High Temperature Thick Film Chip Resistors HTC Series • • • • • Operation to 200°C Excellent high temperature stability Improved working voltage ratings Pb-free wrap-around terminations Standard chip sizes available from 1206 to 2512 Electrical Data Characteristic 1206 2010 2512 1W to 10MW; ±1%, ±5% Resistance Range 10W to 1MW; ±0.5%, ±5%, ±1% 150°C Power Rating 200mW 500mW 750mW Max Voltage Rating 200V 400V 500V Absolute TCR ± 100ppm/°C Operating Temperature Pad/Trace Area1 -55°C to +200°C 80mm2 Termination 200mm2 300mm2 Wrap-around Pb-free with leach resistant Ni barrier Note1 : Recommended minimum pad and adjacent trace area for each termination for rated power on FR4 PCB. Environmental Data Test Method Specification Maximum2 Typical MIL-STD-202 Method 108 (Rated Power for 1000hrs @ 150°C) 1.00% 0.25% 1000 hours @ 200°C 1.00% 0.20% Short Time Overload MIL-PRF-55342H (6.25X rated power for 5secs) 1.00% 0.10% Moisture Resistance MIL-STD-202 Method 106G 1.00% 0.25% MIL-STD-202 Method 107G Condition B 0.25% 0.05% MIL-STD-202 Method 210F 0.25% 0.05% Load Life High Temperature Exposure Thermal Shock Resistance to Soldering Heat Solderability MIL-STD-202 Method 208 (245°C, 5 seconds) >95% Coverage Note2 : 0.01W added for all resistance values <10W. General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TTelectronics plc HTC Series Issue May 2009 Pulse Withstanding Chip Resistors Physical Data L C A Protective Overcoat Overglaze (Stability Enhancer) Sn Plating Ni Barrier Layer W High Reliability Resistance Element T B Alumina Substrate Conductor Part Type L (mm) W (mm) T max (mm) A (mm) B min (mm) C (mm) Weight (grams) 1206 3.2±0.4 1.6±0.2 0.7 0.4±0.15 0.4±0.2 1.7 0.020 2010 5.1±0.3 2.5±0.2 0.8 0.6±0.25 0.6±0.3 3.0 0.036 2512 6.5±0.3 3.2±0.2 0.8 0.6±0.25 0.6±0.3 4.4 0.055 Construction: Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent `leach´ resistance properties and solderability. Marking: Components are not marked. Reels are marked with type, value, tolerance, date code and quantity. Solvent resistance: The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits. Power Derating Data Ordering Data Prefix TKC - HTC - 2512LF - 100R - F % Of Rated P ower 100 Chip Type HTC (High Temperature Chip) Chip Size and Termination 1206LF = 100% Tin (pb-free) termination 2010LF = 100% Tin (pb-free) termination 2512LF = 100% Tin (pb-free) termination 50 Resistance Value (4 Digit Code) Ex. 1R00 = 1Ω; 100R = 100Ω; 10K0 =10KΩ; 1M50 = 1.5MΩ 10 Tolerance Code 150° 200° Temperature in °C Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com J = ±5%; F = ±1%; D = ±0.5% For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. HTC Series Issue May 2009