LIGITEK LRGB63793-A-S1

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TRIPLE COLOR LED LAMPS
Pb
Lead-Free Parts
LRGB63793-A/S1
DATA SHEET
DOC. NO :
QW0905- LRGB63793-A/S1
REV.
:
A
DATE
:
27 - Aug.- 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/7
PART NO. LRGB63793-A/S1
Package Dimensions
4.55
6.6
25.0MIN
27.0MIN
0.5
TYP
1 2 3 4
1.0MIN
3-1.27TYP
1.CATHODE RED
2.COMMON ANODE
3.CATHODE GREEN
4.CATHODE BLUE
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
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Page 2/7
PART NO. LRGB63793-A/S1
Absolute Maximum Ratings at Ta=25 ℃
Absolute Maximum Ratings
Symbol
Parameter
UNIT
URFS
DGM
DBK
Forward Current
IF
50
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
100
100
mA
Power Dissipation
PD
120
120
120
mW
Ir
10
50
50
μA
Electrostatic Discharge( * )
ESD
2000
1000
1000
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
AlGaInP
LRGB63793-A/S1
InGaN/GaN Blue
Water Clear
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Typ. Max. Min. Typ.
Lens
Red
InGaN/GaN Green
Peak Dominant Spectral
wave halfwidth
wave
length
△λnm
length
λPnm λDnm
---
625
20
1.7 ---- 2.6
900 1500
84
518
525
36
---- 3.5 4.0 1500 2200
60
---
470
30
---- 3.5 4.0
60
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
550
900
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB63793-A/S1
Page 3/7
Typical Electro-Optical Characteristics Curve
URFS CHIP
Fig.2 Luminous Intensity vs. Forward Current
6.0
150
Luminous Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
100
50
0
0
0.5
1.0
1.5
2.0
2.5
5.0
4.0
3.0
2.0
1.0
0.0
0
3.0
50
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0
20
40
60
80
100
Fig.4 Luminous Intensity vs. Temperature
Luminous Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
-20
150
Forward Current(mA)
Forward Voltage(V)
-40
100
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
0°
-30°
1.0
30 °
-60 °
60°
0.5
100% 75% 50%
0
550
600
650
Wavelength (nm)
700
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB63793-A/S1
Page 4/7
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
0°
1.0
Relative Intensity@20mA
100
-30°
30 °
-60 °
0.5
0.0
100% 75% 50%
450
500
550
Wavelength (nm)
600
60 °
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB63793-A/S1
Page 5/7
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
5.0
1
10
1.2
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
80
3.0
2.5
2.0
1.5
1.0
100
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
0°
-30°
1.0
30°
-60 °
0.5
0.0
100% 75% 50%
400
450
Wavelength (nm)
60 °
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB63793-A/S1
Page 6/7
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
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Page 7/7
PART NO. LRGB63793-A/S1
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃ &-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11