LIGITEK LURFDGL9553-TR1

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LURFDGL9553/TR1
DATA SHEET
DOC. NO
REV
DATE
:
:
QW0905-L URFDGL9553/TR1
A
: 14 - Apr. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LURFDGL9553/TR1
Page 1/8
Package Dimensions
3.5
3.2
1.85
4
3
0.7±0.05
3.0
0.7±0.05
2.8
1
2
0.7±0.05
2.2
0.7±0.05
0.6
1.85
0.95
3 +
2 -
- 4
+1
DGL
1.3
0.8
URF
0.8
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Carrier Type Dimensions
4.0
2.0
0.23
1.55
1.75
5.5
12.0±0.3
4.06
9.3
Polarity
4.0
3.12
Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm.
2.24
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LURFDGL9553/TR1
Reel Dimensions
16.0±1.0
ψ178±2.0
14.2±1.0
74.0±1.5
Part No.
Description
Quantity/Reel
LURFDGL9553/TR1
12.0mm tape,7"reel
1500 devices
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LURFDGL9553/TR1
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
URF
DGL
Forward Current
IF
50
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
130
100
mA
Power Dissipation
PD
120
120
mW
Ir
10
50
μA
Electrostatic Discharge
ESD
2000
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
V
150
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR
PART NO
MATERIAL
Emitted
AlGaInP
Dominant
wave
length
λDnm
Spectral
halfwidth
△λ nm
Lens
Red
Forward
voltage
@20mA(V)
Luminous
intensity
Viewing
angle
@20mA(mcd) 2θ 1/2
(deg)
Min. Typ. Max. Min.
630
20
1.5 ---
505
32
---
Typ.
2.4
125
320
120
3.5 4.0
125
280
120
Water Clear
LURFDGL9553/TR1
InGaN/GaN Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LURFDGL9553/TR1
Page 4/8
Typical Electro-Optical Characteristics Curve
URF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0
0.1
1.0
1.5
2.0
2.5
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize@25℃
1.2
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
100
Fig.6 Directivity Radiation
0°
1.0
-30°
30°
-60°
60°
0.5
100% 75% 50%
0
550
600
650
Wavelength (nm)
700
25%
0
25% 50% 75% 100%
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/8
PART NO. LURFDGL9553/TR1
Typical Electro-Optical Characteristics Curve
DGL CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
100
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
2.5
2.0
1.5
1.0
0.5
0.0
-40
100
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
Fig.6 Directivity Radiation
1.0
0°
-30°
0.5
0.0
450
30°
-60°
500
550
Wavelength (nm)
600
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LURFDGL9553/TR1
Page 6/8
Recommended Soldering Conditions
1.
Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150 ℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5 ℃/sec
Cooling
-5℃/sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5°C/sec
Preheat
180~200 °C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220 °C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/8
PART NO. LURFDGL9553/TR1
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/8
PART NO. LURFDGL9553/TR1
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=1000hrs ±2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Temperature
Cycling
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5 ℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧ 95% of the dipped surface
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃
30mins 5mins 30mins 5mins
2.10 Cyeles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
Ramp-up rate(183 ℃ to Peak) +3 ℃ second max
Temp. maintain at 125( ±25)℃ 120 seconds max
Temp. maintain above 183 ℃ 60-150 seconds
Peak temperature range 235 ℃+5/-0 ℃
Time within 5 ℃ of actual Peak Temperature(tp)
10-30 seconds
Ramp-down rate +6 ℃ /second max
MIL-STD-750D:2031.2
J-STD-020
Environmental
Test
IR Reflow
MIL-STD-202F:103B
JIS C 7021: B-11