MICROSEMI LX5251CPW

LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
KEY FEATURES
DESCRIPTION
ƒ Compliant with SCSI SPI-2
(Ultra2), SPI-3 (Ultra160), and
SPI-4 (Ultra320)
ƒ Auto-Selectable LVD or SingleEnded Termination
ƒ Fast Response, No Output
Capacitors Required
ƒ Compatible with Active Negation
Drivers
ƒ 15µA Supply Current in
Disconnect Mode
ƒ Logic Command Disconnects All
Termination Lines
ƒ Diffsense Line Driver
ƒ Ground Driver Integrated for
Single-Ended Operation
ƒ Current Limit and Thermal
Protection
ƒ Hot-Swap Compatible (SingleEnded)
ƒ Available in 24-pin TSSOP
Package
application, this pin is tied to the DIFFSENSE
input of the corresponding LVD transceivers.
This action enables the LVD transceiver
function. DIFFSENSE is capable of supplying
a maximum of 15mA.
Tying the DIFFSENSE pin high places the
LX5251 in a HI-Z state indicating the presence
of an HVD device. Tying the pin low places
the part in a single-ended mode while also
signaling the multimode transceiver to operate
in a single-ended mode.
Recognizing the needs of portable and
configurable peripherals, the LX5251 has a
TTL compatible sleep/disable mode. During
this sleep/disable mode, power dissipation is
reduced to a meager 15uA while also placing
all outputs in a HI-Z state. Also during
sleep/disable mode, the DIFFSENSE function
is disabled and is placed in a HI-Z state.
The LX5251 also provides a master / slave
function. Driving this pin high or floating the
pin enables the 1.3V DIFFSENSE reference.
Driving the pin low disables the on board
DIFFSENSE reference and enables use of an
external master reference device.
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The LX5251 is a multimode SCSI
terminator that is compatible with the
SCSI SPI-2 (Ultra2), SCSI SPI-3 (Ultra3
or Ultra160), and SCSI SPI-4 (Ultra320)
specifications developed by the T10
standards committee for low voltage
differential (LVD) termination, while
providing backwards compatibility to the
SCSI, SCSI-2, and SPI single-ended
specifications. Multimode compatibility
permits the use of legacy devices on the
bus without hardware alterations.
Automatic mode selection is achieved
through voltage detection on the
Diffsense line.
The LX5251 utilizes an industry
standard
LVD
architecture.
The
individual high bandwidth drivers
maximize channel separation, reduce
channel-to-channel noise and cross talk
to insure Ultra320 performance.
When the LX5251 is enabled, the
differential sense (DIFFSENSE) pin
supplies a voltage between 1.2V and
1.4V. In
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
PRODUCT HIGHLIGHT
-
L X 5251
-
+
+
L X 5251
LX5251
PACKAGE ORDER INFO
Plastic TSSOP
PW
24-Pin
TA (°C)
RoHS Compliant / Pb-free
Transition DC: 0442
0 to 70
LX5251CPW
Note: Available in Tape & Reel.Append the letters “TR” to the
part number. (i.e. LX5251CPW-TR)
Copyright © 2002
Rev. 1.1, 2006-02-27
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
Note:
Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
1+
12+
23+
34+
45+
5DISC
GND
THERMAL DATA
PW
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VTERM
NC
99+
88+
77+
66+
DIFFSENSE
M/Sb
PW PACKAGE
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Term Power (VTERM) ................................................................................................-0.3V to 7V
Operating Junction Temperature .......................................................................................150°C
Storage Temperature Range ............................................................................... -65°C to 150°C
Peak Package Solder Reflow Temperature (40 second maximum exposure)...... 260°C (+0, -5)
(Top View)
24 Pin Plastic TSSOP
N/C = Not internally connected
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
100°C/W
RoHS / Pb-free 100% Matte Tin Lead Finish
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow. θJA can vary significantly depending on
mounting technique.
MASTER/SLAVE FUNCTION TABLE
Master/Slave
DIFFSENSE Status
L*
HI Z
0mA
H
1.3V
10mA Source
Open (Pull-Up)
1.3V
10mA Source
* When in Low state, terminator will sense state of DIFFSENS line.
DIFFSENSE/POWER UP/POWER DOWN FUNCTION TABLE
Copyright © 2002
Rev. 1.1, 2006-02-27
Outputs
Status
Type
Quiescent
Current
L
< 0.5V
Enable
SE
55mA
L
0.7V – 1.9V
Enable
LVD
35mA
L
> 2.4V
Disable
HI-Z
8mA
H or Open
X
Disable
HI-Z
10µA
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
PACKAGE DATA
DISCONNECT DIFFSENSE
Page 2
LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
RECOMMENDED MAX OPERATING CONDITIONS
Symbol
LVD
SE
Signal Line Voltage
VTerm
VTERM
Min
Units
Max
2.9
3.5
0
5.25
5.25
5.0
0
VTERM
V
0
125
°C
Disconnect Input Voltage
Operating Junction Temperature
LX5251
Typ
TJ
V
V
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 70°C, VTerm = 4.75V,
and DISC = L.
LX5251
Parameter
Symbol
Test Conditions
Units
Min
Typ
Max
`
`
LVD Terminator Section
All term lines open
DISC > 2.0V
1.125
35
15
1.25
45
35
1.375
mA
µA
V
Open circuit between (-) and (+) terminals
100
112
125
mV
VOUT Differential = -1V to +1V
100
105
110
Ω
110
150
195
Ω
3
pF
VTerm Supply Current
LVDICC
Common Mode Voltage
VCM
Offset Voltage
VOS
Differential Terminator Impedance
ZO
Common Mode Impedance
ZCM
0.5V to 2V
Output Capacitance (Note 1)
CO
DISC > 2.0V
Mode Change Delay
tDF
Diffsense = 1.4V to 0V
100
115
300
ms
1.2
1.3
1.4
V
Diffsense Section
Diffsense Output Voltage
Diffsense Output Source Current
Diffsense Sink Current
`
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Parameter
VDIFF
IDIFF
ISINK(DIFF)
VDIFF = 0V
5
15
mA
VDIFF = 2.75V
20
200
µA
2.5
55
250
15
2.7
75
290
35
3.1
mA
mA
µA
V
18.5
22.5
24
40
65
Single Ended Section
VTerm Supply Current
Termination Output High Voltage
Output Current
SEICC
All tem lines = Open, Master/Slave = 0V
All tem lines = 0.2V, Master/Slave = 0V
DISC > 2.0V; TA = 25°
VO
IO
VOUT = 0.2V
ISINK
VOUT = 4V, All lines
Output Capacitance (Note 1)
CO
IDDQ
DISC > 2.0V
DISC > 2.0V ; VLINE = 0 to 4V, TA = 25°
DISC > 2.0V ;VTERM = Open, VLINE = 2.7V,
TA = 25°
I = 1mA
Output Leakage
IHP
Ground Driver Impedance
Copyright © 2002
Rev. 1.1, 2006-02-27
ZG
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
mA
mA
3
2
1
pF
µA
µA
100
Ω
Page 3
ELECTRICALS
Sink Current
LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
`
DISCONNECT Section
Disconnect Thresholds
VTH
Input Current
`
0.8
IIL
IIH
DISC = 0V
DISC = 2.4V
2.0
V
10
nA
µA
100
MASTER/SLAVE Section
Master/Slave Thresholds
VTH(MS)
0.8
IIL(MS)
IIH(MS)
Input Current
Master/Slave = 0V
Master/Slave = 2.4V
100
2.0
V
10
µA
nA
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ELECTRICAL CHARACTERISTICS (CONTINUED)
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 125°C, VTerm = 4.75V,
and DISCONNECT = L.
LX5251
Parameter
Symbol
Test Conditions
Units
Min
Typ
Max
Note 1: Guaranteed by design.
BLOCK DIAGRAM
VTERM
1 of 9
Terminator
Pairs
24
22.4mA
I-Limited
2.7V
Source
1.07 mA
SE
LVD
2
HVD
LVD(-)
/SE
52.5
DISC
11
SE
DISC
LVD
150
52.5
1.25V
M/S
10mA
I-Limited
1.3V
Source
13
HVD
LVD
POWER
ON
&
MODE
DELAY
DIFFB
GND
ELECTRICALS
20K
20
12
Window
Comp.
14
LVD(+)
/SE (Pseudo-GND)
1.07 mA
SE
DIFSENSE
1
HVD
DISC
SE
LATCH
HVD
LVD
Figure 1 – LX5251 Block Diagram
Copyright © 2002
Rev. 1.1, 2006-02-27
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
FUNCTIONAL PIN DESCRIPTION
DESCRIPTION
1-, 2-, 3-, 4-, 5-, 6-, 7-, 8-, 9-
Negative signal termination lines for LVD mode. Signal termination lines for SE mode.
1+, 2+, 3+, 4+, 5+, 6+, 7+, 8+, 9+
Positive signal termination lines for LVD mode. Psuedo-ground lines for SE mode.
Power supply pin for terminator. Connect to SCSI bus VTERM. Musts be
decoupled by one 4.7µF low-ESR capacitor for every three terminator devices. It is
VTERM
absolutely necessary to connect this pin to the decoupling capacitor through a very low
impedance (big traces to PCB). Keeping distances very short from the decoupling
capacitors is somewhat layout dependent and some applications may benefit from high
frequency decoupling with 0.1µF capacitors at VTERM pin.
DISCONNECT
Enables/Disables terminator. See Power Down Function Table for logic levels.
GND
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PIN NAME
Terminator ground pin. Connect to ground.
MASTER/SLAVE
DIFFSENSE
Sometimes referred to as M/S pin in this datasheet. Used to select which terminator is the
controlling device. M/S pin High or Open enables the DIFFSENSE output drive. Please
see MASTER/SLAVE Function Table.
This is a dual function pin. It drives the SCSI bus DIFFSENS line. It is also the sense pin
to detect the SCSI bus mode (LVD, SE, or HVD). DIFFSENSE output drive can be
disabled with low level on the M/S pin. Please see DIFFSENSE and MASTER/SLAVE
Function Tables. Note: Must connect Diffsense signal to Diffsense pin of LX5251.
PACKAGE DATA
Copyright © 2002
Rev. 1.1, 2006-02-27
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
PERIPHERAL
HOST
TERMPOWER
11+
VTERM
11+
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APPLICATION SCHEMATIC
TERMPOWER
VTERM
Data Lines (9)
LX5251
DISCONNECT
99+
99+
LX5251
GND
GND
DIFFSENS
DIFFSENS
4.7uF
DISCONNECT
DISC
DISC
11+
VTERM
1-
VTERM
4.7uF
1+
Data Lines (9)
LX5251
99+
99+
LX5251
DISC
DISC
GND
GND
DIFFSENS
DIFFSENS
1-
VTERM
11+
1+
VTERM
Control Lines (9)
LX5251
99+
99+
LX5251
DISC
DISC
APPLICATIONS
GND
GND
DIFFSENS
DIFFSENS
* DIFFB pin not present on the LX5251CPW. Must connect Diffsense signal to Diffsens pin of each terminator.
Figure 2 – Microsemi Application Schematic
Copyright © 2002
Rev. 1.1, 2006-02-27
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
LX5251
®
TM
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
PW
WWW . Microsemi .C OM
MECHANICAL DRAWINGS
24-Pin Thin Small Shrink Outline (TSSOP)
3 21
P
E
F
D
A H
SEATING PLANE
Dim
G
MILLIMETERS
MIN
MAX
0.85
0.95
0.19
0.30
0.09
0.20
7.70
7.90
4.30
4.50
0.65 BSC
0.05
0.15
–
1.10
0.50
0.75
0°
8°
6.25
6.55
–
0.10
L
C
M
INCHES
MIN
MAX
0.033
0.037
0.007
0.012
0.0035 0.008
0.303
0.311
0.169
0.177
0.025 BSC
0.002
0.005
–
.0433
0.020
0.030
0°
8°
0.246
0.256
–
0.004
MECHANICALS
A
B
C
D
E
F
G
H
L
M
P
*LC
B
* Lead Coplanarity
Note:
1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side.
Lead dimension shall not include solder coverage.
Copyright © 2002
Rev. 1.1, 2006-02-27
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7
LX5251
TM
®
9-Line Multimode SCSI Terminator
P RODUCTION
DATA SHEET
WWW . Microsemi .C OM
NOTES
NOTES
PRODUCTION DATA – Information contained in this document is proprietary to
Microsemi and is current as of publication date. This document may not be modified in
any way without the express written consent of Microsemi. Product processing does not
necessarily include testing of all parameters. Microsemi reserves the right to change the
configuration and performance of the product and to discontinue product at any time.
Copyright © 2002
Rev. 1.1, 2006-02-27
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 8