MARKTECH TLEGD1052

TLBD1052(T20),TLEGD1052(T20)
TOSHIBA LED Lamp
Preliminary
TLBD1052(T20),TLEGD1052(T20)
Panel Circuit Indicator
unit:mm
•
5.2 (L) × 5.2 (W) × 4.0 (H) mm size
•
TL□H1052 (T20) Series
•
Colors
•
Clear luminescence is obtained.
•
High Operating Temperature
3.6 × 4.4 mm transparent oval lens top type
: Blue λd=470 nm (typ.)
: Green λd=528 nm (typ.)
: Topr = −40~100°C (85℃)
: Tstg=−40~110℃
•
Can be mounted using surface mounter.
•
Reflow Soldering is possible.
•
Standard Embossed Taping
•
Applications : message signboards, backlighting,
amusement, etc
8 mm pitch : T20(400pcs/Reel)
Color and Material
Product Name
TLBD1052
TLEGD1052
Color
Material
Blue
InGaN
Green
InGaN
JEDEC
―
JEITA
―
TOSHIBA
4-5AU1
Weight: 0.085g
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TLBD1052(T20),TLEGD1052(T20)
Absolute Maximum Ratings (Ta = 25°C)
Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
30
4
120
TLBD1052
TLEGD1052
Operation
Temperature
Topr (°C)
−40~85
−40~100
Storage
Temperature
Tstg (°C)
−40~110
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
IF – Ta
(mA)
25
Allowable forward current
30
IF
35
TLBD1052
TLEGD1052
20
15
10
5
0
0
20
40
60
Ambient temperature
80
100
Ta
120
(°C)
Electrical Characteristics (Ta = 25°C)
Product Name
Forward Voltage VF
Min.
Typ.
Max.
TLBD1052
2.7
3.3
4.0
TLEGD1052
2.7
3.3
4.0
Unit
V
Reverse Current IR
IF
Max.
VR
20
10
4
mA
µA
V
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2008-01-10
TLBD1052(T20),TLEGD1052(T20)
Optical Characteristics-1 (Ta = 25°C)
Product Name
TLBD1052
Luminous Intensity IV
Available Iv rank
Min.
Typ.
Max.
IF
Please see Note 2
85
300
736
20
N/P/Q
Q/R/S
TLEGD1052
272
850
2300
20
Unit
mcd
mcd
mcd
mA
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Rank
Luminous Intensity IV
Min
Max
N
85
230
P
153
414
Q
272
736
R
476
1290
S
850
2300
Unit
mcd
mcd
Optical Characteristics-2 (Ta = 25°C)
Emission Spectrum
Product Name
Peak Emission
Wavelength λp
Min
Typ
Max
∆λ
Dominant Wavelength λd
Typ
Min
Typ
Max
TLBD1052
⎯
468
⎯
25
463
470
479
TLEGD1052
⎯
518
⎯
35
517
528
540
Unit
nm
nm
nm
IF
20
mA
The cautions
•
•
ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
These products are designed as a general display light source usage, and they have applied the measurement
standard that matched with the sensitivity of human's eyes. Therefore, they are not intended for usage of
functional application (ex. Light source for sensor, optical communication and etc) except general display light
source.
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TLBD1052(T20),TLEGD1052(T20)
TLBD1052
IF – V F
IV – IF
100
1000
Ta = 25°C
Ta = 25°C
Luminous intensity IV (mcd)
Forward current IF
(mA)
500
300
30
100
10
3
1
2.2
2.6
3.0
3.4
3.8
4.2
Forward voltage VF
4.6
50
30
10
1
5.0
5
10
30
Forward current IF
100
50
(mA)
Relative luminous intensity – wavelength
IV – Tc
10
3
(V)
1.0
Relative luminous intensity
Relative luminous intensity IV
Ta = 25°C
5
3
1
0.5
0.3
0.8
0.6
0.4
0.2
0.1
−20
0
20
40
60
80
1
300
100
400
500
600
700
Wavelength λ (nm)
Case temperature Tc (°C)
Radiation pattern
Ta = 25°C
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TLBD1052(T20),TLEGD1052(T20)
TLEGD1052
IV – IF
IF – V F
10000
100
Luminous intensity IV (mcd)
Forward current IF
(mA)
Ta = 25°C
30
10
3
1
2.2
2.6
3.0
3.4
3.8
4.2
Forward voltage VF
3000
1000
500
300
100
1
5.0
(V)
5
10
30
50
100
(mA)
Relative luminous intensity – wavelength
1.0
10
Ta = 25°C
5
Relative luminous intensity
Relative luminous intensity IV
3
Forward current IF
IV – Tc
3
1
0.5
0.3
0.1
Ta = 25°C
5000
−20
0
20
40
60
80
0.8
0.6
0.4
0.2
1
300
100
400
500
600
700
Wavelength λ (nm)
Case temperature Tc (°C)
Radiation pattern
Ta = 25°C
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TLBD1052(T20),TLEGD1052(T20)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 72 hours in an
environment of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also,
be sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do
not toss or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
260°C max
140~160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60~120 s max(*)
Time
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150~180°C 230°C
4°C/s max(*)
max(*)
60~120 s
Time
(s)
30~50s max(*)
(s)
•
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
•
Perform the first reflow soldering in accordance with the above temperature profile and within 72 hours of
opening the package.
•
Second time reflow
In case of second reflow soldering should be performed within 72 hours of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 5∼30°C, 70% RH max
•
Do not perform flow soldering.
•
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: Less than 25 W
Temperature : Less than 350°C or less
Time
: within 3 s (Up to 1time per place)
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TLBD1052(T20),TLEGD1052(T20)
Recommended soldering pattern
2.45
1.3
Unit: mm
2.45
2.7
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our
dipping tests (carried out under the recommended conditions) confirm that these solvents have no effect on
semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account
the cleaning conditions and usage conditions.
Cleaning Solvent
Manufacturer
ASAHI CLEAN AK-225AES
KAO CLEANTHROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
ASAHI GLASS
KAO
ARAKAWA CHEMICAL
GE TOSHIBA SILICONES
Precautions When Mounting
Do not apply force to plastic parts of the LED under high-temperature conditions.
The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.
When installing the PCB in a product, ensure that the device does not come into contact with other components.
Tape Specifications
This specification lays out the 8 mm pitch embossed-tape packing requirements for 5.2 mm (L) × 5.2 mm (W) ×
4.0 mm (H) size surface-mount LED lamp.
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method
of classification is as below. (This method, however, does not apply to products whose electrical
characteristics differ from standard Toshiba specifications.)
(1) Tape Type: T20 (8-mm pitch)
(2) Example
TLBD1052
(T20)
Tape type
Toshiba product No.
2. Related Matters
(1) Electro-optical Characteristics
Please refer to the each technical datasheet for electro-optical characteristics of tape packed
products.
(2) Handling Precautions
Tape material protected against static electricity. However, static electricity may occur
depending on quantity of charged static electricity and a device may attach to a tape, or a device
may be unstable when peeling a tape cover.
(a) In process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize
the ions.
(b) For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are
made of anti-static materials or of materials that dissipate electrostatic electricity.
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TLBD1052(T20),TLEGD1052(T20)
3. Tape Dimensions
Unit in mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
12.0
±0.2
P0
4.0
±0.1
P
8.0
±0.1
t
0.4
±0.05
A0
5.5
±0.1
F
5.5
±0.05
B0
5.5
±0.1
D1
1.6
±0.1
K0
4.4
±0.1
K0
P0
D
t
P2
E
F
W
B0
A0
P
POLARITY
D1
4. Reel Dimensions
Unit in mm
13 ± 0.3
8
φ60
2 ± 0.5
φ13
φ44
180 +0
−4
15.4 ± 1.0
2008-01-10
TLBD1052(T20),TLEGD1052(T20)
5. Leader and Trailer
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
6.Packing display
(1)Packing quantity
Tape type
T20
No.
①
②
③
④
⑤
Bar-code label
Reel
400 pcs
Item
Reel
Silica gel with a
humidity indicator
Aluminum pack
Cushion
Carton
Carton
2000 pcs
④
Bar-code label
⑤
①
②
comment
③
(2)Packing form: Each reel and a silica gel with a humidity indicator are sealed in an aluminum pack.
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TLBD1052(T20),TLEGD1052(T20)
7.Label format
(1))Example:TLBD1052(T20)
*See below for how to decipher the Lot Number.
P/N:
TYPE TLBD1052
ADDC (T20)
Q
TY
Lot. Number & Symbol for control
(Rank symbol)
Use under 5-30degC/70%RH within 72h
[[G]]/ RoHS COMPATIBLE
*(Y)380□□□□
400 Symbol for control
TOSHIBA
400pcs
400
SEALED May,17,2007
DIFFUSED IN USA
ASSEMBLED IN JAPAN
∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥
∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥
(2)Label location
•
Reel
•
Carton
Tape reel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has a copy of the label
attached to the center of one side.
*The Lot Number includes the following information.
Example: 270 7 E 2 G
a
→
“Packaged May 17, 2007”
bcde
a:
Domestic ID
b:
Last digit of the year (CE): “0” (Y2000), “1” (Y2001), “2” (Y2002) ~ “9” (Y2009)
c:
Month: “A” (Jan), “B” (Feb), “C” (Mar) ~ “L” (Dec)
Repeated for each decade
d:
Decade of the month: “1” (First), “2” (Middle), “3” (Last)
e:
Day in d above: “A” (1st), “B” (2nd), “C” (3rd) ~ “J” (9th), “K” (10th)
“L” denotes the 31st of the month
“I” is not used to denote a day in this date system
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TLBD1052(T20),TLEGD1052(T20)
RESTRICTIONS ON PRODUCT USE
030619EAC
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
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2008-01-10