ISC BUW24

Inchange Semiconductor
Product Specification
BUW24
Silicon NPN Power Transistors
DESCRIPTION
・With TO-3 package
・High dielectric strength
・Short switching time
APPLICATIONS
・Suitable for use in clocked
voltatge converters
PINNING (See Fig.2)
PIN
DESCRIPTION
1
Base
2
Emitter
3
Collector
Fig.1 simplified outline (TO-3) and symbol
导体
半
电
MAXIMUN RATINGS
SYMBOL
CONDITIONS
UNIT
450
V
350
V
7
V
Collector current
10
A
Base current
3
A
100
W
VCBO
Collector-base voltage
VCEO
Collector-emitter voltage
Open base
VEBO
Emitter-base voltage
Open collector
IC
IB
TOR
VALUE
固
PARAMETER
Open emitter
EMIC
S
E
G
AN
INCH
C
U
D
ON
Tmb≤25℃
PT
Total power dissipation
Tj
Junction temperature
150
℃
Tstg
Storage temperature
-65~150
℃
VALUE
UNIT
1.25
℃/W
THERMAL CHARACTERISTICS
SYMBOL
Rth j-c
PARAMETER
Thermal resistance from junction to case
Inchange Semiconductor
Product Specification
BUW24
Silicon NPN Power Transistors
CHARACTERISTICS
Tj=25℃ unless otherwise specified
SYMBOL
PARAMETER
VCEO
Collector-emitter breakdown voltage
IC=10mA ; IB=0
VCEsat
Collector-emitter saturation voltage
IC=4A; IB=0.8A
0.8
V
VBEsat
Base-emitter saturation voltage
IC=4A; IB=0.8A
1.5
V
ICBO
Collector cut-off current
VCB=450V; IE=0
0.1
mA
IEBO
Emitter cut-off current
VEB=7V; IC=0
0.1
mA
hFE-1
DC current gain
IC=1A ; VCE=5V
10
hFE-2
DC current gain
IC=4A ; VCE=5V
15
导体
半
电
CONDITIONS
MIN
固
Storage time
tf
Fall time
IN
G
N
A
CH
IC
M
E
ES
IC=5A IB1=- IB2=0.5A
RL=10Ω
2
UNIT
V
80
R
O
T
UC
OND
Turn-on time
ts
MAX
350
Switching times
ton
TYP.
2.0
μs
4.0
μs
1.2
μs
Inchange Semiconductor
Product Specification
BUW24
Silicon NPN Power Transistors
PACKAGE OUTLINE
导体
半
电
固
D
N
O
IC
R
O
T
UC
M
E
S
GE
N
A
H
INC
Fig.2 Outline dimensions
3