TI UCC3750DWTR

application
INFO
available
UCC2750
UCC3750
Source Ringer Controller
FEATURES
DESCRIPTION
• Provides Control for Flyback Based
Four Quadrant Amplifier Topology
The UCC3750 Source Ringer Controller provides a complete control and
drive solution for a four quadrant flyback-based ring generator circuit. The
IC controls a primary side switch, which is modulated when power transfer
is taking place from input to output. It also controls two secondary
switches which act as synchronous rectifier switches during positive
power flow. These switches are pulse-width-modulated when the power is
being delivered back to the source.
• Onboard Sine Wave Reference with
Low THD
• Selectable Ringing Frequency for
Different Phone Systems (20Hz,
25Hz and 50Hz)
• Programmable Output Amplitude and
DC Offset
• DC Current Limiting for Short Circuit
Protection
• Secondary Side Voltage Mode
Control
• Operates from a Single 5V Supply
The UCC3750 has an onboard sine wave reference with programmable
frequencies of 20Hz, 25Hz and 50Hz. The reference is derived from a
high-frequency (32kHz) crystal connected externally. Two frequency-select pins control an internal divider to give a sinusoidal output at
20Hz, 25Hz or 50Hz. The ring generator can also be used at other frequencies by supplying externally generated sine-waves to the chip or by
clocking the crystal input at a fixed multiple of the desired frequency.
Other features included in the UCC3750 are programmable DC current
limit (with buffer amplifier), a charge-pump circuit for gate drive voltage, internal 3V and 7.5V references, a triangular clock oscillator and a buffer
amplifier for adding programmable DC offset to the output voltage. The
UCC3750 also provides an uncommitted amplifier (AMP) for other signal
processing requirements.
TYPICAL APPLICATION
0V
VOUT
–48V
VIN
48V
VOUT
28
26
GD2
2
27
25
GD3 ENBL
GD1
UCC3750
REF
VCP
4
VS 2
6
24
RT
23
CT
VS 1
5
1
RGOOD
VDD
7
11
OUTDC
OUT2
15
12
NEGDC
13
AMP OUT
14
AMP IN
NEG2
18
22
XTAL1
OUT1
16
21
XTAL2
NEG1
17
20
FS 0
19
FS 1
S INFLT
10
5V
S INREF
S WRLY
GND
9
8
3
C17
0.047µF
UDG-99073
SLUS172C - DECEMBER 1999 - REVISED AUGUST 2005
UCC2750
UCC3750
CONNECTION DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Input Supply Voltage
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.5V
Maximum Forced Voltage
VCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 13.2V
VS1, VS2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 5V
OUT1, OUT2, AMPOUT, OUTDC
Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V
Maximum Forced Current . . . . . . . . . . . . . . Internally Limited
NEG1, NEG2, AMPIN, NEGDC
Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V
SINREF, SINFLT
Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V
Logic Inputs
Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V
Reference Output Current (REF) . . . . . . . . . . Internally Limited
Output Current (GD1, GD2, GD3)
Pulsed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300°C
DIL-28, SOIC- 28 (Top View)
N Package, DW Package
Unless otherwise indicated, voltages are reference to ground
and currents are positive into, negative out of the specified terminal. Pulsed is defined as a less than 10% duty cycle with a
maximum duration of 500ns. Consult Packaging Section of
Databook for thermal limitations and considerations of packages.
RGOOD
1
28
GD2
GD1
2
27
ENBL
GND
3
26
GD3
VCP
4
25
REF
VS 1
5
24
RT
VS 2
6
23
CT
VDD
7
22
XTAL1
S WRLY
8
21
XTAL2
S INREF
9
20
FS 0
S INFLT
10
19
FS 1
OUTDC
11
18
NEG2
NEGDC
12
17
NEG1
AMP OUT
13
16
OUT1
AMP IN
14
15
OUT2
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the
UCC3750, –40°C to +85°C for the UCC2750, RT = 14k, CT = 470pF, CREF = 0.1µF, FS0 = 0, FS1 = 0, VDD = 5V. TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
0.5
1
mA
VDD Supply
Supply Current - Active
With 12V Supplied to VCP and Charge Pump
Disabled
Internal Reference w/External Bypass
Output Voltage (REF)
7.55
7.8
V
Load Regulation
IREF = 0mA – 2mA
7.3
30
60
mV
Line Regulation
VCP = 10V to 13V, IREF = 1mA
3
15
mV
Amplifier
Input Voltage
Error, DC Offset and Amp Amplifiers
DC Limit Amplifier
2.9
3
3.1
V
0.7125
0.75
0.7875
V
15
100
nA
Input Bias Current
AVOL
VOUT = 2V to 4V
VOH
Source 100µA
VOL
Sink 100µA
Short Circuit Current
VIN = 0V and 5V with VOUT = 0V and 5V
0.5
TJ = 25°C, Program Frequency–Reference
Frequency
70
5.35
dB
6
7.0
V
0.2
0.65
V
2
3
mA
–1
0
1
Hz
2
%
0.475
0.5
0.525
V
2.85
3.0
3.15
V
Sine Reference
Accuracy
Total Harmonic Distortion
(Note 1)
Amplitude
Peak
Offset
2
UCC2750
UCC3750
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the
UCC3750, –40°C to +85°C for the UCC2750, RT = 14k, CT = 470pF, CREF = 0.1µF, FS0 = 0, FS1 = 0, VDD = 5V. TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Oscillator
Accuracy
108
128
148
kHz
Peak Voltage
4.6
4.75
4.9
V
Valley Voltage
2.9
3.05
3.2
V
10
30
Ω
10
30
Ω
12
14
V
Charge Pump
Switch Pull Up Resistance (VS1, VS2)
Switch Pull Down Resistance (VS1, VS2)
VDD = 5V, IVCP = 10mA
Output Voltage (VCP)
11
Output Drivers
Pull Up Resistance
9
15
Ω
Pull Down Resistance
9
15
Ω
Rise Time
CL = 2.7nF
50
100
ns
Fall Time
CL = 2.7nF
50
100
ns
Current Limit
DC Limit Threshold Voltage Positive
R5/R6 = 3
0.4
0.5
0.6
V
DC Limit Threshold Voltage Negative
R5/R6 = 3
–0.6
–0.5
–0.4
V
48
50
%
50
%
Duty Cycle
Maximum PWM Duty Cycle
Rectifier Duty Cycle
Note 1: Guaranteed by measuring the steps of the PWL Sine Wave.
STATE
0
1
2
3
4
% VCC
0.3333
0.3384
0.3528
0.3745
0.4
VALUE FOR REF = 7.5
2.5
2.538
2.646
2.808
3
STATE
5
6
7
8
% VCC
0.4255
0.4471
0.4616
0.4666
VALUE FOR REF = 7.5
3.191
3.353
3.462
3.5
PIN DESCRIPTIONS
AMPIN: Inverting input of the uncommitted amplifier.
Table I. Frequency selection table
(for 32kHz crystal).
AMPOUT: Output of the uncommitted amplifier.
FS0
0
1
0
1
CT: This pin programs the internal PWM oscillator
frequency. Capacitor from CT to GND sets the charge
and discharge time of the oscillator.
ENBL: Logic input which enables the outputs and the
charge pump when high. ENBL should be pulled low to
turn the outputs off.
FS1
0
0
1
1
SINREF (Hz)
20
25
50
High Impedance
GD1: Output driver that controls the primary side switch
in a flyback converter through a gate drive transformer.
The output signal on this pin is PWM during positive
power transfer modes and zero during negative power
transfer modes.
FS0, FS1: Frequency select pins for the internal
sine-wave generator. Table 1 provides the SINREF
frequencies as a function of FS0 and FS1 when a 32kHz
crystal is used at the crystal inputs (XTAL1, XTAL2).
Other proportional frequencies can be obtained with a
different crystal. Inputs FS0 and FS1 are TTL compatible.
3
UCC2750
UCC3750
PIN DESCRIPTIONS (cont.)
GD2: Output driver that controls the p-channel secondary
side switch in the flyback converter. The output signal on
this pin is PWM during mode 4 (Fig. 2) when the
reference signal is negative and power is being returned
to the input. This pin functions as a synchronous rectifier
output during mode 1 with positive reference signal and
positive power transfer. This output is logically inverted to
provide the correct polarity drive signal for a p-channel
switch.
REF: Internal 7.5V reference. For best results, bypass to
GND with a ceramic capacitor(>0.1µF).
GD3: Output driver that controls the n-channel secondary
side switch in the flyback converter. The output signal on
this pin is PWM during mode 2 (Fig. 2) when the
reference signal is positive and power is being returned
to the input. This pin functions as a synchronous rectifier
output during mode 3 with a negative reference signal
and positive power transfer.
SINFLT: This signal is the buffered version of SINREF.
This signal is summed with the DC offset level with
appropriate scaling.
RGOOD: Logic output that indicates that the error
amplifier output is within range (0< D< 0.5). This pin can
source upto 0.5mA of current.
RT: Resistor from RT to GND helps set the oscillator
frequency. RT programs the charge and discharge
currents of CT.
GND: Reference point for the internal reference and all
thresholds. Also provides the signal return path for all
other pins.
SINREF: This pin is the output of the sine-wave
reference generator. It has a high output impedance
(≈25kΩ). A 0.01µF capacitor to GND is recommended to
provide smoothing of the sinewave. When FS0 and FS1
are both set high, the sine reference generator is
disabled allowing this pin to accept an external sinewave
input.
NEG1: Inverting input of the buffer amplifier that acts as
a summing junction for the DC (battery) offset voltage
and sinewave reference.
SWRLY: Logic output that leads the battery offset
crossings (by typically 5ms) to allow “zero voltage” relay
switching. This pin can typically source 250µA.
NEG2: Inverting input of the error amplifier where the
ringer output voltage and the reference signal with the
desired offset are applied with a weighted sum.
Feedback compensation is connected between NEG2
and OUT2.
XTAL1: Crystal connection for external crystal. This pin
can be also used to clock the internal sine wave
generator when XTAL2 is connected to VDD/2.
XTAL2: Crystal connection for external crystal.
VCP: External connection for charge pump storage
capacitor. A capacitance ≥2.2mF is recommended for
low charge pump output ripple. The voltage at this pin is
used by the output drivers for gate drive voltages.
Alternatively, a regulated gate drive voltage (>10V) can
be connected at this pin while leaving the charge pump
circuit at nodes VS1, VS2 disconnected.
NEGDC: Inverting input of the amplifier used for DC
current limiting.
OUT1: Output of the buffer amplifier that provides scaling
and filtering for the reference signal before feeding it into
the error amplifier. This output is also used internally to
select the PWM mode for the flyback converter.
OUT2: Output of the error amplifier. Used to connect
compensation components. This output’s absolute value
determines the duty cycle of the PWM pulse. The polarity
of this signal also determines the PWM mode.
VDD: External supply input used to bias internal logic
functions. Typically a regulated 5V supply is connected
between this pin and GND. It also is the input voltage for
the voltage tripler circuit to generate the gate drive
voltage.
OUTDC: Output of the DC current limit amplifier. The DC
current limit is activated when this pin is above 4.5V or
below 1.5V.
VS1, VS2: Voltage switches for the voltage tripler
(charge pump circuit). They provide different voltage
levels to external capacitors in order to pump up the
voltage from VDD to VCP.
4
UCC2750
UCC3750
DETAILED BLOCK DIAGRAM
SWRLY FS0
8
XTAL1
XTAL2
XTAL
OSC
21
13
AMPIN
14
SINREF
19
9
SINFLT NEG1
10
12
VCM
– AMP
+
VCM
–
+
5
VS2
6
VDD
7
15
REF
CHARGE
PUMP
+
–
REF
–
+
VCM
MAG
FULLWAVE
RECTIFIER
SIGN
ERROR
AMP
MODE
INTERNAL
REFERENCE
REF=7.5V
VCM = 3.0V
+
–
CONTROL LOGIC
MODE SIGN
SIGN
DC
CURRENT
LIMIT
MAG
VS1
OUT2
18
VCP
4
4
NEG2
16
DC OFFSET AMP
11
VCP
OUT1
–
+
VCM
REF
NEGDC
17
SINE REFERENCE
GENERATOR
VCM
OUTDC
FS1
REF
22
AMPOUT
20
PWM
OUT1
OUT2
0
0
PWM
OFF
0
1
OFF
PWM
OUT3
RECIRC
OFF
1
0
OFF
1
1
PWM RECIRC
OFF
2
GD1
28
GD2
26
GD3
VCP
VCP
PWM
OFF
RAMP
CLOCK
VCM
GENERATOR
25
3
24
23
1
27
REF
GND
RT
CT
RGOOD
ENBL
UDG-99074
Note: All pin numbers are for N or DW Packages.
APPLICATION INFORMATION
The UCC3750 provides complete control and protection
functions for a four quadrant flyback converter used to
generate ring signals for telephone circuits. A typical application circuit for a 15 REN ring generator is shown in
Fig. 1.
DC-DC converter operation where Q1 is modulated with
the PWM signal and rectification is provided through the
Q2, DR2 path to provide a positive output proportional to
the increasing, positive reference voltage. The
pulse-width is controlled by the error amplifier output to
increase or decrease the output as dictated by the reference. The maximum duty cycle is limited to 50% to prevent DR1 from turning on prior to Q2/DR2.
As shown, the flyback converter takes a DC input (typically 48V) and provides an isolated output with a programmable frequency (and amplitude) AC signal
superimposed on a programmable DC offset. The power
path consists of a primary side PWM switch Q1, primary
return rectifier DR1, a 4-winding transformer T1, output
rectifiers DR2 and DR3, synchronous/PWM switches Q2
and Q3, and output filter CF. Resistor RSENSE provides
the output current sensing for protection circuits.
In mode 2, the reference begins to decrease, necessitating that the power transfer back to the input. For this
mode, switch Q3 needs to be modulated while DR1 acts
as the rectifier back to the input. The UCC3750 has
mode decoding circuitry which automatically directs the
PWM signal to Q3 and turns off Q1.
Different operating modes of the converter are depicted
in Table 2. Fig. 2 shows the output voltage and current
waveforms for a purely capacitive load and identifies the
four operating modes. Fig. 3 shows the PWM waveforms
for the circuit and Fig. 4a - 4d show the equivalent circuits under the operating modes. The addition of Q2, Q3
and primary diode facilitates true four quadrant operation
where both the output voltage and power transfer can be
bi-directional. Mode 1 is similar to the commonly used
Table II. Operating modes.
5
Mode
Reference
Polarity
Power
Flow
E.A.
Output
1
2
3
4
+
+
–
–
+
–
+
–
–
+
+
–
Source Rectifier
(PWM)
Switch
Switch
Q1
Q2
Q3
(D1)
Q1
Q3
Q2
(D1)
RTN
VIN
C23
C1
C2
0.47µF 100µF 100µF
R22
C22
R1
10k
R23
Figure 1. Typical application circuit.
6
1
CR9
3
4
Q6
MP S A06
2
5
1
6
Q5
2 Q4
2N5457
3
1 2N7001DICT
3
2
1
C3 0.1µF
R20
1
2
C21
T2
R2
R6
10k
3
VDD
C5
0.47µF
4
Q3
S3
S2
S4
S1
X1 32kHz
R5 30k
R9
AMP IN
XTAL1
XTAL2
14
22
21
19
25
16
17
OUT1
NEG1
8
9
3
10
18
GND
C11 0.22µF
CR5
C9
0.47µF
VDD
C10
2.2µF
C16 2.2µF
R12 2.7k
C18
22µF
R14 3.3M
C13
1µF
C19
100µF
R26
REF
R15 15k
R13 62k
R25 10k C14 1nF
R11 148k
CR7
C12 0.22µF CR6
15
7
5
6
4
NEG2
OUT2
VDD
VS 1
VS 2
VCP
S INFLT
S WRLY
C17
0.047µF
27
R18
ENBL REF
S INREF
FS 1
FS 0
AMP OUT
13
20
NEGDC
OUTDC
RGOOD
CT
RT
GD1
26
GND
GD3
12
11
1
23
24
2
28
GD2
C4
1µF
250V
R17
CR12
C6 0.1µF
C7 470pF
R4 16k
R3
CR10
CR8
IRF840
MTP 2P 50E
Q2
CR3 BYV26C
CR2
BYV99
R21
7,9
10
CR1
BYV99
T1
C20
VB
REF
VDD
5V
R27
R10
148k
VOUT
UCC2750
UCC3750
APPLICATION INFORMATION (cont.)
UDG-99075
UCC2750
UCC3750
APPLICATION INFORMATION (cont.)
When the reference signal goes from positive to negative, a transition is made from mode 2 to mode 3. In
mode 3, the converter once again acts as a DC-DC
flyback converter (with negative output). Similar to mode
1, Q1 is controlled by the PWM output, however, the rectifying path is now through Q3/DR3 as the output polarity
is reversed. At the mode boundaries, there could be
some distortion which won’t affect the THD too much as
it is near zero crossings. Finally, as the reference signal
starts increasing towards zero, the direction of power
transfer is again reversed and Q2 is PWMed in mode 4.
It should be noted that in modes 2 and 3 when the reference is decreasing, the phase of the feedback path is inverted compared to the other two modes. Traditional
PWM methods will result in instability due to this characteristic. The UCC3750 separates the error signal magnitude and polarity and determines the correct PWM signal
based on a separate mode determination circuit.
UDG-96172-1
UDG-96173
Figure 2. Operating modes.
Figure 3. Circuit waveforms.
UDG-96162-1
UDG-96163
Figure 4a. Mode 1: Forward power transfer, positive
output.
Figure 4b. Mode 2: Reverse power transfer, positive
output.
UDG-96164-1
UDG-96165-1
Figure 4c. Mode 3: Forward power transfer, negative
output.
Figure 4d. Mode 4: Reverse power transfer, negative
output.
7
UCC2750
UCC3750
APPLICATION INFORMATION (cont.)
R13
 R13 R13 
 • VCM –
VOUT1= 1+
+
• REF
R26
 R14 R26 
Sine Reference Generator
The IC has a versatile low frequency sinewave reference
generator with low harmonic distortion and good frequency accuracy. In its intended mode as shown in Fig.
5, the reference generator will take an input from a
32kHz crystal (connected between XTAL1 and XTAL2)
and generate a sine-wave at 20Hz, 25Hz or 50Hz based
on the programming of pins FS0 and FS1 (See Table 2).
If the crystal frequency is changed, the output frequencies will be appropriately shifted. C-2 type Quartz crystals
(Epson makes available through DigiKey) are recommended for this application. If the frequency accuracy is
not a major concern, the more common and less expensive clock crystal (C-type) at 32.768kHz can be used with
a minor output frequency offset (20.5Hz instead of 20Hz).
Additionally, the XTAL1 input can be clocked at a desired
frequency to get a different set of output frequencies at
the sine-wave output (with divide ratios of 1600, 1280
and 640). The sine-wave output is centered around an internal reference of 3V. A capacitor from SINREF to GND
helps provide smoothing of the sine wave reference.
Recommended value is at least 0.01µF and maximum of
0.1µF. When FS0 and FS1 are both 1 (high), the sine reference is disabled and external sine-wave can be fed
into the SINREF pin. This signal should have the same
DC offset as the internal sine-wave (3V).
–
(1)
R13
R13
• VB –
• VAC
R14
R15
In order to nullify the effect of VCM on this value, the ratio
of R26 to R14 should be made 1.5. With this ratio, the
equation becomes:
VOUT1= VCM –
R13
R13
• VB –
• VAC
R14
R15
(2)
VOUT1 is the reference voltage that the second amplifier
(AMP2) uses to program the output voltage. Assuming
that Z4 is high DC impedance, the output voltage is derived by summing the currents into pin 18. The output is
given as:
 R10 R10 
 • VCM
VO = 1+
+
 R27 R12 
–
(3)
R10
R10
• REF –
• VOUT1
R12
R27
Again, if the ratio of R27 to R10 is made 1.5, the effect of
VCM is nullified and the output voltage becomes (after
substituting for VOUT1):
VO =
Reference and Error Amplifier
The recommended circuit connections for these circuits
are shown in Fig. 6. The sine-wave is added to a DC offset to create the composite reference signal for the error
amplifier. The DC reference can vary over a wide range.
For pure AC outputs it is zero, while in many common
applications, it is the talk battery voltage (–48V). The
UCC3750 accomplishes this task by summing the two
signals weighted by resisting R14 and R15. The output of
AMP1 also helps determine the mode of the circuit.
R10 • R13
R10 • R13
• VB +
• VAC
R12 • R14
R12 • R15
(4)
From equation 4, it can be seen that if the output voltage
DC value has to track VB directly, the following condition
should be forced:
R10 • R13 = R12 • R14
(5)
However, in some cases, this becomes impractical due
to large AC gain required form VAC to VO. Only a small
part of the gain can be accommodated in the first amplifier stage due to its output voltage limitations. As a result,
the required resistance values become very high. This
Referring to Fig. 6, the output of AMP1 is given by :
UDG-96166-1
UDG-96167-1
Figure 5. Sine-wave generator.
Figure 6. Error amplifier setup.
8
UCC2750
UCC3750
APPLICATION INFORMATION (cont.)
problem is only manifested for high values of VB (e.g.
48V) and can be alleviated by using a fraction of the required DC offset as the VB input and regaining the offset
with resistive ratios.
ulation turns on the PWM signal when the ramp signal
falls below MAG on the falling slope and turns it off at the
end of the clock cycle. This technique enables synchronized turn-on of the rectifier switches immediately after
the PWM pulse is turned off. The triangular nature of the
ramp ensures that the maximum duty cycle of the PWM
output is 50%, providing inherent current limiting.
The error amplifier compares the reference signal with
the output voltage by way of weighted sum at its inverting
input. The error signal is further processed to separate its
polarity and magnitude. An absolute value circuit (precision full-wave rectifier) is used to get the magnitude information. The polarity is used along with the reference
signal polarity to determine the mode information. The
absolute value circuit provides phase inversion when appropriate for modes 2 and 3 to maintain the correct loop
gain polarity. While the output of the error amplifier
swings around 3V, the full-wave rectifier output (MAG)
converts it into a signal above 3V. This signal is compared to the oscillator ramp to generate the PWM output.
Control Logic and Outputs
The PWM signal is processed through control logic which
takes into account the operating mode and output polarity to determine which output to modulate. The logic table
for the outputs is given in Table 2. For example, assume
that the reference signal is in the first quadrant (positive
and increasing). The output will lag the reference by a
certain delay and hence the error amp output will be positive, resulting in SIGN = 0. The logic table indicates that
GD1 is modulated during this phase allowing power
transfer to increase the output voltage to keep up with
the reference. Increasing error (MAG) will result in larger
duty cycle and enable the output to increase and catch
up with the reference. If the output becomes higher than
the reference (as is likely in the second quadrant when
the reference is dropping), the SIGN becomes 1 and
GD3 is modulated to decrease the output level by transferring power to the input. At the boundary of the first and
second quadrant, there may be some switching back and
forth between modes as the reference slope crosses
through zero. Some of this switching can be eliminated
by judicious selection of error amplifier filtering and compensation components. In the first quadrant, when PWM
is applied to Q1, Q2 is turned on in the rectifier mode by
the clock signal to allow the flyback transformer flux to
Oscillator and PWM Comparator
The UCC3750 has an internal oscillator capable of high
frequency (>250kHz) operation. A resistor on the RT pin
programs the current that charges and discharges CT,
resulting in a triangular ramp waveform. Fig 7. shows the
oscillator hook-up circuit. The ramp peak and valley are
4.75V and 3V respectively. The nominal frequency is
given by:
fOS C =
1
1.17 • RT • CT
The ramp waveform and the rectified output of the error
amplifier are compared by the PWM comparator to generate the PWM signal. The PWM action is disabled on
the positive slope of the ramp signal. Leading edge mod-
3V
RT
RT
24
4.75V
IR
IR
3.0V
–
+
R
Q
+
–
S
CT
CT
23
IR
UDG-99077
Figure 7. Oscillator setup.
9
UCC2750
UCC3750
APPLICATION INFORMATION (cont.)
R S ENS E
11
OUTDC
R5
R6
12
NEGDC
VCM
4
–
DC
+
TO
P WM
UDG-96170-1
Figure 8. Current limiting.
Figure 9. Charge pump circuits.
reset (and to transfer power to the output). Operation in
quadrants 3 and 4 is symmetrical to the first two quadrants with Q2 and Q3 interchanged. Note that the output
signal for Q2 is logically inverted to allow for driving the
p-channel switch. An n-channel switch can also be used
for Q2, but the drive circuit must be transformer isolated
and the polarity inverted. The outputs are designed for
high peak current drive and low internal impedance. In
isolated systems, GD1 must be coupled to Q1 using a
gate-drive transformer.
Charge Pump and Reference
The UCC3750 is designed to work on the secondary side
of an isolated power supply. It requires a 5V power supply with respect to its GND pin to operate. Note that the
GND pin of the IC is also the reference point of the ring
signal that is generated by the converter. If the converter
output is connected in series with any other voltage, it
should be ensured that the available supply voltage is
referenced to the converter output return. The IC along
with its associated charge pump components shown in
Fig. 9 generates all the other voltages the system requires. The UCC3750 typically requires about 5mA to operate without any loads on the drive outputs. The charge
pump capacitor should be large enough to keep the VCP
fairly constant when driving Q1-Q3 in the converter.
DC Current Limit
The DC current limit function provides protection against
short circuit conditions by limiting the maximum current
level and shutting off the PWM function when the limit
point is reached.
120
The DC limit is activated when DC out is below 0.5 VCM
or above 1.5 • VCM. The DC current limit can be programmed by setting:
160
100
140
MAG.
80
MAGNITUDE (dB)
With this ratio, a symmetric DC limit with thresholds of
±0.5V is obtained. For other ratios, the positive and negative voltage thresholds for current sense signal are
given by:
VCM
VS ENS E (P OS ) =
4
120
60
100
40
80
PHAS E
60
PHASE (Degree)
R5
= 3.
R6
VS ENS E (NEG) =
180
20
40
0
 R6 

• 1 R5 
20
-20
1
VCM  5R6 

• 14
 R5 
10
100
100
1000
10k
10000
100k 100000
1M
100000
0
FREQUENCY (Hz)
0
10M
1E+07
Figure 10. Frequency response to error amplifiers.
Even though the DC current is typically sensed in the
secondary, the currentl limit is applied fo the active PWM
switch at the time. For example, if Q1 is the PWM switch
and DCLIM is activated, the UCC3750 will prevent
trun-on for Q1 during the negative slope of the ramp (Fig.
2). The DC limit is functional on a cycle-by-cycle basis.
Table II. Revision History
Revision
C
10
Date
08/2005
Comment
Changed amplifier input bias
current maximum limit from 600
nA to 100 nA and Typical from
500 nA to 15 nA.
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
UCC2750DW
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UCC2750DW
UCC2750DWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
UCC2750DW
UCC3750DW
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UCC3750DW
UCC3750DWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UCC3750DW
UCC3750DWTR
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UCC3750DW
UCC3750DWTRG4
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 70
UCC3750DW
UCC3750N
ACTIVE
PDIP
N
28
13
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UCC3750N
UCC3750NG4
ACTIVE
PDIP
N
28
13
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
UCC3750N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UCC3750DWTR
Package Package Pins
Type Drawing
SOIC
DW
28
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
32.4
Pack Materials-Page 1
11.35
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
18.67
3.1
16.0
32.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC3750DWTR
SOIC
DW
28
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
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