TECHNICAL DATA ISO K Line Serial Link Interface IL33290 The IL33290 is a serial link bus interface device designed to provide bidirectional half-duplex communication interfacing in automotive diagnostic applications. It is designed to interface between the vehicle.s on-board microcontroller and systems offboard the vehicle via the special ISO K line. The IL33290 is designed to meet the Diagnostic Systems ISO9141 specification. The device’s K line bus driver.s output is fully protected against bus shorts and overtemperature conditions. The IL33290 derives its robustness to temperature and voltage extremes by being built on a process, incorporating CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs. Although the IL33290 was principally designed for automotive applications, it is suited for other serial communication applications. It is parametrically specified over an ambient temperature range of -40°C ≤ TA ≤ 125°C and 8.0 V ≤ VBB ≤ 18 V supply. The economical SO-8 surface-mount plastic package makes the IL33290 very cost effective. Features • Designed to Operate Over Wide Supply Voltage of 8.0 to 18 V • Ambient Operating Temperature of -40 to 125°C • Interfaces Directly to Standard CMOS Microprocessors • ISO K Line Pin Protected Against Shorts to Ground • Thermal Shutdown with Hysteresis • Maximum Transmission Speeds in Excess of 50 k Baud • ISO K Line Pin Capable of High Currents • ISO K Line Can Be Driven with up to 10 nF of Parasitic Capacitance • 8.0 kV ESD Protection Attainable with Few Additional Components • Standby Mode: No VBat Current Drain with VDD at 5.0 V • Low Current Drain During Operation with VDD at 5.0 V Rev. 00 IL33290 Pin Function Description Notes 1. NC pins should not have any connections made to them. NC pins are not guaranteed to be open circuits. Rev. 00 IL33290 Maximum Ratings All voltages are with respect to ground unless otherwise noted. Notes 2. Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain within specified parametric limits during this duration. 3. ESD data available upon request. 4. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 5. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 6. Nonrepetitive clamping capability at 25°C. 7. Lead soldering temperature limit is for 10 seconds maximum duration. Rev. 00 IL33290 Static Electrical Characteristics Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Notes 8. When IBB transitions to >100 µA. 9. When IBB transitions to <100 µA. 10. Enable pin has an internal current pull-down equivalent to greater than 50 kΩ. 11. Measured by ramping TX down from 0.7 VDD and noting TX value at which ISO falls below 0.2 VBB. 12. Measured by ramping TX up from 0.3 VDD and noting the value at which ISO rises above 0.9 VBB. 13. Tx pin has internal current pull-up equivalent to greater than 50 kΩ. Pull-Up current measured with TX pin at 0.7 VDD. 14. Thermal Shutdown performance (TLIM) is guaranteed by design but not production tested. Rev. 00 IL33290 Static Electrical Characteristics (continued) Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Notes 15. ISO ramped from 0.8 VBB to 0.4 VBB, Monitor RX, Value of ISO voltage at which RX transitions to 0.3 VDD. 16. ISO ramped from 0.4 VBB to 0.8 VBB, Monitor RX, Value of ISO voltage at which RX transitions to 0.7 VDD. 17. Input Hysteresis, VHys(ISO) = VIH(ISO) - VIL(ISO). 18. ISO has internal current limiting. Rev. 00 IL33290 Dynamic Electrical Characteristics Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Notes 19. Time required ISO voltage to transition from 0.8 VBB to 0.2 VBB. 20. Changes in the value of CISO affect the rise and fall time but have minimal effect on Propagation Delay. 21. Step TX voltage from 0.2 VDD to 0.8 VDD. Time measured from VIH(ISO) until VISO reaches 0.3 VBB. 22. Step TX voltage from 0.8 VDD to 0.2 VDD. Time measured from VIL(ISO) until VISO reaches 0.7 VBB. Rev. 00 IL33290 Application Information Rev. 00 IL33290 Package Dimensions D SUFFIX SOIC (MS - 012AA) Dimension, mm A 8 5 B H 1 G P 4 D K MIN MAX A 4.80 5.00 B 3.80 4.00 C 1.35 1.75 D 0.33 0.51 F 0.40 1.27 R x 45 C -T- Symbol SEATING PLANE J F 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. M G 1.27 H 5.72 J 0° 8° K 0.10 0.25 M 0.19 0.25 P 5.80 6.20 R 0.25 0.50 Rev. 00