LIGITEK LY22441-PF-TRF-3

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
Pb
Lead-Free Parts
LY22441-PF/TRF-3
DATA SHEET
DOC. NO : QW0905- LY22441-PF/TRF-3-08
REV.
:
A
DATE
: 17 - Mar.- 2009
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LY22441-PF/TRF-3
Page 1/6
Package Dimensions
ΔH
P2
12.28~13.28
H2
H1 H
W2
L W0
W1 W3
P1 F
D
-
+
P
T
LY22441-PF
3.1
4.28
3.55
3.85
5.28
0.5
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LY22441-PF/TRF-3
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
Y
Forward Current
IF
15
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
50
mA
Power Dissipation
PD
50
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @ 10mA(V)
λPnm
Viewing
angle
@10mA(mcd) 2θ 1/2
(deg)
Min. TYP. Min. Typ.
Lens
LY22441-PF/TRF-3 GaAsP/GaP Yellow Yellow Transparent
Luminous
intensity
585
35
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.1
45
65
30
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LY22441-PF/TRF-3
Page 3/6
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
4.8
0.19
5.8
0.23
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
Height Of Seating Plane
-------
H
15.5
0.61
16.5
0.65
TRF-3
H1
22.5
0.89
24.5
0.96
Feed Hole To Bottom Of Component
Feed Hole To Overall Component Height
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
36
1.42
11.0
0.43
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
3.15
0.12
4.55
0.18
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
W0
REMARK:TRF=Tape And Reel Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Reel Diameter
D
78.2
3.08
380
14.96
Core Diameter
D1
34.9
1.37
102
4.02
Hub Recess Inside Diameter
D2
28.6
1.13
88.0
3.46
Arbor Hole Diameter
D3
13.8
0.54
38.1
1.5
Overall Reel Thickness
T
---
---
57.2
2.25
Iside Reel Flange Thickness
T1
30.0
1.18
50.0
1.97
LY22441-PF/TRF-3
2000PCS
D3
MARKING
D2
D1
D
T1 T2
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LY22441-PF/TRF-3
Page4/6
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
0°
-30 °
1.0
30 °
-60 °
0.5
60 °
0.0
500
550
600
650
Wavelength (nm)
700
100% 75% 50%
25%
0
25%
50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LY22441-PF/TRF-3
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LY22441-PF/TRF-3
Page 6/6
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11