TECHNICAL DATA IN74HCT574A Octal 3-State Noninverting D Flip-Flop High-Performance Silicon-Gate CMOS The IN74HCT574A is identical in pinout to the LS/ALS574. This device may be used as a level converter for interfacing TTL or NMOS outputs to High-Speed CMOS inputs. Data meeting the setup time is clocked to the outputs with the rising edge of the Clock. The Output Enable input does not affect the states of the flip-flops, but when Output Enable is high, all device outputs are forced to the high-impedance state; thus, data may be stored even when the outputs are not enabled. • • • • ORDERING INFORMATION IN74HCT574AN Plastic IN74HCT574ADW SOIC TA = -55° to 125° C for all packages TTL/NMOS Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 µA PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE PIN 20=VCC PIN 10 = GND Inputs Output Enable D Q L H H L L L X no change X Z L H Clock Output L,H, X X = don’t care Z = high impedance Rev. 00 IN74HCT574A MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Current, per Pin ±35 mA ICC DC Supply Current, VCC and GND Pins ±75 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) Min Max Unit 4.5 5.5 V 0 VCC V -55 +125 °C 0 500 ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74HCT574A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limit V 25 °C to -55°C ≤85 °C ≤125 °C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA 4.5 5.5 2.0 2.0 2.0 2.0 2.0 2.0 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA 4.5 5.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOH Minimum HighLevel Output Voltage VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA 4.5 5.5 4.4 5.4 4.4 5.4 4.4 5.4 V VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA 4.5 3.98 3.84 3.7 VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 µA 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 VIN= VIL or VIH ⎢IOUT⎢ ≤ 6.0 mA 4.5 0.26 0.33 0.4 VOL Maximum LowLevel Output Voltage V IIN Maximum Input Leakage Current VIN=VCC or GND 5.5 ±0.1 ±1.0 ±1.0 µA IOZ Maximum Three State Leakage Current Output in High-Impedance State VIN =VIH or VIL VOUT= VCC or GND 5.5 ±0.5 ±5.0 ±10 µA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND IOUT=0µA 5.5 4.0 40 160 µA ∆ICC Additional Quiescent Supply Current VIN=2.4 V, Any One Input VIN=VCC or GND, Other Inputs ≥-55°C 25°C to 125°C mA 2.9 2.4 IOUT=0µA 5.5 Rev. 00 IN74HCT574A AC ELECTRICAL CHARACTERISTICS (VCC =5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit 25 °C to -55°C ≤85°C ≤125°C Unit Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) 30 24 20 MHz tPLH, tPHL Maximum Propagation Delay, Clock to Q (Figures 1 and 4) 30 38 45 ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) 28 35 42 ns tPZH, tPZL Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) 28 35 42 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 4) 12 15 18 ns Maximum Input Capacitance 10 10 10 pF Maximum Three-State Output Capacitance (Output in High-Impedance State) 15 15 15 pF Symbol fmax CIN COUT CPD Parameter Power Dissipation Capacitance (Per Flip-Flop) Typical @25°C,VCC=5.0 V Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC 58 pF TIMING REQUIREMENTS (VCC =5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit Symbol Parameter 25 °C to -55°C ≤85°C ≤125°C Unit tSU Minimum Setup Time, Data to Clock (Figure 3) 10 13 15 ns th Minimum Hold Time, Clock to Data (Figure 3) 5 5 5 ns tw Minimum Pulse Width, Clock (Figure 1) 15 19 22 ns tr, tf Maximum Input Rise and Fall Times (Figure 1) 500 500 500 ns Rev. 00 IN74HCT574A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit Figure 5. Test Circuit EXPANDED LOGIC DIAGRAM Rev. 00 IN74HCT574A N SUFFIX PLASTIC DIP (MS - 001AD) A Dimension, mm 11 20 B 1 10 Symbol MIN MAX A 24.89 26.92 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 N G K M J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 013AC) A 20 11 H Dimension, mm B 1 P 10 G R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 12.6 13 B 7.4 7.6 C 2.35 2.65 D 0.33 0.51 F 0.4 1.27 G 1.27 H 9.53 J 0° 8° K 0.1 0.3 M 0.23 0.32 P 10 10.65 R 0.25 0.75 Rev. 00