IXYS MX8771

MX8771
IXYS
16-Channel, 60V Driver
Push-Pull Output, I2C Interface
Features:
General Description
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The MX8771 is a 16 channel high voltage switch
with I2C serial input control. The MX8771 connects
directly to a microprocessor through a standard I2C
interface. The push-pull output configuration can
drive up to 60 volts at 15mA. Outputs can be
paralleled for increased drive current up to a device
total of 240mA sink or source.
16 Push-Pull Outputs Rated at 60V, 15mA
6V to 60V Driver Supply Range
1.65V to 5.5V Logic Supply Range
I2C Interface
Synchronous update across multiple packages
Outputs can be paralleled
28 Lead QFN Package
The MX8771 is designed to operate over a
temperature range of -40°C to +85°C, and is
available in a QFN-28 Package.
Applications:
• White Goods
• ATE
• Industrial Equipment
Ordering Information
Part No.
Description
MX8771R
QFN-28
MX8771RTR QFN-28 Tape & Reel
Qty
73
2500
Functional Block Diagram
VCC
VPWR
RSTN
A0
A1
A2
16
I2C
16 bit
Data
Register
16-bit
Buffer
Register
Level
Shifter
SCL
Outputs
SDA
I2C
OE
MX8771
Drawing No. 877109
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3/6/08
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IXYS
MX8771
Absolute Maximum Ratings (Voltages with respect to GND=0V)
Parameter
VPWR Supply Voltage
Logic Supply Voltage
Input Pin Voltage
Continuous Output Current
Storage Temperature
Operating Ambient Temp
Operating Junction Temp
Thermal Resistance
(Junction to Ambient)
Symbol
VPWR
VCC
VIN
IOUT(OUT0-15)
TSTG
TA
TJ
Min
Max
62
6
6
20
150
85
150
Unit
V
V
V
mA
Co
Co
Co
RθJA
110 Typical
Co/W
-55
-40
Absolute Maximum Ratings are
stress ratings. Stresses in excess of
these ratings can cause permanent
damage to the device. Functional
operation of the device at these or
any other conditions beyond those
indicated in the operational sections
of this data sheet is not implied.
Exposure of the device to the
absolute maximum ratings for an
extended period may degrade the
device and affect its reliability.
ESD Warning
ESD (electrostatic discharge) sensitive device. Although the MX8771 features proprietary ESD protection circuitry,
permanent damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
DC Electrical Characteristics
o
VCC=5.0V, VPWR=42V, TA=25 C, unless otherwise specified.
Parameter
Logic Supply Voltage
Quiescent Logic Supply Current
VPWR Voltage
VPWR Current
GND Current
Quiescent VPWR Current
High Level Input Voltage
Low Level Input Voltage
Input Leakage Current
Input hysteresis voltage
Output Low voltage, 3 mA sink
Out0-15 Current
Out0-15 ON Resistance
Out0-15 Tri-State Leakage
Condition
Min
1.65
Typ
Inputs = 0 or VCC
6
Total of all outputs
Total of all outputs
VPWR = 42V, No load
SDA, SCL, OE
Max
5.5
1
60
240
240
350
0.7VCC
0.3VCC
1
0.1VCC
SDA, VCC > 2
VCC < 2
Any one output, sink or source
VPWR = 42V
OE = Logic Low
0.4
0.2VCC
15
45
1
Unit
V
µA
V
mA
mA
uA
V
V
µA
V
V
mA
Ω
µA
Notes: To avoid unwanted output during VPWR application and system initialization, either reset the
device (RSTN logic low) or maintain OE logic low until the registers are initialized by I2C control.
Thermal Resistance is measured in still air with the device soldered to a 6 square inch board
without a ground plane. Applications may require derating of the specified maximum currents to
avoid exceeding the maximum operation junction temperature.
MX8771
Drawing No. 877109
2
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IXYS
MX8771
AC Electrical Characteristics
VCC=5.0V, VPWR=42V, TA=25oC, unless otherwise specified.
Parameter
Symbol
OUTX Rise Time
OUTX Fall Time
OE Rising to OUTX Rising
OE Rising to OUTX Falling
OE Falling to OUTX High Z
Condition
From 10% to 90%,
C(OUTx) = 200pF
From 10% to 90%,
C(OUTx) = 200pF
To 90%
To 90%
To 10%, OUTx High
To 10%, OUTx Low
Min
Typ
Max Unit
170
nS
140
nS
1100
600
900
900
nS
nS
nS
nS
Pin Description
Pin No.
Pin Name
Description
2
GND
Ground
3
GND
Ground
4
VPWR
High Voltage Supply
5
VPWR
High Voltage Supply
6
VCC
Logic Supply
7
OUT15
byte 2 bit 7 Output
8
OUT14
byte 2 bit 6 Output
9
OUT13
byte 2 bit 5 Output
10
OUT12
byte 2 bit 4 Output
11
OUT11
byte 2 bit 3 Output
12
OUT10
byte 2 bit 2 Output
13
OUT9
byte 2 bit 1 Output
14
OUT8
byte 2 bit 0 Output
15
A0
I2C device address
16
A1
I2C device address
17
A2
I2C device address
18
SDA
I2C Serial Data
19
SCL
I2C Serial Clock
20
OE
Output Enable
21
RSTN
Reset, active low
22
OUT0
byte 1 bit 0 Output
23
OUT1
byte 1 bit 1 Output
24
OUT2
byte 1 bit 2 Output
25
OUT3
byte 1 bit 3 Output
26
OUT4
byte 1 bit 4 Output
27
OUT5
byte 1 bit 5 Output
28
OUT6
byte 1 bit 6 Output
1
OUT7
byte 1 bit 7 Output
MX8771
Drawing No. 877109
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IXYS
MX8771
The MX8771 responds to two different slave addresses. The first address can be set from 20h to 27h by
connecting pins A2, A1, A0 according to the table below and is used to write and read from the 16-bit
data register. The second address is fixed at 28h and facilitates the simultaneous update of outputs from
multiple bytes and multiple MX8771's. The contents of the data register are transferred to the buffer
register when the i2c master issues a read command to address 28h. The data byte that is read from 28h
is a dummy byte whose value is undefined. Optionally the master can terminate the read command after
issuing the address and the read bit without actually reading a byte.
A2
A1
A0
i2c slave address
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
20 (hex)
21
22
23
24
25
26
27
RSTN OE
All Outputs
0
1
0
1
Hi-Z
Hi-Z
GND
i2c control
0
0
1
1
For the following timing examples, pin A2 = high, A1 = high, A0 = low
Write two bytes to the MX8771 data register and then update the MX8771 buffer register:
address 26h, W
byte 1
SDA
byte 2
7 6 5 4 3 2 1 0
address 28h, R
stop here
-ordummy read
stop
7 6 5 4 3 2 1 0
SCL
OUT
ack (slave)
start
ack (slave)
ack (slave)
start
no ack (master)
stop
ack (slave)
Read two bytes from the MX8771 data register:
address 26h + R
SDA
byte 1
7 6 5 4 3 2 1 0
byte 2
no ack (master)
7 6 5 4 3 2 1 0
SCL
start
MX8771
Drawing No. 877109
ack (slave)
ack (master)
4
stop
3/6/08
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IXYS
MX8771
28 LEAD 5MM X 5MM X 0.90MM QFN
PIN 1
(REF.)
DIMENSIONS
DIM.
INCH
MM.
MIN.
MAX.
MIN.
MAX.
A
.031
.039
.80
1.0
A1
0
.002
0
.05
A2
b
D
D2
E
E2
.008 REF.
.007
.012
.197 BSC
.118
.128
.197 BSC
.118
.128
e
.0197 BSC
L
.0177 .0256
N
28
,200 REF.
.18
.30
5.00 BSC
3.00
TOP VIEW
3.25
5.00 BSC
3.00
3.25
.500 BSC
.45
SIDE VIEW
.65
28
3. MOLDED PACKAGE SHALL CONFORM TO
JEDEC STANDARD CONFIGURATION
MO-220 VARIATION VHHD-1.
2. DIMENSIONS AND TOLERANCING CONFORM
TO ASME Y14.5M-1994.
1. COPLANARITY APPLIES TO THE EXPOSED
HEAT SINK SLUG AS WELL AS THE TERMINALS.
NOTES: (UNLESS OTHERWISE SPECIFIED)
BOTTOM VIEW
IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither
circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS’ Standard Terms and Conditions of Sale,
IXYS Corporation assumes no liability whatsoever, and disclaims any expressed or implied warranty, relating to its products
including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any
intellectual property right.
MX8771
Drawing No. 877109
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3/6/08
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IXYS
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MX8771
Drawing No. 877109
IXYS cannot assume responsibility for use of any circuitry other than circuitry
entirely embodied in this IXYS product. No circuit patent licenses nor indemnity
are expressed or implied. IXYS reserves the right to change the specification and
circuitry, without notice at any time. The products described in this document are
not intended for use in medical implantation or other direct life support
applications where malfunction may result in direct physical harm, injury or death
to a person.
Specification: MX8771
©Copyright 2008, IXYS Corporation
All rights reserved. Printed in USA.
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