LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LHIR9553 DATA SHEET DOC. NO REV DATE : : QW0905-L HIR9553 A : 16 - Mar. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LHIR9553 Package Dimensions 3.5 3.2 1.85 2.8 2.2 1.85 0.95 0.9 0.9 + - Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR9553 Page 2/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT HIR Forward Current IF 50 mA Peak Forward Current (300PPS,10 μs Pulse) IFP 1 A Power Dissipation PD 100 mW Reverse Voltagev Vr 5 V Operating Temperature Topr -55 ~ +100 ℃ Storage Temperature Tstg -55 ~ +100 ℃ Electrical Optical Characteristics (Aa=25℃) SYMBOL Min. Typ. Radiant Intensity Le 1.1 Aperture Radiant Incidence Ee 0.15 Peak Emission Wavelength PARAMETER Spectral Line Half Width UNIT TEST CONDITION 1.9 mW/sr IF=20mA 0.27 mW/cm IF=20mA λpeak 850 nm IF=20mA △λ 50 nm IF=20mA 1.6 V IF=20mA 100 μA VR=5V Forward Voltage VF Reverse Current IR Viewing Angle Max. 2θ1/2 1.2 2 120 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. deg LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LHIR9553 2.Handling Precaution 1 Do not poke the silicone encapsulant with sharp objec t 2 Hold the LED only by the body 3 Do not atach assembied PCB 4 Do not touch the silicone encapsulant 5 Clean the silicone surface whit cotton bud with minimal pressure 6 Use pick and place nozzle per recommendation in datasheet LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR9553 Page 4/8 Typical Electro-Optical Characteristics Curve HIR CHIP Fig.2 Relative Radiant Power vs. Wavelength Fig.1 Forward Current vs. Rorward Voltage 1.0 Relative Radiant Power Normalize @20mA Forward Current[mA] 1000 100 10 1 0.1 0.0 1.0 2.0 3.0 4.0 0.5 0.0 800 850 Wavelength[nm] Forward Voltage[V] Fig.3 Relative Radiant Power vs. Forward DC Current Fig.4 Relative Radiant Power vs. Forward Peak Current 10.0 Relative Radiant Power Normalize @100 mA Relative Radiant Power Normalize @20mA 10.0 1.0 0.1 1 0.1 10 100 10 1.0 100 Fig.5 Forward DC Voltage vs. Temperature Fig.6 Relative Radiant Power vs. Temperature 1.1 1.0 0.9 -20 0 20 40 60 80 Ambient Temperature [℃] 100 Relative Radiant Power Normalize @ 20mA, 25 ℃ 1.2 0.8 -40 1000 IFPK [mA] IFDC[mA] Forward DC Voltage Normalize @20mA, 25 ℃ 950 900 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature[ ℃] 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR9553 Page 5/8 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3. LEAD Reflow Solder Temp. (℃) 240 Rising +5 ℃/sec Cooling -5℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 4. PB-Free Reflow Solder 1~5° C/sec Preheat 180~200° C 1~5° C/sec 260° C MaX. 10sec.Max Above 220° C 60 sec.Max. 120 sec.Max. Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR9553 Page 6/8 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8 PART NO. LHIR9553 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : ≦30℃ ,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than168hrs in an atmosphere ≦ 30℃ ,RH<60%, The single LED end product must use for 125 ℃for 10hours to eliminate wet 4.If opened more than168hrs in an atmosphere ≦ 30℃ ,RH<60%, ℃ The reel and carrier end product must use for 60 ℃for 24 hours to eliminate wet Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. LEVEL CAUTION 3 2 1 This bag contains MOISTURE-SENSITIVE DEVICES 1.Shelf life in sealed bag:12months at ≦30℃ and<60﹪ relative humidity(RH)〔Complete package before open the packing〕 2.Once the package is opened,devices that will be subjected to infrared reflow must be (a)Mounted within 168 hours at factory conditions of≦30℃/60﹪RH (b)Stored at ≦30℃/≦10﹪RH within 168 hours (c)The aluminum foil bag does out the vacuum （d）From SMT to the IR timing control is 24 hours 3.If the humidity indicator 10 %RH is pink or after open package hrs house,the led monomer should be treated at125℃±5℃for10hrs. 4.The reel and carrier end product must use for 60 ℃for 24 hours to eliminate wet For the detail,please refer to the standard 3 3 0 D T S J C E D E J / C P I . 5 Date and time opened: Note:level and body temperature defined by IPC/JEDEC J-STD-020 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR9553 Page 8/8 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=65 ℃±5℃ 3.RH=90 %~95 % 4.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Endurance Test 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5 ℃& -40 ℃±5 ℃ (10min) (10min) 3.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell Time= 10 ±1sec. MIL-STD-202F: 210A MIL-STD-750D: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Immersion rate 25 ±2.5mm/sec 4.Immersion rate 25 ±2.5mm/sec 5.Coverage ≧95% of the dipped surface MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 1.105 ℃ ~ 25 ℃ ~ 55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Ramp-up rate(183 ℃ to Peak) +3 ℃ second max Temp. maintain at 125( ±25) ℃ 120 seconds max Temp. maintain above 183 ℃ 60-150 seconds Peak temperature range 235 ℃+5-0 ℃ Time within 5 ℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 ℃/second max MIL-STD-750D:2031.2 J-STD-020 Thermal Shock Test Environmental Test Temperature Cycling Solderability Test