3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT5150-UG 5.0mm ROUND LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 5.0 mm ROUND LED LAMP MT5150-UG Description This true green lamp is made with InGaN/Sapphire chip and water clear 24.0 MIN. 1.5 TYP. 0.5 MAX. 8.7 5.9 epoxy resin. K A Notes: 1. All dimensions are in mm. 2. Tolerance is±0.25mm unless otherwise noted. Description LED Chip Part No. MT5150-UG Material Emitting Color InGaN/Sapphire True green Lens Color Water clear VER.: 01 Date: 2007/03/22 Page: 1/5 5.0 mm ROUND LED LAMP MT5150-UG Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 100 mW Reverse Voltage VR 5 V D.C. Forward Current If 25 mA Reverse (Leakage) Current Ir 50 μA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +95 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol. Electrostatic discharge ESD. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 12000 22000 Forward Voltage Vf If=20mA Dominant Wavelength λd If=20mA Reverse (Leakage) Current Ir Vr=5V 2θ1/2 If=20mA 15 deg ∆λ If=20mA 35 nm Viewing Angle Spectrum Line Halfwidth 520 Max. Unit mcd 3.2 4.0 V 525 535 nm 50 µA Notes: 1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/03/22 Page: 2/5 5.0 mm ROUND LED LAMP MT5150-UG Typical Electrical / Optical Characteristics Curves : Relative Luminous Intensity(mcd) Forward Current IF(mA) 50 40 30 20 10 2.0 2.4 2.8 3.2 3.6 50000 40000 30000 20000 10000 4.0 0.0 20.0 10.0 30.0 Forward Current (mA) Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 50 20° 10° Forward Current IF(mA) 30° 40 R j-pin=230℃/W 40° 30 1.0 20 50° 0.9 60° 0.8 70° 80° 90° 10 R j-a=480 ℃/W 0.7 0 20 40 60 Temperature (℃) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM VER.: 01 Date: 2007/03/22 Page: 3/5 MT5150-UG 5.0 mm ROUND LED LAMP Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. Z1 12000 16800 Z2 16800 23500 Z3 23500 32900 Specifications for Vf Group: Vf(V) Group MIN. MAX. V6 2.6 2.8 V7 2.8 3.0 V8 3.0 3.2 V9 3.2 3.4 V10 3.4 3.6 V11 3.6 3.8 V12 3.8 4.0 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: λD(nm) @20mA Group MIN. MAX. X7 520 525 X8 525 530 X9 530 535 VER.: 01 Date: 2007/03/22 Page: 4/5 MT5150-UG 5.0 mm ROUND LED LAMP Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) 3. Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/03/22 Page: 5/5