MILL-MAX 833-93-001-10

INTERCONNECTS
2mm Grid Headers and Sockets
Single and Double Row
Series 830, 831
832, 833
• Series 830 single and double row
interconnects have 2mm pin spacing and
permit board stacking as low as .322”.
• Pin headers (830 & 832 series) use MM
#5012 pins. See page 175 for details.
• Sockets (831 & 833 series) use MM #1802
receptacles and accept pin diameters from
.015”-.025”. See page 140 for details.
• Insulators are high temp. thermoplastic,
suitable for all soldering operations.
RoHS
2002/95/EC
Fig. 1
Ordering Information
Single Row Pin Header
Fig. 1
830-XX-0_ _-10-001000
Specify # of pins
01-50
Double Row Pin Header
832-XX-_ _ _-10-001000
Fig. 2
Specify # of pins
Fig. 2
For Electrical,
Mechanical & Enviromental
Data, See pg. 4
002-100
For RoHS compliance
select plating code.
XX=Plating Code
See Below
SPECIFY PLATING CODE XX=
10
10μ” Au
Pin Plating
90
40
200μ” Sn/Pb
200μ” Sn
Single Row Socket
Fig. 3
831-XX-0_ _-10-001000
Specify # of pins
Fig. 3
01-50
Double Row Socket
833-XX-_ _ _-10-001000
Fig. 4
Specify # of pins
For Electrical,
Mechanical & Enviromental
Data, See pg. 4
SPECIFY PLATING CODE XX=
Fig. 4
w w w. m i l l - m a x . c o m
For RoHS compliance
select plating code.
XX=Plating Code
See Below
13 Sleeve (Pin)
10µ” Au
Contact (Clip)
30µ” Au
70
002-100
91
93
41 99
43 44 200µ” Sn/Pb 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn 200µ”Sn
10µ” Au
30µ” Au
200µ”Sn/Pb
10µ” Au
30µ” Au 200µ”Sn
516-922-6000