3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT4PR060-BL HIGH POWER AUTOMATIVE LED ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES HIGH POWER AUTOMATIVE LED MT4PR060-BL Package Dimensions 7.62±0.5 +1 +4 1 4 2 3 7.62±0.5 +2 +3 3.0 ± 0.2 4.4±0.2 1.5 0.5 2.5 7.5±0.2 0.4±0.2 1.55±0.2 5.08±0.3 5.08±0.3 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted Description LED Chip Part No. MT4PR060-BL Material Emitting Color InGaN/Sapphire Blue VER.: 01 Lens Color Water Clear Date: 2007/08/24 Page: 1/6 HIGH POWER AUTOMATIVE LED MT4PR060-BL Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 120 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +100 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature (1.6mm from body) Tsld. Electric Static Discharge Threshold (HBM) ESD Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering: 260℃ for 5 sec. Hand Soldering: 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. IV If=30mA 500 930 Luminous Flux Φv If=30mA 250 1200 mlm Forward Voltage Vf If=30mA 3.0 4.0 V Peak Wavelength λp If=30mA Dominant Wavelength λd If=30mA Reverse Current Ir Vr=5V Viewing Angle 2θ1/2 If=30mA 60 deg ∆λ If=30mA 26 nm Luminous Intensity Spectrum Line Halfwidth Max. mcd -----465 Unit nm 475 nm 50 µA Notes: 1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/08/24 Page: 2/6 HIGH POWER AUTOMATIVE LED MT4PR060-BL Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) 1500 Relative Luminous Intensity(mcd) Forward Current IF(mA) 50 40 30 20 10 2.2 2.6 3.0 3.4 3.8 4.2 1200 900 600 300 0 Applied Voltage (V) Forward Current VS. Applied Voltage 0.0 20.0 10.0 Forward Current (mA) 30.0 Forward Current VS. Luminous Intensity 0° 50 10° 20° Forward Current IF(mA) 30° 40 30 20 40° RΘj-a=251℃/W 1.0 RΘj-pin=117℃/W 0.9 10 0 50° 60° 0.8 20 40 60 80 100 Ambient Temperature Ta (℃) (TjMax.=110℃) Ambient Temperature VS. Forward Current 70° 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 Radiation Diagram VER.: 01 Date: 2007/08/24 Page: 3/6 MT4PR060-BL HIGH POWER AUTOMATIVE LED Specifications for Bin Grading: Φv(mlm) Bin Min. Max. B 250 500 C 400 800 D 600 1200 Specifications for Vf Group: Vf(V) Bin Min. Max. V8 3.0 3.2 V9 3.2 3.4 V10 3.4 3.6 V11 3.6 3.8 V12 3.8 4.0 Specifications for Wavelength Group: WLD(nm) Bin Min. Max. X4 465 470 X5 470 475 VER.: 01 Date: 2007/08/24 Page: 4/6 HIGH POWER AUTOMATIVE LED MT4PR060-BL Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/08/24 Page: 5/6