TI UCC28703

UCC28700, UCC28701
UCC28702, UCC28703
www.ti.com
SLUSB41 – JULY 2012
Constant-Voltage, Constant-Current Controller
With Primary-Side Regulation
Check for Samples: UCC28700, UCC28701, UCC28702, UCC28703
FEATURES
DESCRIPTION
•
•
The UCC28700 family of flyback power supply
controllers provides Constant-Voltage (CV) and
Constant-Current (CC) output regulation without the
use of an optical coupler. The devices process
information from the primary power switch and an
auxiliary flyback winding for precise control of output
voltage and current. Low start-up current,
dynamically-controlled operating states and a tailored
modulation profile support very low stand-by power
without sacrificing start-up time or output transient
response.
1
•
•
•
•
•
•
•
•
•
•
< 30-mW No-Load Power for 5-Star Rating
Primary-Side Regulation (PSR) Eliminates
Opto-Coupler
±5% Voltage and Current Regulation
130-kHz Maximum Switching Frequency
Enables High-Power Density Charger Designs
Quasi-Resonant Valley-Switching Operation
for Highest Overall Efficiency
Patent-Pending Frequency-Jitter Scheme to
Ease EMI Compliance
Wide VDD Range Allows Small Bias Capacitor
Clamped Gate-Drive Output for MOSFET
Protection Functions: Over-Voltage, Low-Line,
and Over-Current
Programmable Cable Compensation
(UCC28700 only)
NTC Resistor Interface (UCC28701, UCC28702
and UCC28703 only) with Fixed Cable
Compensation Options
SOT23-6 Package
APPLICATIONS
•
•
USB-Compliant Adapters and Chargers for
Consumer Electronics (cell phones, tablets
and cameras)
AC and DC Power Supplies
Control algorithms in the UCC28700 family allow
operating efficiencies to meet or exceed applicable
standards. The output drive interfaces to a MOSFET
power switch. Discontinuous Conduction Mode
(DCM) with valley switching reduces switching losses.
Modulation of switching frequency and primary
current peak amplitude (FM and AM) keeps the
conversion efficiency high across the entire load and
line ranges.
The controllers have a maximum switching frequency
of 130 kHz and always maintain control of the peakprimary current in the transformer. Protection features
help keep primary and secondary component
stresses in check. The UCC28700 allows the level of
cable compensation to be programmed. The
UCC28701, UCC28702 and UCC28703 devices allow
remote temperature sensing using a Negative
Temperature Coefficient (NTC) resistor while
providing fixed cable-compensation levels.
Simplified Application Diagram and Typical V-I Regulation
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
UCC28700, UCC28701
UCC28702, UCC28703
SLUSB41 – JULY 2012
www.ti.com
Table 1. PRODUCT INFORMATION (1) (2)
PART NUMBER
PACKAGED DEVICES
UCC28700
UCC28701
SOT23 6-Pin (DBV)
UCC28702
UCC28703
(1)
(2)
VERSION
Programmable cable compensation
NTC, 0 mV (at 5-V output) cable compensation option
NTC, 150 mV (at 5-V output) cable compensation option
NTC, 300 mV (at 5-V output) cable compensation option
See Addendum for specific device ordering information.
For other fixed cable compensation options, please consult the factory.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Bias supply voltage
VVDD
38
Continuous gate current sink
IDRV
50
Continuous gate current source
IDRV
Selflimiting
Peak VS pin current
IVS
Gate-drive voltage at DRV
−0.5
Selflimiting
−0.75
7
Voltage range
CS, CBC (UCC28700),
NTC (UCC28701/2/3)
−0.5
5
Operating junction temperature range
TJ
−55
150
Storage temperature
TSTG
−65
150
VS
Lead temperature 0.6 mm from case for 10 seconds
(1)
2
mA
−1.2
VDRV
V
°C
260
Human-body model (HBM)
ESD rating
V
2000
Charged-device model (CDM)
500
V
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages
are with respect to GND. Currents are positive into, negative out of the specified terminal. These ratings apply over the operating
ambient temperature ranges unless otherwise noted.
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SLUSB41 – JULY 2012
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VDD
Bias supply operating voltage
CVDD
VDD bypass capacitor
9
35
V
0.047
1
µF
RCBC
Cable-compensation resistance
10
kΩ
IVS
VS pin current
−1
mA
TJ
Operating junction temperature
−20
125
°C
THERMAL INFORMATION
UCC28700/1/2/3
THERMAL METRIC (1)
DBV
UNITS
6 PINS
θJA
Junction-to-ambient thermal resistance (2)
180.0
θJCtop
Junction-to-case (top) thermal resistance (3)
71.2
θJB
Junction-to-board thermal resistance (4)
44.4
ψJT
Junction-to-top characterization parameter (5)
5.1
ψJB
Junction-to-board characterization parameter (6)
43.8
(1)
(2)
(3)
(4)
(5)
(6)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
Copyright © 2012, Texas Instruments Incorporated
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, VDD = 25 V, RCBC = RNTC = open, -20°C ≤ TA ≤ 125°C, TJ = TA
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Bias Supply Input
IRUN
Supply current, run
IDRV = 0, run state
2.1
2.65
IWAIT
Supply current, wait
IDRV = 0, wait state
85
110
ISTART
Supply current, start
IDRV = 0, VVDD = 18 V, start state
1.0
1.5
IFAULT
Supply current, fault
IDRV = 0, fault state
2.1
2.8
mA
µA
mA
Under-Voltage Lockout
VVDD(on)
VDD turn-on threshold
VVDD low to high
19
21
23
VVDD(off)
VDD turn-off threshold
VVDD high to low
7.7
8.1
8.45
VVSR
Regulating level
Measured at no-load condition, TJ = 25°C
4.01
4.05
4.09
V
VVSNC
Negative clamp level
IVS = -300 µA, volts below ground
190
250
325
mV
IVSB
Input bias current
VVS = 4 V
-0.25
0
0.25
µA
V
VS Input
CS Input
VCST(max) Max CS threshold voltage
VVS = 3.7 V (1)
715
750
775
VCST(min)
Min CS threshold voltage
VVS = 4.35 V (1)
230
250
270
KAM
AM control ratio
VCST(max) / VCST(min)
2.75
3.0
3.15
V/V
VCCR
constant-current regulating
level
CC regulation constant
310
319
329
mV
KLC
Line compensating current
ratio
IVSLS = -300 µA, IVSLS / current out of CS pin
23
25
28
A/A
TCSLEB
Leading-edge blanking time
DRV output duration, VCS = 1 V
195
235
275
ns
IDRS
DRV source current
VDRV = 8 V, VVDD = 9 V
20
25
RDRVLS
DRV low-side drive resistance IDRV = 10 mA
VDRCL
DRV clamp voltage
RDRVSS
DRV pull-down in start state
mV
DRV
mA
6
12
Ω
14
16
V
150
200
230
kΩ
120
130
140
kHz
875
1000
1100
Hz
1.8
2.1
2.45
µs
VVDD = 35 V
Timing
fSW(max)
Maximum switching frequency VVS = 3.7 V (1)
fSW(min)
Minimum switching frequency
TZTO
Zero-crossing timeout delay
(1)
4
VVS = 4.35 V
(1)
These devices automatically vary the control frequency and current sense thresholds to improve EMI performance, these threshold
voltages and frequency limits represent average levels.
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SLUSB41 – JULY 2012
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range, VDD = 25 V, RCBC = RNTC = open, -20°C ≤ TA ≤ 125°C, TJ = TA
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Protection
VOVP
Over-voltage threshold
At VS input, TJ = 25°C
4.52
4.6
4.68
VOCP
Over-current threshold
At CS input
1.4
1.5
1.6
IVSL(run)
VS line-sense run current
Current out of VS pin – increasing
190
220
260
IVSL(stop)
VS line-sense stop current
Current out of VS pin – decreasing
70
80
95
KVSL
VS line-sense ratio
IVSL(run) / IVSL(stop)
2.5
2.8
3.05
TJ(stop)
Thermal shut-down
temperature
Internal junction temperature
165
V
µA
A/A
°C
Cable Compensation (UCC28700 only)
VCBC(max)
Cable compensation
maximum voltage
Voltage at CBC at full load
2.8
3.0
3.4
VCVS(min)
Compensation at VS
VCBC = open, change in VS regulating level at full
load
-45
-15
25
VCVS(max)
Maximum compensation at
VS
VCBC = 0 V, change in VS regulating level at full
load
275
320
365
-45
-15
25
V
mV
Cable Compensation (UCC28701/2/3 only)
VCVS
Compensation at VS
(UCC28701)
Change in VS regulating level at full load
VCVS
Compensation at VS
(UCC28702)
Change in VS regulating level at full load
100
VCVS
Compensation at VS
(UCC28703)
Change in VS regulating level at full load
200
mV
NTC Input (UCC28701/2/3 only)
VNTCTH
NTC shut-down threshold
Fault UVLO cycle when below this threshold
0.95
V
INTC
NTC pull-up current
Current out of pin
105
µA
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DEVICE INFORMATION
Functional Block Diagram
6
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SLUSB41 – JULY 2012
DBV Package
(Top View)
CBC (00)
NTC (01)
1
6
VS
VDD
2
5
GND
DRV
3
4
CS
Table 2. TERMINAL FUNCTIONS
PIN
DESCRIPTION
NAME
NO.
I/O
CBC
(UCC28700)
1
I
CaBle Compensation is a programming pin for compensation of cable voltage drop.
Cable compensation is programmed with a resistor to GND.
CS
4
I
Current Sense input connects to a ground-referenced current-sense resistor in series
with the power switch. The resulting voltage is used to monitor and control the peak
primary current. A series resistor can be added to this pin to compensate the peak
switch current levels as the AC-mains input varies.
DRV
3
O
DRriVe is an output used to drive the gate of an external high voltage MOSFET
switching transistor.
The GrouND pin is both the reference pin for the controller and the low-side return for
the drive output. Special care should be taken to return all AC decoupling capacitors as
close as possible to this pin and avoid any common trace length with analog signal
return paths.
GND
5
—
NTC
(UCC28701/2/3)
1
I
NTC is an interface to an external NTC (negative temperature coefficient) resistor for
remote temperature sensing. Pulling this pin low shuts down PWM action.
VDD
2
—
VDD is the bias supply input pin to the controller. A carefully-placed bypass capacitor
to GND is required on this pin.
VS
6
I
Copyright © 2012, Texas Instruments Incorporated
Voltage Sense is an input used to provide voltage and timing feedback to the controller.
This pin is connected to a voltage divider between an auxiliary winding and GND. The
value of the upper resistor of this divider is used to program the AC-mains run and stop
thresholds and line compensation at the CS pin.
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Detailed Pin Description
VDD (Device Bias Voltage Supply): The VDD pin is connected to a bypass capacitor to ground and a start-up
resistance to the input bulk capacitor (+) terminal. The VDD turn-on UVLO threshold is 21 V and turn-off UVLO
threshold is 8.1 V, with an available operating range up to 35 V. The USB charging specification requires the
output current to operate in constant-current mode from 5 V to a minimum of 2 V; this is easily achieved with a
nominal VDD of approximately 25 V. The additional VDD headroom up to 35 V allows for VDD to rise due to the
leakage energy delivered to the VDD capacitor in high-load conditions. Also, the wide VDD range provides the
advantage of selecting a relatively small VDD capacitor and high-value start-up resistance to minimize no-load
stand-by power loss in the start-up resistor.
GND (Ground): This is a single ground reference external to the device for the gate drive current and analog
signal reference. Place the VDD bypass capacitor close to GND and VDD with short traces to minimize noise on
the VS and CS signal pins.
VS (Voltage-Sense): The VS pin is connected to a resistor divider from the auxiliary winding to ground. The
output-voltage feedback information is sampled at the end of the transformer secondary current demagnetization
time to provide an accurate representation of the output voltage. Timing information to achieve valley-switching
and to control the duty cycle of the secondary transformer current is determined by the waveform on the VS pin.
Avoid placing a filter capacitor on this input which would interfere with accurate sensing of this waveform.
The VS pin also senses the bulk capacitor voltage to provide for AC-input run and stop thresholds, and to
compensate the current-sense threshold across the AC-input range. This information is sensed during the
MOSFET on-time. For the AC-input run/stop function, the run threshold on VS is 220 µA and the stop threshold
is 80 µA. The values for the auxilliary voltage divider upper-resistor RS1 and lower-resistor RS2 can be
determined by the equations below.
where
•
•
•
NPA is the transformer primary-to-auxiliary turns ratio,
VIN(run) is the AC RMS voltage to enable turn-on of the controller (run),
IVSL(run) is the run-threshold for the current pulled out of the VS pin during the MOSFET on-time. (see
ELECTRICAL CHARACTERISTICS)
(1)
VOCV is the converter regulated output voltage,
VF is the output rectifier forward drop at near-zero current,
NAS is the transformer auxiliary to secondary turns ratio,
RS1 is the VS divider high-side resistance,
VVSR is the CV regulating level at the VS input (see ELECTRICAL CHARACTERISTICS).
(2)
where
•
•
•
•
•
DRV (Gate Drive): The DRV pin is connected to the MOSFET gate pin, usually through a series resistor. The
gate driver provides a gate-drive signal limited to 14 V. The turn-on characteristic of the driver is a 25-mA current
source which limits the turn-on dv/dt of the MOSFET drain and reduces the leading-edge current spike, but still
provides gate-drive current to overcome the Miller plateau. The gate-drive turn-off current is determined by the
low-side driver RDS(on) and any external gate-drive resistance. The user can reduce the turn-off MOSFET drain
dv/dt by adding external gate resistance.
8
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SLUSB41 – JULY 2012
CS (Current Sense): The current-sense pin is connected through a series resistor (RLC) to the current-sense
resistor (RCS). The current-sense threshold is 0.75 V for IPP(max) and 0.25 V for IPP(min). The series resistor RLC
provides the function of feed-forward line compensation to eliminate change in IPP due to change in di/dt and the
propagation delay of the internal comparator and MOSFET turn-off time. There is an internal leading-edge
blanking time of 235 ns to eliminate sensitivity to the MOSFET turn-on current spike. It should not be necessary
to place a bypass capacitor on the CS pin. The value of RCS is determined by the target output current in
constant-current (CC) regulation. The values of RCS and RLC can be determined by the equations below. The
term ηXFMR is intended to account for the energy stored in the transformer but not delivered to the secondary.
This includes transformer resistance and core loss, bias power, and primary-to-secondary leakage ratio.
Example: With a transformer core and winding loss of 5%, primary-to-secondary leakage inductance of 3.5%,
and bias power to output power ratio of 1.5%. The ηXFMR value is approximately: 1 - 0.05 - 0.035 - 0.015 = 0.9.
where
•
•
•
•
RLC =
VCCR is a current regulation constant (see ELECTRICAL CHARACTERISTICS),
NPS is the transformer primary-to-secondary turns ratio (a ratio of 13 to 15 is recommended for 5-V output),
IOCC is the target output current in constant-current regulation,
ηXFMR is the transformer efficiency.
(3)
KLC ´ RS1 ´ RCS ´ TD ´ NPA
LP
where
•
•
•
•
•
•
RS1 is the VS pin high-side resistor value,
RCS is the current-sense resistor value,
TD is the current-sense delay including MOSFET turn-off delay, add ~50 ns to MOSFET delay,
NPA is the transformer primary-to-auxiliary turns ratio,
LP is the transformer primary inductance,
KLC is a current-scaling constant (see ELECTRICAL CHARACTERISTICS).
(4)
CBC (Cable Compensation), Pin 1 UCC28700: The cable compensation pin is connected to a resistor to
ground to program the amount of output voltage compensation to offset cable resistance. The cable
compensation block provides a 0-V to 3-V voltage level on the CBC pin corresponding to 0 to IOCC output current.
The resistance selected on the CBC pin programs a current mirror that is summed into the VS feedback divider
therefore increasing the output voltage as IOUT increases. There is an internal series resistance of 28 kΩ to the
CBC pin which sets a maximum cable compensation of a 5-V output to 400 mV when CBC is shorted to ground.
The CBC resistance value can be determined by the equation below.
where
•
•
•
•
•
VO is the output voltage,
VF is the diode forward voltage,
VOCBC is the target cable compensation voltage at the output terminals,
VCBC(max) is the maximum voltage at the cable compensation pin at the maximum converter output current (see
ELECTRICAL CHARACTERISTICS),
VVSR is the CV regulating level at the VS input (see ELECTRICAL CHARACTERISTICS).
(5)
NTC (NTC Thermistor Shut-down), Pin 1 UCC28701/2/3: These versions of the UCC28700 family utilize pin 1
for an external NTC thermistor to allow user-programmable external thermal shut-down. The shut-down threshold
is 0.95 V with an internal 105-µA current source which results in a 9.05-kΩ thermistor shut-down threshold.
These controllers have either zero or fixed internal cable compensation.
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TYPICAL CHARACTERISTICS
At VDD = 25 V, unless otherwise noted.
10
10
Run State
IRUN, VDD = 25 V
1
IVDD − Bias Supply Current (mA)
IVDD − Bias Supply Current (mA)
1
Wait State
0.1
0.01
VDD Turn−Off
0.001
VDD Turn−On
IWAIT, VDD = 25 V
0.1
0.01
0.001
0.0001
ISTART, VDD = 18 V
Start State
0.00001
0
5
10
15
20
25
VDD − Bias Supply Voltage (V)
30
35
0.0001
−25
0
25
50
75
TJ − Temperature (°C)
100
G001
G002
Figure 1. Bias Supply Current vs. Bias Supply Voltage
Figure 2. Bias Supply Current vs. Temperature
300
4.10
250
VS Line Sense Current (µA)
VVSR − VS Regulation Voltage (V)
4.08
4.06
4.04
4.02
4.00
IVSLRUN
200
150
IVSLSTOP
100
50
3.98
3.96
−25
0
25
50
75
TJ − Temperature (°C)
100
125
0
−20
5
30
55
80
TJ − Temperature (°C)
105
G003
Figure 3. VS Regulation Voltage vs. Temperature
10
125
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125
G004
Figure 4. Line-Sense Current vs. Temperature
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SLUSB41 – JULY 2012
TYPICAL CHARACTERISTICS (continued)
At VDD = 25 V, unless otherwise noted.
330
VCCR − Constant Current Regulating Level (mV)
VCSTMIN − Minimum CS Threshold Voltage (mV)
270
265
260
255
250
245
240
235
230
−25
0
25
50
75
TJ − Temperature (°C)
100
325
320
315
310
−25
125
0
25
50
75
TJ − Temperature (°C)
100
G005
125
G006
Figure 5. Minimum CS Threshold Voltage vs. Temperature
Figure 6. Constant-Current Regulating Level vs.
Temperature
1100
34
1075
32
1050
IDRS − DRV Source Current (mA)
FSWMIN − Minimum Switching Frequency (Hz)
VDRV = 8 V, VVDD = 9 V
1025
1000
975
950
925
28
26
24
22
900
875
−25
30
0
25
50
75
TJ − Temperature (°C)
100
125
20
−25
0
25
50
75
TJ − Temperature (°C)
100
G007
Figure 7. Minimum Switching Frequency vs. Temperature
Copyright © 2012, Texas Instruments Incorporated
125
G008
Figure 8. DRV Source Current vs. Temperature
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TYPICAL CHARACTERISTICS (continued)
At VDD = 25 V, unless otherwise noted.
120
115
0.98
INTC −NTC Pull−up Current (µA)
VNTCTH − NTC Shutdown Threshold Voltage (V)
1.00
0.96
0.94
0.92
110
105
100
95
0.90
−25
0
25
50
75
TJ − Temperature (°C)
100
125
90
−25
0
25
50
75
TJ − Temperature (°C)
100
G009
Figure 9. NTC Shut-down Threshold Voltage vs.
Temperature
125
G010
Figure 10. NTC Pull-Up Current vs. Temperature
4.68
VOVP − VS Over−Voltage Threshold (V)
4.66
4.64
4.62
4.60
4.58
4.56
4.54
4.52
−25
0
25
50
75
TJ − Temperature (°C)
100
125
G011
Figure 11. Over-Voltage Threshold vs. Temperature
12
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FUNCTIONAL DESCRIPTION
The UCC28700 is a flyback power supply controller which provides accurate voltage and constant current
regulation with primary-side feedback, eliminating the need for opto-coupler feedback circuits. The controller
operates in discontinuous conduction mode with valley-switching to minimize switching losses. The modulation
scheme is a combination of frequency and primary peak current modulation to provide high conversion efficiency
across the load range. The control law provides a wide-dynamic operating range of output power to achieve the
<30-mW stand-by power requirement.
Another feature beneficial to achieve low stand-by power without excessive start-up time is a wide operating
VDD range to allow a high-value VDD start-up resistance and low-value VDD capacitance. During low-power
operating ranges the device has power management features to reduce the device operating current at operating
frequencies below 44 kHz. The UCC28700 controller includes features in the modulator to reduce the EMI peak
energy of the fundamental switching frequency and harmonics. Accurate voltage and constant current regulation,
fast dynamic response, and fault protection are achieved with primary-side control. A complete charger solution
can be realized with a straightforward design process, low cost and low component count.
Primary-Side Voltage Regulation
Figure 12 illustrates a simplified flyback convertor with the main voltage regulation blocks of the device shown.
The power train operation is the same as any DCM flyback circuit but accurate output voltage and current
sensing is the key to primary-side control.
Figure 12. Simplified Flyback Convertor
(with the main voltage regulation blocks)
In primary-side control, the output voltage is sensed on the auxiliary winding during the transfer of transformer
energy to the secondary. As shown in Figure 13 it is clear there is a down slope representing a decreasing total
rectifier VF and resistance voltage drop (ISRS) as the secondary current decreases to zero. To achieve an
accurate representation of the secondary output voltage on the auxiliary winding, the discriminator reliably blocks
the leakage inductance reset and ringing, continuously samples the auxiliary voltage during the down slope after
the ringing is diminished, and captures the error signal at the time the secondary winding reaches zero current.
The internal reference on VS is 4.05 V; the resistor divider is selected as outlined in the VS pin description.
Figure 13. Auxiliary Winding Voltage
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The UCC28700 VS signal sampler includes signal discrimination methods to ensure an accurate sample of the
output voltage from the auxiliary winding. There are however some details of the auxiliary winding signal to
ensure reliable operation, specifically the reset time of the leakage inductance and the duration of any
subsequent leakage inductance ring. Refer to Figure 14 below for a detailed illustration of waveform criteria to
ensure a reliable sample on the VS pin. The first detail to examine is the duration of the leakage inductance reset
pedestal, TLK_RESET in Figure 14. Since this can mimic the waveform of the secondary current decay, followed by
a sharp downslope, it is important to keep the leakage reset time less than 500 ns for IPRI minimum, and less
than 1.5 µs for IPRI maximum. The second detail is the amplitude of ringing on the VAUX waveform following
TLK_RESET. The peak-to-peak voltage at the VS pin should be less than approximately 100 mVp-p at least 200 ns
before the end of the demagnetization time, tDM. If there is a concern with excessive ringing, it usually occurs
during light or no-load conditions, when tDM is at the minimum. The tolerable ripple on VS is scaled up to the
auxiliary winding voltage by RS1 and RS2, and is equal to 100 mV x (RS1 + RS2) / RS2.
TLK RESET
TSMPL
VS ring p-p
TDM
Figure 14. Auxiliary Waveform Details
During voltage regulation, the controller operates in frequency modulation mode and amplitude modulation mode
as illustrated in Figure 15 below. The internal operating frequency limits of the device are 130 kHz maximum and
1 kHz minimum. The transformer primary inductance and primary peak current chosen sets the maximum
operating frequency of the converter. The output preload resistor and efficiency at low power determines the
converter minimum operating frequency. There is no stability compensation required for the UCC28700
controller.
Figure 15. Frequency and Amplitude Modulation Modes
(during voltage regulation)
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Primary-Side Current Regulation
Timing information at the VS pin and current information at the CS pin allow accurate regulation of the secondary
average current. The control law dictates that as power is increased in CV regulation and approaching CC
regulation the primary-peak current is at IPP(max). Referring to Figure 16 below, the primary-peak current, turns
ratio, secondary demagnetization time (tDM), and switching period (TSW) determine the secondary average output
current. Ignoring leakage inductance effects, the average output current is given by Equation 6. When the
average output current reaches the regulation reference in the current control block, the controller operates in
frequency modulation mode to control the output current at any output voltage at or below the voltage regulation
target as long as the auxiliary winding can keep VDD above the UVLO turn-off threshold.
IPP
IS x N S/NP
tON
tDM
T SW
Figure 16. Transformer Currents
(6)
Figure 17. Typical Target Output V-I Characteristic
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Valley-Switching
The UCC28700 utilizes valley-switching to reduce switching losses in the MOSFET, to reduce induced-EMI, and
to minimize the turn-on current spike at the sense resistor. The controller operates in valley-switching in all load
conditions unless the VDS ringing has diminished.
Referring to Figure 18 below, the UCC28700 operates in a valley-skipping mode in most load conditions to
maintain an accurate voltage or current regulation point and still switch on the lowest available VDS voltage.
VDS
VDRV
Figure 18. Valley-Skipping Mode
Start-Up Operation
Upon application of input voltage to the converter, the start-up resistor connected to VDD from the bulk capacitor
voltage (VBLK) charges the VDD capacitor. During charging of the VDD capacitor the device bias supply current is
less than 1.5 µA. When VDD reaches the 21-V UVLO turn-on threshold, the controller is enabled and the
converter starts switching. The initial three cycles are limited to IPP(min). This allows sensing any initial input or
output faults with minimal power delivery. After the initial three cycles at minimum IPP(min), the controller responds
to the condition dictated by the control law. The converter remains in discontinuous mode during charging of the
output capacitor(s), maintaining a constant output current until the output voltage is in regulation.
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Fault Protection
There is comprehensive fault protection incorporated into the UCC28700. Protection functions include:
• Output over voltage
• Input under voltage
• Internal over temperature
• Primary over-current fault
• CS pin fault
• VS pin fault
A UVLO reset and restart sequence applies for all fault protection events.
The output over-voltage function is determined by the voltage feedback on the VS pin. If the voltage sample on
VS exceeds 115% of the nominal VOUT, the device stops switching and keeps the internal circuitry enabled to
discharge the VDD capacitor to the UVLO turn-off threshold. After that, the device returns to the start state and a
start-up sequence ensues.
The UCC28700 always operates with cycle-by-cycle primary peak current control. The normal operating range of
the CS pin is 0.75 V to 0.25 V. There is additional protection if the CS pin reaches 1.5 V. This results in a UVLO
reset and restart sequence. There is no leading-edge blanking on the 1.5-V threshold on CS.
The line input run and stop thresholds are determined by current information at the VS pin during the MOSFET
on-time. While the VS pin is clamped close to GND during the MOSFET on-time, the current through RS1 is
monitored to determine a sample of the bulk capacitor voltage. A wide separation of run and stop thresholds
allows clean start-up and shut-down of the power supply with the line voltage. The run current threshold is 220
µA and the stop current threshold is 80 µA.
The internal over-temperature protection threshold is 165°C. If the junction temperature reaches this threshold
the device initiates a UVLO reset cycle. If the temperature is still high at the end of the UVLO cycle, the
protection cycle repeats.
Protection is included in the event of component failures on the VS pin. If complete loss of feedback information
on the VS pin occurs, the controller stops switching and restarts.
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DESIGN PROCEDURE
This procedure outlines the steps to design a constant-voltage, constant-current flyback converter using the
UCC28700 family of controllers. Refer to the Figure 19 for component names and network locations. The design
procedure equations use terms that are defined below.
Figure 19. Design Procedure Application Example
Definition of Terms
Capacitance Terms in Farads
• CBULK: total input capacitance of CB1 and CB2.
• CDD: minimum required capacitance on the VDD pin.
• COUT: minimum output capacitance required.
Duty Cycle Terms
• DMAGCC: secondary diode conduction duty cycle in CC, 0.425.
• DMAX: MOSFET on-time duty cycle.
Frequency Terms in Hertz
• fLINE: minimum line frequency.
• fMAX: target full-load maximum switching frequency of the converter.
• fMIN: minimum switching frequency of the converter, add 15% margin over the fSW(min) limit of the device.
• fSW(min): minimum switching frequency (see ELECTRICAL CHARACTERISTICS).
Current Terms in Amperes
• IOCC: converter output constant-current target.
• IPP(max): maximum transformer primary current.
• ISTART: start-up bias supply current (see ELECTRICAL CHARACTERISTICS).
• ITRAN: required positive load-step current.
• IVSL(run): VS pin run current (see ELECTRICAL CHARACTERISTICS).
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Current and Voltage Scaling Terms
• KAM: maximum-to-minimum peak primary current ratio (see ELECTRICAL CHARACTERISTICS).
• KLC: current-scaling constant (see ELECTRICAL CHARACTERISTICS).
Transformer Terms
• LP: transformer primary inductance.
• NAS: transformer auxiliary-to-secondary turns ratio.
• NPA: transformer primary-to-auxiliary turns ratio.
• NPS: transformer primary-to-secondary turns ratio.
Power Terms in Watts
• PIN: converter maximum input power.
• POUT: full-load output power of the converter.
• PRSTR: VDD start-up resistor power dissipation.
• PSB: total stand-by power.
• PSB_CONV: PSB minus start-up resistor and snubber losses.
Resistance Terms in Ω
• RCS: primary current programming resistance.
• RESR: total ESR of the output capacitor(s).
• RPL: preload resistance on the output of the converter.
• RS1: high-side VS pin resistance.
• RS2: low-side VS pin resistance.
• RSTR: maximum start-up resistance to achieve the turn-on time target.
• RSTR: VDD start-up resistance.
Timing Terms in Seconds
• TD: current-sense delay including MOSFET turn-off delay; add 50 ns to MOSFET delay.
• TDMAG(min): minimum secondary rectifier conduction time.
• TON(min): minimum MOSFET on time.
• TR: resonant frequency during the DCM (discontinuous conduction mode) time.
• TSTR: converter start-up time requirement.
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Voltage Terms in Volts
• VBLK: highest bulk capacitor voltage for stand-by power measurement.
• VBULK(min): minimum voltage on CB1 and CB2 at full power.
• VOCBC: target cable compensation voltage at the output terminals.
• VCBC(max): maximum voltage at the CBC pin at the maximum converter output current (see ELECTRICAL
CHARACTERISTICS).
• VCCR: constant-current regulating voltage (see ELECTRICAL CHARACTERISTICS).
• VCST(max): CS pin maximum current-sense threshold (see ELECTRICAL CHARACTERISTICS).
• VCST(min): CS pin minimum current-sense threshold (see ELECTRICAL CHARACTERISTICS).
• VDD(off): UVLO turn-off voltage (see ELECTRICAL CHARACTERISTICS).
• VDD(on): UVLO turn-on voltage (see ELECTRICAL CHARACTERISTICS).
• VOΔ: output voltage drop allowed during the load-step transient.
• VDSPK: peak MOSFET drain-to-source voltage at high line.
• VF: secondary rectifier forward voltage drop at near-zero current.
• VFA: auxiliary rectifier forward voltage drop.
• VLK: estimated leakage inductance energy reset voltage.
• VOCV: regulated output voltage of the converter.
• VOCC: target lowest converter output voltage in constant-current regulation.
• VREV: peak reverse voltage on the secondary rectifier.
• VRIPPLE: output peak-to-peak ripple voltage at full-load.
• VVSR: CV regulating level at the VS input (see ELECTRICAL CHARACTERISTICS).
AC Voltage Terms in VRMS
• VIN(max): maximum input voltage to the converter.
• VIN(min): minimum input voltage to the converter.
• VIN(run): converter input start-up (run) voltage.
Efficiency Terms
• ηSB: estimated efficiency of the converter at no-load condition, not including start-up resistance or bias losses.
For a 5-V USB charger application, 60% to 65% is a good initial estimate.
• η: converter overall efficiency.
• ηXFMR: transformer primary-to-secondary power transfer efficiency.
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Stand-by Power Estimate
Assuming no-load stand-by power is a critical design parameter, determine estimated no-load power based on
target converter maximum switching frequency and output power rating.
The following equation estimates the stand-by power of the converter.
(7)
For a typical USB charger application, the bias power during no-load is approximately 2.5 mW. This is based on
25-V VDD and 100-µA bias current. The output preload resistor can be estimated by VOCV and the difference in
the converter stand-by power and the bias power. The equation for output preload resistance accounts for bias
power estimated at 2.5 mW.
(8)
Typical start-up resistance values for RSTR range from 13 MΩ to 20 MΩ to achieve 1-s start-up time. The
capacitor bulk voltage for the loss estimation is the highest voltage for the stand-by power measurement,
typically 325 VDC.
(9)
For the total stand-by power estimation add an estimated 2.5 mW for snubber loss to the start-up resistance and
converter stand-by power loss.
(10)
Input Bulk Capacitance and Minimum Bulk Voltage
Determine the minimum voltage on the input capacitance, CB1 and CB2 total, in order to determine the maximum
Np to Ns turns ratio of the transformer. The input power of the converter based on target full-load efficiency,
minimum input RMS voltage, and minimum AC input frequency are used to determine the input capacitance
requirement.
Maximum input power is determined based on VOCV, IOCC, and the full-load efficiency target.
(11)
The below equation provides an accurate solution for input capacitance based on a target minimum bulk
capacitor voltage. To target a given input capacitance value, iterate the minimum capacitor voltage to achieve the
target capacitance.
(12)
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Transformer Turns Ratio, Inductance, Primary-Peak Current
The maximum primary-to-secondary turns ratio can be determined by the target maximum switching frequency at
full load, the minimum input capacitor bulk voltage, and the estimated DCM quasi-resonant time.
Initially determine the maximum available total duty cycle of the on time and secondary conduction time based on
target switching frequency and DCM resonant time. For DCM resonant time, assume 500 kHz if you do not have
an estimate from previous designs. For the transition mode operation limit, the period required from the end of
secondary current conduction to the first valley of the VDS voltage is ½ of the DCM resonant period, or 1 µs
assuming 500-kHz resonant frequency. DMAX can be determined using the equation below.
(13)
Once DMAX is known, the maximum turns ratio of the primary to secondary can be determined with the equation
below. DMAGCC is defined as the secondary diode conduction duty cycle during constant-current, CC, operation. It
is set internally by the UCC28700 at 0.425. The total voltage on the secondary winding needs to be determined;
which is the sum of VOCV, the secondary rectifier VF, and the cable compensation voltage (VOCBC). For the 5-V
USB charger applications, a turns ratio range of 13 to 15 is typically used.
(14)
Once an optimum turns ratio is determined from a detailed transformer design, use this ratio for the following
parameters.
The UCC28700 controller constant-current regulation is achieved by maintaining a maximum DMAG duty cycle of
0.425 at the maximum primary current setting. The transformer turns ratio and constant-current regulating
voltage determine the current sense resistor for a target constant current.
Since not all of the energy stored in the transformer is transferred to the secondary, a transformer efficiency term
is included. This efficiency number includes the core and winding losses, leakage inductance ratio, and bias
power ratio to rated output power. For a 5-V, 1-A charger example, bias power of 1.5% is a good estimate. An
overall transformer efficiency of 0.9 is a good estimate to include 3.5% leakage inductance, 5% core and winding
loss, and 1.5% bias power.
(15)
The primary transformer inductance can be calculated using the standard energy storage equation for flyback
transformers. Primary current, maximum switching frequency and output and transformer power losses are
included in the equation below. Initially determine transformer primary current.
Primary current is simply the maximum current sense threshold divided by the current sense resistance.
(16)
(17)
The secondary winding to auxiliary winding transformer turns ratio (NAS) is determined by the lowest target
operating output voltage in constant-current regulation and the VDD UVLO of the UCC28700. There is additional
energy supplied to VDD from the transformer leakage inductance energy which allows a lower turns ratio to be
used in many designs.
(18)
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Transformer Parameter Verification
The transformer turns ratio selected affects the MOSFET VDS and secondary rectifier reverse voltage so these
should be reviewed. The UCC28700 controller requires a minimum on time of the MOSFET (TON) and minimum
DMAG time (TDMAG) of the secondary rectifier in the high line, minimum load condition. The selection of FMAX, LP
and RCS affects the minimum TON and TDMAG.
The secondary rectifier and MOSFET voltage stress can be determined by the equations below.
(19)
For the MOSFET VDS voltage stress, an estimated leakage inductance voltage spike (VLK) needs to be included.
(20)
The following equations are used to determine if the minimum TON target of 300 ns and minimum TDMAG target of
1.1 µs is achieved.
(21)
(22)
Output Capacitance
The output capacitance value is typically determined by the transient response requirement from no-load. For
example, in some USB charger applications there is a requirement to maintain a minimum VO of 4.1 V with a
load-step transient of 0 mA to 500 mA . The equation below assumes that the switching frequency can be at the
UCC28700 minimum of fSW(min).
(23)
Another consideration of the output capacitor(s) is the ripple voltage requirement which is reviewed based on
secondary peak current and ESR. A margin of 20% is added to the capacitor ESR requirement in the equation
below.
(24)
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VDD Capacitance, CDD
The capacitance on VDD needs to supply the device operating current until the output of the converter reaches
the target minimum operating voltage in constant-current regulation. At this time the auxiliary winding can sustain
the voltage to the UCC28700. The total output current available to the load and to charge the output capacitors is
the constant-current regulation target. The equation below assumes the output current of the flyback is available
to charge the output capacitance until the minimum output voltage is achieved. There is an estimated 1 mA of
gate-drive current in the equation and 1 V of margin added to VDD.
(25)
VDD Start-Up Resistance, RSTR
Once the VDD capacitance is known, the start-up resistance from VBULK to achieve the turn-on time target can be
determined.
(26)
VS Resistor Divider, Line Compensation, and Cable Compensation
The VS divider resistors determine the output voltage regulation point of the flyback converter, also the high-side
divider resistor (RS1) determines the line voltage at which the controller enables continuous DRV operation. RS1
is initially determined based on transformer auxiliary to primary turns ratio and desired input voltage operating
threshold.
(27)
The low-side VS pin resistor is selected based on desired VO regulation voltage.
(28)
The UCC28700 can maintain tight constant-current regulation over input line by utilizing the line compensation
feature. The line compensation resistor (RLC) value is determined by current flowing in RS1 and expected gate
drive and MOSFET turn-off delay. Assume a 50-ns internal delay in the UCC28700.
(29)
On the UCC28700 which has adjustable cable compensation, the resistance for the desired compensation level
at the output terminals can be determined using the equation below.
(30)
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
UCC28700DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UCC28700DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UCC28701DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UCC28701DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
UCC28700DBVR
SOT-23
DBV
6
3000
178.0
9.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
UCC28700DBVT
SOT-23
DBV
6
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
UCC28701DBVR
SOT-23
DBV
6
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
UCC28701DBVT
SOT-23
DBV
6
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC28700DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
UCC28700DBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
UCC28701DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
UCC28701DBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
Pack Materials-Page 2
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