 2008
44
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
5S
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Figure 29: Ready/Busy Pin electrical specifications
Rev 0.2 / Jan. 2008
45
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
wˆŽŒG]Z
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a
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kˆ›ˆGO][P
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kˆ›ˆGO][P
Figure 30: page programming within a block
Rev 0.2 / Jan. 2008
46
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Bad Block Management
Devices with Bad Blocks have the same quality level and the same AC and DC characteristics as devices where all the
blocks are valid. A Bad Block does not affect the performance of valid blocks because it is isolated from the bit line and
common source line by a select transistor. The devices are supplied with all the locations inside valid blocks
erased(FFh). The Bad Block Information is written prior to shipping. Any block where the 1st Byte in the spare area of
the 1st or 2nd th page (if the 1st page is Bad) does not contain FFh is a Bad Block. The Bad Block Information must be
read before any erase is attempted as the Bad Block Information may be erased. For the system to be able to recognize the Bad Blocks based on the original information it is recommended to create a Bad Block table following the flowchart shown in Figure 31. The 1st block, which is placed on 00h block address is guaranteed to be a valid block.
67$57
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Figure 31: Bad Block Management Flowchart
Rev 0.2 / Jan. 2008
47
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Bad Block Replacement
Over the lifetime of the device additional Bad Blocks may develop. In this case the block has to be replaced by copying
the data to a valid block. These additional Bad Blocks can be identified as attempts to program or erase them will give
errors in the Status Register.
Unlike the case of odd page which carries a possibility of affecting previous page, the failure of a page program operation does not affect the data in other pages in the same block, the block can be replaced by re-programming the current data and copying the rest of the replaced block to an available valid block.
Refer to Table 23 and Figure 32 for the recommended procedure to follow if an error occurs during an operation.
Operation
Recommended Procedure
Erase
Block Replacement
Program
Block Replacement
Read
ECC (with 1bit/528byte)
Table 23: Block Failure
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Figure 32: Bad Block Replacement
NOTE :
1. An error occurs on nth page of the Block A during program or erase operation.
2. Data in Block A is copied to same location in Block B which is valid block.
3. Nth data of block A which is in controller buffer memory is copied into nth page of Block B
4. Bad block table should be updated to prevent from eraseing or programming Block A
Rev 0.2 / Jan. 2008
48
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
Write Protect Operation
The Erase and Program Operations are automatically reset when WP goes Low (tWW = 100ns, min). The operations
are enabled and disabled as follows (Figure 33~36)
:(
W ::
,2[
K
K
:3
5%
Figure 33: Enable Programming
:(
W ::
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K
K
:3
5%
Figure 34: Disable Programming
Rev 0.2 / Jan. 2008
49
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
:(
W ::
K
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:3
5%
Figure 35: Enable Erasing
:(
W ::
,2[
K
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:3
5%
Figure 36: Disable Erasing
Rev 0.2 / Jan. 2008
50
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
H
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$
$
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/
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Figure 37: 48-TSOP1 - 48-lead Plastic Thin Small Outline, 12 x 20mm, Package Outline
Symbol
millimeters
Min
Typ
A
Max
1.200
A1
0.050
0.150
A2
0.980
1.030
B
0.170
0.250
C
0.100
0.200
CP
0.100
D
11.910
12.000
12.120
E
19.900
20.000
20.100
E1
18.300
18.400
18.500
e
0.500
L
0.500
0.680
alpha
0
5
Table 24: 48-TSOP1 - 48-lead Plastic Thin Small Outline,
12 x 20mm, Package Mechanical Data
Rev 0.2 / Jan. 2008
51
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
'
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6'
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H
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6(
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H
E
$
$
Figure 38: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Outline
NOTE: Drawing is not to scale.
Symbol
A
A1
A2
b
D
D1
D2
E
E1
E2
e
FD
FD1
FE
FE1
SD
SE
Millimeters
Min
0.80
0.25
0.55
0.40
8.90
10.90
Typ
0.90
0.30
0.60
0.45
9.00
4.00
7.20
11.00
5.60
8.80
0.80
2.50
0.90
2.70
1.10
0.40
0.40
Max
1.00
0.35
0.65
0.50
9.10
11.10
Table 25: 63-ball FBGA - 9 x 11 ball array 0.8mm pitch, Pakage Mechanical Data
Rev 0.2 / Jan. 2008
52
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
%
%
%
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Figure 39: 52-ULGA, 12 x 17mm, Package Outline
(Top view through package)
Symbol
A
millimeters
Min
Typ
Max
16.90
17.00
17.10
A1
13.00
A2
B
12.00
11.90
12.00
B1
10.00
B2
6.00
C
1.00
C1
1.50
C2
2.00
D
1.00
D1
1.00
E
12.10
0.65
CP1
0.65
0.70
0.75
CP2
0.95
1.00
1.05
Table 26: 52-ULGA, 12 x 17mm, Package Mechanical Data
Rev 0.2 / Jan. 2008
53
1
HY27UF(08/16)2G2B Series
2Gbit (256Mx8bit) NAND Flash
MARKING INFORMATION - TSOP1 / FBGA / ULGA
P a ck a g
TSO P1
/
FBG A
/
ULGA
M a rk in g E x a m p le
H
Y
2
7
x
x
x
x
U
F
- h y n ix
: H yn ix S ym bo l
- KOR
: O rig in C ou n try
- H Y27UFxx2G 2B xxxx
: P a rt N u m b er
x
K
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x
2
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2
B
Y
W
W
x
x
H Y : H yn ix
2 7 : N A N D Fla sh
U : P o w e r S u p p ly
: U (2 .7 V ~ 3 .6 V )
F : C la ssifica tion
: S in g le Leve l C e ll+ S in g le D ie + Larg e B lo ck
x x : B it O rga n izatio n
: 0 8 (x8 ), 1 6 (x1 6 )
2 G : D e n sity
: 2 G b it
2 : M o de
: 2 (1 n C E & 1 R /n B ; S e q u e n tia l R o w R e a d D isa ble )
B : V e rsion
: 3 rd G e n era tion
x : P acka ge T yp e
: T (4 8-T S O P 1 ), F (6 3 -FB G A ), U (5 2 -U LG A )
x : P acka ge M a te ria l
: B la n k(N orm a l), P (Le a d Fre e )
x : O p eratin g T e m perature
: C (0 ℃ ~ 7 0℃ ), I(-4 0℃ ~ 8 5 ℃ )
: B (In clu de d B a d B lock ), S (1 ~ 5 B a d B lock ),
x : B ad B lo ck
P (A ll G o od B lo ck)
- Y : Y e ar (ex: 5 = ye ar 2 0 0 5 , 6= ye a r 2 0 0 6 )
- w w : W o rk W eek (e x: 12 = w ork w eek 12 )
- x x : P roce ss C o d e
N o te
- C a p ita l L e tte r
: Fixe d Ite m
- S m a ll L e tte r
: N on -fixe d Ite m
Rev 0.2 / Jan. 2008
54