LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA38B-86/RGY-1-PF DATA SHEET DOC. NO : QW0905-LA 38B-86/RGY-1-PF REV. : A DATE : 04 - May - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LA38B-86/RGY-1-PF Package Dimensions 5.0 5.9 7.6 8.6 7.5 5.8 25.0MIN □0.5 TYP 1 23 4 1.0MIN 4-1.27TYP 1.CATHODE RED 2.COMMON ANODE 3.CATHODE YELLOW 4.CATHODE GREEN 1.0MIN 1.0MIN LRGY3393-A/NP 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 1 23 4 1.0MIN 4-1.27TYP 1.CATHODE RED 2.COMMON ANODE 3.CATHODE YELLOW 4.CATHODE GREEN 1.0MIN 1.0MIN Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-86/RGY-1-PF Page 2/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT UR DGM UYR Forward Current IF 40 30 50 mA Peak Forward Current Duty 1/10@10KHz IFP 120 100 90 mA Power Dissipation PD 120 120 120 mW ESD ---- 150 2000 V Reverse Current @5V Ir 10 50 10 μA Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Electrostatic Discharge( * ) Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted Forward voltage @20mA(V) Luminous Viewing intensity angle @20mA(mcd) 2θ 1/2 (deg) Min. Typ. Max. Min. Typ. Lens 660 ---- 20 1.5 ---- 2.4 550 1100 32 InGaN/GaN Green Water Clear 518 525 36 ---- 3.5 4.0 900 1500 24 Yellow ---- 590 20 1.7 --- 2.6 900 1500 24 GaAlAs LA38B-86/RGY-1-PF Peak Dominant Spectral wave halfwidth wave length △λnm length λPnm λDnm AlGaInP Red Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-86/RGY-1-PF Page 3/7 Typical Electro-Optical Characteristics Curve UR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 20 0 40 60 80 100 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directive Radiation 1.0 0° -30° 30 ° 0.5 -60° 0.0 600 650 700 Wavelength (nm) 750 100% 75% 50% 60° 25% 0 25% 50% 75% 100% 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-86/RGY-1-PF Page 4/7 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0° -30 ° 30° 0.5 -60 ° 0.0 100% 75% 50% 450 500 550 Wavelength (nm) 600 60 ° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-86/RGY-1-PF Page 5/7 Typical Electro-Optical Characteristics Curve UYR CHIP Fig.2 Luminous Intensity vs. Forward Current 150 5.0 Luminous Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 100 50 0 0 0.5 1.0 1.5 2.0 2.5 4.0 3.0 2.0 1.0 0.0 0 3.0 50 1.06 1.04 1.02 1.00 0.98 0.96 0.94 0 20 40 60 80 100 Fig.4 Luminous Intensity vs. Temperature Luminous Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 150 Forward Current(mA) Forward Voltage(V) -40 100 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0° -30 ° 0.5 30 ° -60° 0.0 100% 75% 50% 500 550 600 Wavelength (nm) 650 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-86/RGY-1-PF Page 6/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA38B-86/RGY-1-PF Page 7/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11