ETC CF322513-4R7K

NT
IA
PL
M
CO
Features
Applications
■ 1210 size
■ Prevention of electromagnetic
interference to signals on the secondary
side of electronic equipment
*R
oH
S
■ Magnetic shielding
■ High Q characteristics
■ High current
■ Lead free
CF322513 Series - Ferrite Multi-Layer High Current Chip Inductors
Electrical Specifications
Bourns Part No.
µH
CF322513-R12K
CF322513-R15K
CF322513-R18K
CF322513-R22K
CF322513-R27K
CF322513-R33K
CF322513-R39K
CF322513-R47K
CF322513-R56K
CF322513-R68K
CF322513-R82K
CF322513-1R0K
CF322513-1R2K
CF322513-1R5K
CF322513-1R8K
CF322513-2R2K
CF322513-2R7K
CF322513-3R3K
CF322513-3R9K
CF322513-4R7K
CF322513-5R6K
CF322513-6R8K
CF322513-8R2K
CF322513-100K
CF322513-120K
CF322513-150K
CF322513-180K
CF322513-220K
CF322513-270K
CF322513-330K
Inductance
Tol. %
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10.0
12.0
15.0
18.0
22.0
27.0
33.0
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
Q
min.
Test Freq.
L,Q MHz
SRF MHz
min.
DCR
Ω max.
I rms
mA max.
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
500
450
400
350
320
300
250
220
180
160
140
120
100
85
80
75
70
60
55
50
47
43
40
36
33
30
27
25
20
17
0.22
0.25
0.28
0.32
0.36
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.85
0.90
1.00
1.10
1.20
1.30
1.50
1.60
1.80
2.00
2.10
2.50
2.80
3.30
3.70
5.00
5.60
450
450
450
450
450
450
450
450
450
450
450
400
390
370
350
320
290
260
250
220
200
180
170
150
140
130
120
110
80
70
Packaging Specifications
2.0 ± 0.8
(.079 ± .031)
178.0
(7.00)
DIA.
Materials
Base Material ................................Ferrite
Terminal ..........................Pd/Pt/Ag/Ni/Sn
Packaging..................2,500 pcs. per reel
Product Dimensions
2.5 ± 0.2
(.098 ± .008)
0.8
MAX.
(.031)
3.2 ± 0.2
(.126 ± .008)
1.3 ± 0.2
(.051 ± .008)
Recommended Layout
1.1
(.043)
3.4
(.134)
1.1
(.043)
2.2
(.087)
12.0
(.472)
THICKNESS
0.10
(.004)
MAX.
13.0 ± 0.5
(.512 ± .020)
DIA.
21.0 ± 0.8
(.827 ± .031)
General Specifications
Temperature Rise
...................40 ˚C max. at rated current
Operating Temperature
..................................-55 °C to +125 °C
Storage Temperature..-55 °C to +125 °C
Reflow Soldering ...230 °C, 50 sec. max.
Resistance to Soldering Heat
.................................260 ˚C, 5 seconds
EMBOSSED
CAVITY
50.0
(1.969)
13.0 ± 0.5
DIA.
(.512 ± .020)
DIMENSIONS:
MM
(INCHES)
9.0
(.354)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
EMBOSSED
CARRIER
8.0
(.315)
REV. 05/05