NEC PS7141EL-1A

DATA SHEET
Solid State Relay
OCMOS FET
PS7141E-1A,PS7141EL-1A
6-PIN DIP, 400V BREAK DOWN VOLTAGE
NORMALLY OPEN TYPE
1-ch Optical Coupled MOS FET
−NEPOC Series−
DESCRIPTION
The PS7141E-1A and PS7141EL-1A are solid state relays containing GaAs LEDs on the light emitting side (input
side) and MOS FETs on the output side.
They are suitable for analog signal control because of their low offset and high linearity.
The PS7141EL-1A has a surface mount type lead.
FEATURES
• 1 channel type (1 a output)
• Designed for AC/DC switching line changer
• Small package (6-pin DIP)
• Low offset voltage
• Ordering number of taping product: PS7141EL-1A-E3, E4: 1 000 pcs/reel
<R>
• Pb-Free product
<R>
• Safety standards
• UL approved: File No. E72422
• BSI approved: No. 8806/8807
• SEMKO approved: No. 313447
• DEMKO approved: No. 312887
• NEMKO approved: No. P4202453
• FIMKO approved: No. FI 20732
APPLICATIONS
• Exchange equipment
• Measurement equipment
• FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10439EJ02V0DS (2nd edition)
Date Published July 2006 NS CP(K)
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2003, 2006
PS7141E-1A,PS7141EL-1A
PACKAGE DIMENSIONS (in millimeters)
PS7141E-1A
9.25±0.5
TOP VIEW
6
5
4
1
2
3
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
7.62
3.5±0.3
3.3±0.3 4.15±0.3
6.5±0.5
0.5±0.1
1.34±0.1
0.25 M
0 to 15˚
2.54
PS7141EL-1A
9.25±0.5
TOP VIEW
6
5
4
1
2
3
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
3.5±0.3
0.10+0.10
–0.05
6.5±0.5
1.34±0.1
0.25 M
2
0.9±0.25
2.54
9.60±0.4
Data Sheet PN10439EJ02V0DS
PS7141E-1A,PS7141EL-1A
<R>
MARKING EXAMPLE
No. 1 pin
Mark
PS7141E-1A
NL601
Country Assembled
Type Number
Assembly Lot
N L 6 01
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
(L: Pb-Free)
Rank Code
Data Sheet PN10439EJ02V0DS
3
PS7141E-1A,PS7141EL-1A
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Safety Standard
Application Part
Approval
Number
Specification
PS7141E-1A
PS7141E-1A-A
PS7141EL-1A
PS7141EL-1A-A
PS7141EL-1A-E3
PS7141EL-1A-E3-A
PS7141EL-1A-E4
PS7141EL-1A-E4-A
Pb-Free
Magazine case 50 pcs
Standard products PS7141E-1A
(UL, BSI, SEMKO,
Embossed Tape 1 000 pcs/reel
DEMKO, NEMKO,
FIMKO approved)
*1 For the application of the Safety Standard, following part number should be used.
4
Data Sheet PN10439EJ02V0DS
*1
PS7141E-1A,PS7141EL-1A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Diode
Parameter
Symbol
Ratings
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
5.0
V
PD
50
mW
IFP
1
A
VL
400
V
IL
120
mA
Power Dissipation
Peak Forward Current
MOS FET
*1
Break Down Voltage
Continuous
Load Current
Connection A
*2
Pulse Load Current
Connection B
150
Connection C
250
*3
ILP
240
mA
PD
560
mW
BV
1 500
Vr.m.s.
Total Power Dissipation
PT
610
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−40 to +100
°C
(AC/DC Connection)
Power Dissipation
Isolation Voltage
*4
*1 PW = 100 µs, Duty Cycle = 1%
*2 Conditions: IF ≥ 5 mA. The following types of load connections are available.
Connection A
Connection B
Connection C
1
2
3
1
2
3
1
2
3
1
2
3
6
5
4
6
5
IL
IL
VL (AC/DC)
L
L
+
VL (DC)
–
4
6
5
4
6
5
IL
IL
L
L
IL + I L
4
–
+ VL (DC)
+
VL (DC)
–
IL
*3 PW = 100 ms, 1 shot
*4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-3 shorted together, 4-6 shorted together.
Data Sheet PN10439EJ02V0DS
5
PS7141E-1A,PS7141EL-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
LED Operating Current
IF
5
10
20
mA
LED Off Voltage
VF
0
0.5
V
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
MOS FET
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Off-state Leakage
ILoff
VD = 400 V
Output Capacitance
Cout
VD = 0 V, f = 1 MHz
LED On-state Current
IFon
IL = 120 mA
On-state Resistance
Ron1
IF = 10 mA, IL = 10 mA
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
5.0
µA
1.0
µA
0.01
Current
Coupled
36
pF
5.0
mA
36
50
Ω
Ron2
IF = 10 mA, IL = 120 mA, t ≤ 10 ms
25
35
Turn-on Time
*1, 2
ton
IF = 10 mA, VO = 5 V, RL = 1.5 kΩ,
0.5
1.0
Turn-off Time
*1, 2
toff
PW ≥ 10 ms
0.07
0.2
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
10
ms
Ω
9
1.1
pF
*1 Test Circuit for Switching Time
IF
Pulse Input
VL
50 %
Input
0
VO = 5 V
Input monitor
90 %
VO monitor
Output
Rin
RL
10 %
ton
toff
*2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms.
Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off
time will increase.
6
Data Sheet PN10439EJ02V0DS
PS7141E-1A,PS7141EL-1A
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
300
Maximum Load Current IL (mA)
Maximum Forward Current IF (mA)
100
80
60
40
20
0
–25
0
25
75 85
50
200
120
100
0
–25
100
0
25
75 85
50
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
1.8
100
200
1.6
1.4
Output Capacitance Cout (pF)
Forward Voltage VF (V)
f = 1 MHz
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1 mA
1.2
1.0
0.8
–25
0
25
50
75
150
100
50
0
100
20
40
80
100
120
Ambient Temperature TA (˚C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs.
APPLIED VOLTAGE
LOAD CURRENT vs. LOAD VOLTAGE
10–6
200
IF = 10 mA
TA = 85˚C
10–7
Load Current IL (mA)
Off-state Leakage Current ILoff (A)
60
10–8
25˚C
10–9
10–10
0
100
200
300
400
100
–4.0
500
–2.0
0
2.0
4.0
–100
–200
Load Voltage VL (V)
Applied Voltage VD (V)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10439EJ02V0DS
7
PS7141E-1A,PS7141EL-1A
ON-STATE RESISTANCE DISTRIBUTION
ON-STATE RESISTANCE DISTRIBUTION
30
30
n = 50 pcs,
IF = 10 mA,
IL = 10 mA
20
25
Number (pcs)
Number (pcs)
25
15
10
n = 50 pcs,
IF = 10 mA,
IL = 120 mA
5
20
15
10
5
0
36
35
0
38
37
24
26
25
On-state Resistance Ron1 (Ω)
On-state Resistance Ron2 (Ω)
ON-STATE RESISTANCE vs.
LOAD CURRENT
ON-STATE RESISTANCE vs.
FORWARD CURRENT
40
40
IF = 10 mA
On-state Resistance Ron (Ω)
On-state Resistance Ron (Ω)
IL = 10 mA
35
30
25
20
0
20
40
60
80
100
120
35
30
120 mA
25
20
0
140
2
4
6
8
TURN-ON TIME DISTRIBUTION
TURN-ON TIME vs. FORWARD CURRENT
12
30
n = 50 pcs,
IF = 10 mA,
VO = 5 V
10
25
8
20
Number (pcs)
Turn-on Time ton (ms)
VO = 5 V
6
4
15
10
5
2
5
10
15
20
25
30
0
0.4
0.5
Turn-on Time ton (ms)
Forward Current IF (mA)
Remark The graphs indicate nominal characteristics.
8
12
Forward Current IF (mA)
Load Current IL (mA)
0
10
Data Sheet PN10439EJ02V0DS
0.6
PS7141E-1A,PS7141EL-1A
TURN-OFF TIME vs. FORWARD CURRENT
TURN-OFF TIME DISTRIBUTION
30
0.6
n = 50 pcs,
IF = 10 mA,
VO = 5 V
0.5
25
0.4
20
Number (pcs)
Turn-off Time toff (ms)
VO = 5 V
0.3
0.2
0.1
10
5
0
5
10
15
20
25
0
30
0.05
0.06
0.07
0.08
Forward Current IF (mA)
Turn-off Time toff (ms)
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
6.0
Normalized to 1.0
at TA = 25˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
100
75
Normalized Turn-off Time toff
3.0
Normalized Turn-on Time ton
15
Normalized to 1.0
at TA = 25˚C,
IF = 10 mA,
VO = 5 V
5.0
4.0
3.0
2.0
1.0
0.0
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
On-state Resistance Ron (Ω)
3.0
Normalized to 1.0
at TA = 25˚C,
IF = 10 mA,
IL = 10 mA
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10439EJ02V0DS
9
PS7141E-1A,PS7141EL-1A
TAPING SPECIFICATIONS (in millimeters)
4.5 MAX.
10.3±0.1
7.5±0.1
1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
10.4±0.1
1.55±0.1
12.0±0.1
0.3
Tape Direction
PS7141EL-1A-E3
PS7141EL-1A-E4
Outline and Dimensions (Reel)
2.0±0.5
R 1.0
21.0±0.8
100±1.0
330±2.0
2.0±0.5
13.0±0.2
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
10
Data Sheet PN10439EJ02V0DS
15.9 to 19.4
Outer edge of
flange
PS7141E-1A,PS7141EL-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
<R>
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Data Sheet PN10439EJ02V0DS
11
PS7141E-1A,PS7141EL-1A
<R>
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10439EJ02V0DS
PS7141E-1A,PS7141EL-1A
• The information in this document is current as of July, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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and industrial robots.
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PN10439EJ02V0DS
13
PS7141E-1A,PS7141EL-1A
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: [email protected]
Hong Kong Head Office TEL: +852-3107-7303
FAX: +852-3107-7309
Taipei Branch Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office
TEL: +82-2-558-2120
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH
http://www.eu.necel.com/
TEL: +49-211-6503-0
FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500
FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
0604