LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only FEATURES * SPECIAL FOR HIGH CURRENT AND LOW FORWARD VOLTAGE * HIGH POWER * AVAILABLE FOR PULSE OPERATING * WIDE VIEWING ANGLE * WATER CLEAR PACKAGE * SOLDER PLATED LEADS PACKAGE DIMENSIONS NOTES: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.5mm(.059") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. 6. The vender of dice is OTC. Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4 Page : 1 of 5 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only ABSOLUTE MAXIMUM RATINGS AT TA=25℃ PARAMETER MAXIMUM RATING UNIT 150 mW 2 A 100 mA 5 V Power Dissipation Peak Forward Current (300pps, 10μs pulse) Continuous Forward Current Reverse Voltage Operating Temperature Range -40℃ to + 85℃ Storage Temperature Range -55℃ to + 100℃ Lead Soldering Temperature [4.0mm(.157") From Body] 320℃ for 3 Seconds ELECTRICAL / OPTICAL CHARACTERISTICS AT TA=25℃ PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION mW/c㎡ IF = 20mA mW/sr IF = 100mA 10.5 mW/sr IF = 20mA λP 940 nm IF = 20mA Δλ 50 nm IF = 20mA Forward Voltage VF 1.25 1.6 V IF = 50mA Forward Voltage VF 1.65 2.1 V IF = 250mA Forward Voltage VF 2.0 2.4 V IF = 450mA Reverse Current IR 100 μA VR = 5V Aperture Radiant Incidence Ee 0.80 Radiant Intensity IE 30 Radiant Intensity IE 6 Peak Emission Wavelength Spectral Line Half-Width Viewing Angle (See FIG.6) 2θ1/2 Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4 20 1.4 50 deg. Page : 2 of 5 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only TYPICAL ELECTRICAL / OPTICAL CHARACTERISTICS CURVES (25℃ Ambient Temperature Unless Otherwise Noted) 120 Forward Current IF (mA) Relative Radiant Intensity 1.0 0.5 940 60 40 20 0 1040 -40 -20 0 20 40 60 80 100 Wavelength (nm) Ambient Temperature Ta ( o C) FIG.1 SPECTRAL DISTRIBUTION FIG.2 FORWARD CURRENT VS. AMBIENT TEMPERATURE 1000 1.2 100 10 0 1.0 1.5 2.0 2.5 1.0 0.8 0.6 0.4 0.2 0 3.0 -20 0 20 40 60 80 Forward Voltage (V) Ambient Temperature Ta ( o C) FIG.3 FORWARD CURRENT VS. FORWARD VOLTAGE FIG.4 RELATIVE RADIANT INTENSITY VS. AMBIENT TEMPERATURE 40 36 32 28 24 20 16 12 8 4 0 0 Relative Radiant Intensity Output Power Relative To Value at IF=20mA 80 Output Power Relative To Value at IF=20mA Forward Current (mA) 0 840 100 0 200 400 600 800 1000 o 10 o 20 o 30 o 40 o 1.0 0.9 50 o 0.8 60 o 0.7 70 80 90 o 0.5 0.3 0.1 o o 0.2 0.4 0.6 Foward Current (mA) FIG.5 RELATIVE RADIANT INTENSITY VS. FORWARD CURRENT Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4 FIG.6 RADIATION DIAGRAM Page : 3 of 5 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only PACKING LTE-3271T-A1 16 m 5m 130mm LTE-3271T-A1 30 DIVICE NO. BIN 0m m QUANTITY LTE-3271T-A1 295mm 61 Q.C STAMP 0m m 35 m 0m Bag volume (pcs / Bag) Inner carton volume (Bag / carton) Outer carton volume (Box / Carton) Total volume (pcs/outer carton) 1000 8 8 64000 Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4 Page : 4 of 5 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 320°C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100°C Max. 60 sec. Max. 260°C Max. 5 sec. Max. Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4 Page : 5 of 5