SG6100/SG6511 SG6101/SG6510 DIODE ARRAY CIRCUITS DESCRIPTION FEATURES The SG6100/SG6511 and SG6101/SG6510 diode arrays are monolithic, high breakdown, fast switching speed diode arrays. The SG6100/SG6511 is configured with 7 straight through diodes, while the SG6101/SG6510 has 8 straight through diodes. • • • • These two diode array configurations allow the designer maximum flexibility for circuit design and board layout. Since each diode within the array has individual anode and cathode connections the device may be used in a variety of applications. Also, due to the array's monolithic construction the diode electrical parameters are very closely matched. HIGH RELIABILITY FEATURES Both devices are available in ceramic DIP and flatpack and can be processed to Linfinity's S level, JANTXV, JANTX, or JAN equivalent flows. 75V minimum breakdown voltage 100mA current capability per diode Switching speeds less than 5ns Low leakage current < 25nA ♦ MIL-S-19500/474 QPL - 1N6100 - 1N6101 - 1N6510 - 1N6511 ♦ Equivalent JANS, JANTXV, JANTX, JAN screening available CIRCUIT DIAGRAMS 7 - STRAIGHT THROUGH DIODES SG6100/SG6511 8 - STRAIGHT THROUGH DIODES SG6101/SG6510 LINFINITY 6/91 Rev 1.1 2/94 Copyright 1994 1 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 DIODE ARRAY SERIES ABSOLUTE MAXIMUM RATINGS (Note 1 & 2) Breakdown Voltage (VBR) .................................................... 75V Output Current (IO), TC = 25°C Continuous ................................................................. 300mA Operating Junction Temperature Hermetic (J, F Packages) ............................................ 150°C Storage Temperature Range ............................ -65°C to 200°C Lead Temperature (Soldering, 10 seconds) .................. 300°C Note 1. Exceeding these ratings could cause damage to the device. Note 2. Applicable for each diode. THERMAL DATA J Package (14 & 16 Pin): Thermal Resistance-Junction to Case , θ JC .................. 30°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 80°C/W F Package (14 Pin): Thermal Resistance-Junction to Case , θ JC .................. 80°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 140°C/W F Package (16 Pin): Thermal Resistance-Junction to Case , θ JC .................. 70°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 115°C/W RECOMMENDED OPERATING CONDITIONS Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pcboard system. All of the above assume no ambient airflow. (Note 3) Operating Ambient Temperature Range SG6100 .......................................................... -55°C to 150°C SG6101 .......................................................... -55°C to 150°C SG6511 .......................................................... -55°C to 150°C SG6510 .......................................................... -55°C to 150°C Note 3. Range over which the device is functional. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply for the operating ambient temperature of TA = 25°C for each diode. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Parameter Breakdown Voltage (VBR ) Forward Voltage (VF) Reverse Current (IR) Capacitance (C) (Note 4) Forward Recovery Time (tfr) (Note 4) Reverse Recovery Time (trr) (Note 4) Test Conditions IR = 5µA, Duty Cycle < 20% Duty Cycle ≤ 2%, 300 µs pulse IF = 100mA IF = 10mA, TA = -55°C VR = 20V VR = 40V VR = 40V, TA = 150°C VR = 0V, f = 1MHz, Pin-to-pin SG6100/SG6511 SG6010/SG6510 Min. Typ. Max. 75 Units V 1.0 1.0 25 100 50 4 V V nA nA µA pf IF = 500mA, tr ≤ 15ns, V fr = 1.8V, RS = 50Ω 15 ns IF = IR = 200mA, irr = 20mA, RL = 100Ω 5 ns Note 4. The parameters, although guaranteed, are not 100% tested in production. LINFINITY 6/91 Rev 1.1 2/94 Copyright 1994 2 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 DIODE ARRAY SERIES CONNECTION DIAGRAMS & ORDERING INFORMATION Package 14-PIN CERAMIC DIP J - PACKAGE 16-PIN CERAMIC DIP J - PACKAGE 14-PIN CERAMIC FLATPACK F - PACKAGE 16-PIN CERAMIC FLATPACK F - PACKAGE Part No. SG6511J (1N6511) SG6101J (1N6101) SG6100F (1N6100) SG6510F (1N6510) (continued) Ambient Temperature Range Connection Diagram -55°C to 150°C -55°C to 150°C -55°C to 150°C -55°C to 150°C 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 Note 1. Consult factory for other packages available. 2. All packages are viewed from the top. 3. Consult factory for JAN, JANTX, JANTXV product availability. LINFINITY 6/91 Rev 1.1 2/94 Copyright 1994 3 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570