Metal Glaze™ Surface Mount Precision Power Chip Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate PPC Series • Surge tolerant • Up to 1000 volts • Tight TCR - 25 ppm/°C High temperature dielectric coating • Tolerance down to ±0.1% Solder over nickel barrier Electrical Data Size Code Industry Footprint IRC Type Power Rating at 70°C (W) Working Voltage Resistance Range (ohms) B 1206 PPC1/8 1/8 W 200 100 - 10K D 2010 PPC1/2 1/2 W 300 100 - 10K F 2512 PPC1 1W 350 100 - 10K H 3610 PPC2 2W 1.33W 500 100 - 10K Tolerance (±%) 0.1% (B) 0.25% (C) 0.5% (D) Qty / Reel (7") Qty / Reel (13") 2500 10000 1500 5000 N/A 5000 N/A 1500 Environmental Data Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.5 2.5 x High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Solderability ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent) Life Test ±1% + 0.01 ohm 1200 gram push from underside of mounted chip for 60 seconds Terminal Adhesion Strength ±1% + 0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 1mm so as to exert pull on chip contacts for 5 seconds √ for 5 seconds General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TT electronics plc PPC Series Issue November 2008 Sheet 1 of 3 Metal Glaze™ Surface Mount Precision Power Chip Physical Data L C W Dimensions (Inches and (mm)) Industry Footprint Size Code Actual Size L W C 0.057 ± 0.006 (1.45 ± 0.15) 0.020 ± 0.010 (0.51 ± 0.25) B 1206 0.128 ± 0.007 (3.25 ± 0.18) D 2010 0.200 ± 0.010 (5.08 ± 0.25) 0.079 ± 0.006 (2.01 ± 0.15) 0.030 ± 0.010 (0.761 ± 0.25) F 2512 0.251 ± 0.010 (6.38 ± 0.25) 0.079 ± 0.006 (2.01 ± 0.15) 0.040 ± 0.010 (1.02 ± 0.25) H 3610 0.367 ± 0.010 (9.32 ± 0.25) 0.105 ± 0.006 (2.67 ± 0.15) 0.050 ± 0.010 (1.27 ± 0.25) Recommended Solder Pad Dimensions (Reflow): To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a large repeatable solder fillet to the PPC resistor on reflow processes and will provide maximum heat transfert to the PC board in high power applications. By placing the PPC on the solder paste while the paste is in the "tacky" state, the PPC will be held in position until solder reflow begins. The pad design thes uses the surface tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising above the board level directly beneath the PPC is not recommended. Recommended Solder Pad Dimensions (Reflow): F A C A B E D Size Code Industry Footprint B Dimensions (Inches and mm)) A B C D E F 1206 0.076 (1.93) 0.093 (2.36) 0.058 (1.47) 0.098 (2.49) 0.032 (0.81) 0.211 (5.36) D 2010 0.111 (2.82) 0.126 (3.20) 0.096 (2.44) 0.152 (3.86) 0.040 (1.02) 0.318 (8.08) F 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 (4.65) 0.040 (1.02) 0.369 (9.37) H 3610 0.170 (4.32) 0.160 (4.06) 0.213 (5.41) 0.273 (6.93) 0.044 (1.12) 0.553 (14.05) Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com PPC Series Issue November 2008 Sheet 2 of 3 Metal Glaze™ Surface Mount Precision Power Chip Standard Reel Packaging Per EIA-481 Size Code Industry Footprint Reel Diameter* Quantity Per Reel Carrier Tape Width Component Pitch B 1206 7", 13" 2,500 max., 10,000 max. 8mm 4mm D 2010 7", 13" 1,500 max., 5,000 max. 12mm 4mm F 2512 13" 5,000 max. 12mm 4mm H 3610 7" 1,500 max. 24mm 4mm * The 13" reel is considered standard and will be supplied unless otherwise specified. Repetitive Surge Curve Power Derating Curve 100 1000 80 Peak Power (watts) % of Rated Power PPC 1/8, 1/2, 1 60 PPC 2 40 20 0 30 40 50 60 70 80 PPC 2 PPC 1 100 10 PPC PPC 1/8 1/2 90 100 110 120 130 140 150 1 0.0001 Ambient Temperature (°C) .1msec Ordering Data 0.0010 1msec 0.0100 10msec 0.1000 100msec 1.0000 10000msec Surge or Pulse Duration (seconds) Specify type, resistance, tolerance, RoHS-Compliance and packaging. This example is for a Surface Mount Precision Power Chip. Sample Part No. PPC1 25 1001 F LF 13 IRC Type PPC 1/8, 1/2, 1, 2 Resistance Value (EIA 4-digit code) (≥100Ω - First 3 significant digits plus 4th digit multiplier) Example: 100Ω = 1000; 1000Ω = 1001 (>100Ω - "R" is used to designate decimal) Example: 10Ω = 10R0; 0.25Ω = R250 Tolerance (EIA format) B = ±0.1%, C = ±0.25%, D = ±0.5% RoHS Indicator LF indicates RoHS compliance Blank designates 60% Sn / 40% Pb Solder Packaging (BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel) Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com PPC Series Issue November 2008 Sheet 3 of 3