LRC L1SS400GT1G

LESHAN RADIO COMPANY, LTD.
Switching diode
L1SS400GT1G
• Applications
High speed switching
• Features
1) Extremely small surface mounting type.
1
2) High Speed.
3) High reliability.
2
• Construction
Silicon epitaxial planar
SOD - 723
• We declare that the material of product
compliance with RoHS requirements.
1
CATHODE
• Device Marking
L1SS400GT1G=3
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Parameter
Symbol
Peak reverse voltage
VRM
DC reverse voltage
VR
Peak forward current
I FM
Mean rectifying current
IO
Surge current (1s)
I surge
Junction temperature
Tj
Storage temperature
Tstg
Limits
90
80
225
100
500
125
– 55 ~ +125
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Parameter
Symbol
Min.
Forward voltage
VF
–
Reverse current
IR
–
Capacitance between terminals
CT
–
Reverse recovery time
trr
–
Typ.
–
–
0.72
–
2
ANODE
Unit
V
V
mA
mA
mA
°C
°C
Max.
1.2
0.1
3.0
4
Unit
V
µA
pF
n
Conditions
I F=100mA
VR=80V
VR=0.5V , f=1MHz
sR=6V , VIF=10mA , RL=100 Ω
ORDRING INFORMATION
Device
Marking
Shipping
L1SS400GT1G
3
3000/Tape&Reel
L1SS400GT3G
3
10000/Tape&Reel
1/3
LESHAN RADIO COMPANY, LTD.
L1SS400GT1G
ELECTRICAL CHARACTERISTIC CURVES
(Ta = 25°C)
1m
1
FORWARD CURRENT : IF (A)
0.1m
REVERSE CURRENT : IR (A)
100m
10m
1m
100µ
10µ
1µ
100n
10n
1n
10µ
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
20
40
60
80
100
FORWARD VOLTAGE : VF (V)
REVERSE VOLTAGE : VR (V)
Fig.1 Forward characteristics
Fig.2 Reverse characteristics
120
3
10
5
REVERSE RECOVERY TIME : trr (ns)
CAPACITANCE BETWEEN TERMINALS : CT (pF)
0
2
1
0.5
0.2
2
1
0
0.1
0
2
4
6
8
10
12
14
REVERSE VOLTAGE : VR (V)
Fig.3 Capacitance between terminals
0
10
20
30
FORWARD CURRENT : I F (mA)
Fig.4 Reverse recovery time characteristics
100
SURGE CURRENT : Isurge (A)
50
0.01µF
D.U.T.
20
10
PULSE GENERATOR
OUTPUT 50Ω
5kΩ
50Ω
SAMPLING
OSCILLOSCOPE
5
2
Fig.6 Reverse recovery time (trr)
measurement circuit
1
0.1
1
10
100
1000
10,000
PULSE WIDTH : TW (ms)
Fig.5 Surge current characteristics
2/3
LESHAN RADIO COMPANY, LTD.
L1SS400GT1G
SOD−723
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
b
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
MILLIMETERS
INCHES
MIN
NOM MAX MIN
NOM MAX
0.49
0.52
0.55
0.019 0.020 0.022
0.25
0.28
0.32 0.0098 0.011 0.013
0.08
0.12
0.15 0.0032 0.0047 0.0059
0.95
1.00
1.05
0.037 0.039 0.041
0.55
0.60
0.65
0.022 0.024 0.026
1.35
1.40
1.45
0.053 0.055 0.057
0.15
0.20
0.25
0.006 0.0079 0.010
HE
SOLDERING FOOTPRINT*
1.1
0.043
0.45
0.0177
0.50
0.0197
SCALE 10:1
mm Ǔ
ǒinches
3/3