LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only Features * Low power consumption. * High efficiency. * Versatile mounting on p.c. board or CBI. * I.C. compatible/low current requirement. * Narrow viewing angle for more brightness. Package Dimensions Part No. Lens Source Color LTL102SFK Water Clear AlInGaP Yellow Orange Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 1 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only Absolute Maximum Ratings at TA=25℃ Parameter Maximum Rating Unit 120 mW 90 mA Continuous Forward Current 50 mA Derating Linear From 50℃ 0.6 mA/℃ 5 V Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Reverse Voltage Operating Temperature Range -40℃ to + 100℃ Storage Temperature Range -55℃ to + 100℃ Lead Soldering Temperature [1.6mm(.063") From Body] Part No. : LTL102SFK BNS-OD-C131/A4 260℃ for 5 Seconds Page : 2 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only Electrical / Optical Characteristics at TA=25℃ Parameter Symbol Min. Typ. IV 4500 7200 mcd IF = 20mA Note 1 2θ1/2 15 deg Note 2 (Fig.5) Peak Emission Wavelength λP 610 nm Measurement @Peak (Fig.1) Dominant Wavelength λd 605 nm Note 4 Δλ 17 nm Forward Voltage VF 2.0 Reverse Current IR Capacitance C Luminous Intensity Viewing Angle Spectral Line Half-Width 40 Max. Unit 2.4 V 100 μA pF Test Condition IF = 20mA VR = 5V VF = 0 , f = 1MHz NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Iv classification code is marked on each packing bag. 4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 3 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only Typical Electrical / Optical Characteristics Curves (25℃ Ambient Temperature Unless Otherwise Noted) Part No. : LTL102SFK BNS-OD-C131/A4 Page : 4 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only Bin Code List For Reference Luminous Intensity Unit : mcd @20mA Bin Code Min. Max. V 4500 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Dominant Wavelength Part No. : LTL102SFK BNS-OD-C131/A4 Unit : nm @20mA Bin Code Min. Max. H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 Page : 5 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Lite-on’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity . It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in a dessicator with nitrogen ambient. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the leadframe as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition : Soldering iron Wave soldering 100°C Max. Pre-heat 60 sec. Max. Pre-heat time 260°C Max. Solder wave 10 sec. Max. Soldering time Note.: Excessive soldering temperature and / or time might result in deformation of the LED lens or catastrophic Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) failure of the LED. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 6 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only 6. Drive Method An LED is a current operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit. in series with each LED as shown in Circuit A below. (A) Recommended circuit. Circuit model A Circuit model B (B) The brightness of each LED might LED LED appear different due to the differences in the I-V characteristics of those LEDs 7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: ■ Use a conductive wrist band or anti- electrostatic glove when handling these LEDs. ■ All devices, equipment and machinery must be properly grounded. ■ Work tables , storage racks , etc. should be properly grounded. ■ Use ion blower to neutralize the static charge which might have built up on surface of the LED's plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “no lightup” at low currents. To verify for ESD damage, check for “lightup” and Vf of the suspect LEDs at low currents. The Vf of “good” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product. Chip ESD level Machine Mode Human Body Mode InGaN/Sapphire 100 V 300 V AlInGaP 200 V 500 V InGaN / SiC 600 V 1000 V 8. Reliability Test Classification Test Item ENDURANCE TEST OPERATION LIFE Part No. : LTL102SFK BNS-OD-C131/A4 Test Condition Reference Standard Ta= UNDER ROOM TEMPERATURE AS PER MIL-STD-750D : 1026 (1995) DATA SHEET MAXIMUM RATING MIL-STD-883D : 1005 (1991) *TEST TIME= 1000HRS (-24HRS, +72HRS) JIS C 7021 : B-1 (1982) Page : 7 of 8 LITE-ON TECHNOLOGY CORPORATOIN Property of Lite-On Only Classification Test Item Test Condition Reference Standard Ta= 65±5℃ MIL-STD-202F: 103B(1980) TEMPERATURE RH= 90 ～ 95% JIS C 7021 : B-11(1982) HIGH HUMIDITY TEST TIME= 240HRS±2HRS ENDURANCE TEST HIGH STORAGE HIGH Ta= 65±5℃ TEMPERATURE RH= 90 ～ 95% HIGH HUMIDITY VR=5V REVERSE BIAS TEST TIME= 500HRS (-24HRS, +48HRS) HIGH Ta= 105±5℃ MIL-STD-883D : 1008 (1991) TEMPERATURE TEST TIME= 1000HRS (-24HRS, +72HRS) JIS C 7021 : B-10 (1982) LOW Ta= -55±5℃ JIS C 7021 : B-12 (1982) TEMPERATURE TEST TIME= 1000HRS (-24HRS, +72HRS) JIS C 7021 : B-11(1982) STORAGE STORAGE ENVIRONMENTAL TEMPERATURE 105℃ ～ 25℃ ～ -55℃ ～ 25℃ MIL-STD-202F : 107D (1980) TEST CYCLING 30mins MIL-STD-750D : 1051(1995) 5mins 30mins 10CYCLES 5mins MIL-STD-883D : 1010 (1991) JIS C 7021 : A-4(1982) THERMAL SHOCK 105 ± 5℃ ～ -55℃ ± 5℃ 10mins 10mins MIL-STD-202F : 107D(1980) MIL-STD-750D : 1051(1995) 10CYCLES MIL-STD-883D : 1011 (1991) SOLDER T.sol= 260 ± 5℃ MIL-STD-202F : 210A(1980) RESISTANCE DWELL TIME= 10 ± 1secs MIL-STD-750D : 2031(1995) JIS C 7021 : A-1(1982) SOLDERABILITY T.sol= 230 ± 5℃ MIL-STD-202F : 208D(1980) DWELL TIME= 5 ± 1secs MIL-STD-750D : 2026(1995) MIL-STD-883D : 2003(1991) JIS C 7021 : A-2(1982) 9. Others The appearance and specifications of the product may be modified for improvement, without prior notice. Part No. : LTL102SFK BNS-OD-C131/A4 Page : 8 of 8