oH V SC AV ER OM AI SIO PL LA N IA BL S NT E TISP6L7591 *R DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS TISP6L7591 SLIC Protector Rated for Standard Lightning Wave Shapes Wave Shape Standard 2/10 GR-1089-CORE 10/700 D Package (Top View) IPP TIP 1 8 PT VS 2 7 GND NC 3 6 GND RING 4 5 PR A ±80 ITU-T K.20 & K.21 ±40 10/1000 GR-1089-CORE ±30 MD6XAND Rated for AC Fault Currents AC Device Symbol Time ITSM s A 0.01 ±5 1 ±3.5 Hz 50/60 PT (8) TIP (1) GND (7) VS (2) GND (6) Gate Trigger Current ............................................... 15 mA max. High VS Voltage ......................................................... -80 V max. PR (5) RING (4) High Holding Current ............................................. 150 mA min. ............................................ UL Recognized Components SD6XAEE Pin Symbol 1 TIP Comment Line-side TIP Pin Symbol 8 PT 7 GND Ground 6 GND Ground 5 PR Description The TISP6L7591 is a dual forward-conducting buffered p-gate overvoltage protector. It is designed to protect monolithic SLICs (Subscriber Line Interface Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. The TISP6L7591 limits voltages that exceed the SLIC supply rail voltage. The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage, VS, in the region of -20 V to -80 V. The protector gate is connected to this negative supply. This references the protection (clipping) voltage to the negative supply voltage. The negative protection voltage will then track the negative supply voltage and the overvoltage stress on the SLIC is minimized. Supply voltage 2 VS 3 NC 4 RING to Gate No Internal connection Line-side RING Comment Protected TIP to SLIC Protected RING to SLIC Note: Pins 1 and 4 must always be connected to the protection resistors shown in Figures 2 and 3 (Line Feed Circuitry). The SLIC can be connected either to the protected outputs (pins 5 and 8) or to the inputs (pins 1 and 4). Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially clipped close to the SLIC negative supply rail value. If sufficient current is available from the overvoltage, then the protector will switch into a low voltage on-state condition. As the overvoltage subsides the high holding current of TISP6L7591 crowbar prevents d.c. latchup. These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high reliability and in normal system operation they are virtually transparent. The TISP6L7591 is available in 8-pin plastic small-outline surface mount package. How To Order Device Package Carrier TISP6L7591 D (8-pin Small-Outline) R (Embossed Tape Reeled) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. For Standard Termination Finish Order As TISP6L7591DR For Lead Free Termination Finish Order As TISP6L7591DR-S TISP6L7591 SLIC Protector Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) Rating Repetitive peak TIP or RING off-state voltage, V(VS)(TIP) = 0, V(VS)(RING) = 0 Repetitive peak VS voltage, VTIP = 0, VRING = 0 Symbol Value Unit V(TIP)M , V(RING)M -100 V V(VS)M -80 V Non-repetitive peak pulse current (see Notes 1, 2 and 3) 10/1000 µs (Bellcore GR-1089-CORE, open-circuit voltage wave shape 10/1000 µs) 5/320 µs (ITU-T K.20 & K.21, open-circuit voltage wave shape 10/700 µs) 30 IPP A 40 2/10 µs (Bellcore GR-1089-CORE, open-circuit voltage wave shape 2/10 µs) 80 Non-repetitive peak on-state current, 50 Hz to 60 Hz (see Notes 1, 2 and 3) 10 ms 5 ITSM 1s A 3.5 Non-repetitive peak VS current, half sine wave 10 ms, cathodes commoned (see Note 1) I(VS)M +2 A Operating free-air temperature range TA -40 to +85 °C Storage temperature range Tstg -40 to +125 °C NOTES: 1. Initially the protector must be in thermal equilibrium. The surge may be repeated after the device returns to its initial conditions. 2. These non-repetitive rated currents are peak values for either polarity. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice the rated current value of an individual terminal pair). 3. Supply Voltage, VS , range -20 V to -80 V. Electrical Characteristics, TA = 25 °C (Unless Otherwise Noted) Parameter Test Conditions Min Typ Max Unit VF Forward voltage IP = 5 A, t P = 1 ms 3 V VFP Peak forward voltage IPP = 30 A, 10/1000 15 V IGT Gate trigger current VS = -48 V IH Holding current t P = 10 ms, VS = -48 V VT Trip voltage d.c. VSGL Dynamic trip voltage IPP = -30 A, 10/1000, VS = -48 V IRG Reverse gate current VS = -75 V, VTIP = 0, VRING = 0 dvR/dt VON IR Coff Critical rate of voltage rise On-state voltage Reverse current (Gate open) TIP or RING to GND off-state capacitance 0.2 15 -150 VS-2.8 V -63 V TA = 25 °C -5 µA TA = 70 °C -50 µA TIP or RING lead ±1000 V/µs IT = -0.5 A, t P = 1 ms -3 IT = -3.0 A, t P = 1 ms -4 VR = -85 V, IG = 0 f = 1 MHz, Vd = 1 V, IG = 0, (see Note 4) mA mA V TA = 25 °C -5 µA TA = 70 °C -50 µA VR = -3 V 50 pF VR = -48 V 40 pF NOTE 4: These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured device terminals are a.c. connected to the guard terminal of the bridge. MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP6L7591 SLIC Protector Parameter Measurement Information +i Quadrant I IPP Forward Conduction Characteristic ITSM IP VF VR -v IR +v IH VON VSGL IT ITSM Quadrant III IPP Switching Characteristic -i Figure 1. Typical Voltage-Current Characteristic of the SLIC Protector Unless Otherwise Noted, All Voltages are Referenced to the Anode Letter Symbol Definitions Symbol IH Parameter Thyristor holding current IGT Gate trigger current into VS pin IP Pulse current IPP Peak pulse current IRG Reverse current VS to TIP or RING IT TIP or RING current when thyristor is on IR Reverse current, TIP or RING to GND VF Forward voltage, TIP or RING to GND VFP Peak forward voltage, TIP or RING to GND VT Trip voltage, TIP or RING to VS VSGL Dynamic trip voltage, TIP or RING to VS VON Thyristor on voltage at IT VR TIP or RING voltage when thyristor is off Coff Off-state capacitance, TIP or RING to Ground MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. PM6XAAZ TISP6L7591 SLIC Protector APPLICATIONS INFORMATION TIP TIP (1) PT (8) Protected Tip RPT GND (7) VS VS (2) GND (6) RPR RING RING (4) PR (5) RPT and RPR must be properly selected for proper operation and/or response. Protected Ring AI6XDN Figure 2. Standard Configuration IP TIP (1) PT (8) RPT VMEAS GND (7) -48 V VS (2) GND (6) VMEAS RPR AI6XDO IP RING (4) PR (5) Figure 3. Test Circuit MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP6L7591 SLIC Protector MECHANICAL DATA Device Symbolization Code Devices will be coded as below. Device Symbolization Code TISP6L7591D L7591 MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP6L7591 SLIC Protector MECHANICAL DATA D008 Plastic Small-outline Package This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound is designed to withstand normal soldering temperatures with no deformation and circuit performance characteristics will remain stable when operated in most high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. D008 8-pin Small Outline Microelectronic Standard Package MS-012, JEDEC Publication 95 4.80 - 5.00 (0.189 - 0.197) 5.80 - 6.20 (0.228 - 0.244) 8 7 6 5 1 2 3 4 INDEX 3.81 - 4.00 (0.150 - 0.157) 1.35 - 1.75 (0.053 - 0.069) 7 ° NOM 3 Places 0.25 - 0.50 x 45 ° N0M (0.010 - 0.020) 0.102 - 0.203 (0.004 - 0.008) 0.28 - 0.79 (0.011 - 0.031) DIMENSIONS ARE: NOTES: A. B. C. D. Pin Spacing 1.27 (0.050) (see Note A) 6 places 0.36 - 0.51 (0.014 - 0.020) 8 Places 4.60 - 5.21 (0.181 - 0.205) 7 ° NOM 4 Places 0.190 - 0.229 (0.0075 - 0.0090) 4°±4° 0.51 - 1.12 (0.020 - 0.044) MILLIMETERS (INCHES) Leads are within 0.25 (0.010) radius of true position at maximum material condition. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion shall not exceed 0.15 (0.006). Lead tips to be planar within ±0.051 (0.002). MDXXAA E MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP6L7591 SLIC Protector MECHANICAL DATA D008 Tape DImensions D008 Package (8-pin Small Outline) Single-Sprocket Tape 3.90 - 4.10 (.154 - .161) 1.50 - 1.60 (.059 - .063) 1.95 - 2.05 (.077 - .081) 7.90 - 8.10 (.311 - .319) 0.8 MIN. (.03) 0.40 (.016) 5.40 - 5.60 (.213 - .220) 11.70 - 12.30 (.461 - .484) ø 1.50 MIN. (.059) 6.30 - 6.50 (.248 - .256) Carrier Tape Embossment DIMENSIONS ARE: 0 MIN. Direction of Feed Cover Tape 2.0 - 2.2 (.079 - .087) MILLIMETERS (INCHES) NOTES: A. Taped devices are supplied on a reel of the following dimensions:Reel diameter: 330 +0.0/-4.0 (12.99 +0.0/-.157) Reel hub diameter: 100 ± 2.0 (3.937 ± .079) Reel axial hole: 13.0 ± 0.2 (.512 ± .008) B. 2500 devices are on a reel. “TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. “Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries. MAY 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MDXXATC