NEC UPC3225TB-E3-A

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC3225TB
5 V, SILICON GERMANIUM MMIC
MEDIUM OUTPUT POWER AMPLIFIER
DESCRIPTION
The µPC3225TB is a silicon germanium (SiGe) monolithic integrated circuits designed as IF amplifier for DBS
tuners. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
• Wideband response
: fu = 2.8 GHz TYP. @ 3 dB bandwidth
• Low current
: ICC = 24.5 mA TYP.
• Medium output power
: PO (sat) = +15.5 dBm TYP. @ f = 0.95GHz
: PO (sat) = +12.5 dBm TYP. @ f = 2.15 GHz
• High linearity
: PO (1dB) = +9.0 dBm TYP. @ f = 0.95 GHz
: PO (1dB) = +7.0 dBm TYP. @ f = 2.15 GHz
• Power gain
: GP = 32.5 dB TYP. @ f = 0.95 GHz
: GP = 33.5 dB TYP. @ f = 2.15 GHz
• Noise Figure
: NF = 3.7 dB TYP. @ f = 0.95 GHz
: NF = 3.7 dB TYP. @ f = 2.15 GHz
• Supply voltage
: VCC = 4.5 to 5.5 V
• Port impedance
: input/output 50 Ω
APPLICATIONS
• IF amplifiers in LNB for DBS converters etc.
ORDERING INFORMATION
Part Number
µPC3225TB-E3
Order Number
Package
µPC3225TB-E3-A 6-pin super minimold
(Pb-Free)
Note
Marking
C3M
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark
To order evaluation samples, please contact your nearby sales office
Part number for sample order: µPC3225TB.
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10500EJ01V0DS (1st edition)
Date Published December 2004 CP(K)
Printed in Japan
 NEC Compound Semiconductor Devices, Ltd. 2004
µPC3225TB
PIN CONNECTIONS
C3M
(Top View)
3
2
1
Pin No.
Pin Name
1
OUTPUT
2
GND
3
VCC
4
INPUT
5
GND
6
GND
(Bottom View)
4
4
3
5
5
2
6
6
1
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER
(TA = +25°C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
fu
PO (sat)
GP
NF
ICC
(GHz)
(dBm)
(dB)
(dB)
(mA)
µPC2708TB
2.9
+10.0
15
6.5
26
µPC2709TB
2.3
+11.5
23
5.0
25
C1E
µPC2710TB
1.0
+13.5
33
3.5
22
C1F
µPC2776TB
2.7
+8.5
23
6.0
25
C2L
µPC3223TB
3.2
+12.0
23
4.5
19
C3J
24.5
C3M
Part No.
µPC3225TB
2.8
+15.5
Note
32.5
Note
3.7
Note
Package
6-pin super minimold
Note f = 0.95 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2
Data Sheet PU10500EJ01V0DS
Marking
C1D
µPC3225TB
PIN EXPLANATION
Pin
Pin
No.
Name
4
INPUT
Applied
Pin
Voltage
Voltage
(V)
(V)
−
Function and Applications
Note
0.98
Signal input pin.
A internal matching circuit, configured with resistors, enables 50 Ω
connection over a wide band.
A multi-feedback circuit is designed to cancel the deviations of hFE and
resistance.
This pin must be coupled to signal source with capacitor for DC cut.
1
OUTPUT
Voltage
−
Signal output pin.
The inductor must be attached between VCC and output pins to supply
as same
current to the internal output transistors.
as VCC
through
external
inductor
3
VCC
4.5 to 5.5
−
Power supply pin.
Which biases the internal input transistor.
This pin should be externally equipped with bypass capacitor to
minimize its impedance.
2
GND
0
−
Ground pin.
5
This pin should be connected to system ground with minimum
6
inductance. Ground pattern on the board should be formed as wide as
possible.
All the ground pins must be connected together with wide ground
pattern to decrease impedance defference.
Note Pin voltage is measured at VCC = 5.0 V
Data Sheet PU10500EJ01V0DS
3
µPC3225TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C, Pin 1 and 3
6
V
Total Circuit Current
ICC
TA = +25°C
45
mA
Power Dissipation
PD
TA = +85°C
270
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Input Power
Pin
0
dBm
Note
TA = +25°C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Symbol
VCC
Conditions
The same voltage should be applied
MIN.
TYP.
MAX.
Unit
4.5
5.0
5.5
V
−40
+25
+85
°C
to pin 1 and 3.
Operating Ambient Temperature
TA
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No input signal
20.0
24.5
31.0
mA
Power Gain
GP
f = 0.95 GHz, Pin = −35.0 dBm
30.0
32.5
35.0
dB
f = 2.15 GHz, Pin = −35.0 dBm
30.5
33.5
36.0
f = 0.95 GHz, Pin = -5.0 dBm
+13.5
+15.5
−
f = 2.15 GHz, Pin = -5.0 dBm
+10.5
+12.5
−
f = 0.95 GHz
+7.0
+9.0
−
f = 2.15 GHz
+5.0
+7.0
−
f = 0.95 GHz
−
3.7
4.5
f = 2.15 GHz
−
3.7
4.5
3 dB down below flat gain at f = 0.95
−
2.8
−
GHz
f = 0.95 GHz, Pin = −35.0 dBm
36.0
41.0
−
dB
f = 2.15 GHz, Pin = −35.0 dBm
36.0
45.0
−
f = 0.95 GHz, Pin = −35.0 dBm
7.0
8.5
−
f = 2.15 GHz, Pin = −35.0 dBm
8.0
11.0
−
f = 0.95 GHz, Pin = −35.0 dBm
7.0
10.5
−
f = 2.15 GHz, Pin = −35.0 dBm
9.5
13.0
−
−
2.5
4.0
Saturated Output Power
Gain 1 dB Compression Output Power
Noise Figure
Upper Limit Operating Frequency
PO (sat)
PO (1 dB)
NF
fu
dBm
dBm
dB
GHz
Isolation
Input Return Loss
Output Return Loss
Gain Flatness
4
ISL
RLin
RLout
∆GP
f = 0.95 to 2.15 GHz
Data Sheet PU10500EJ01V0DS
dB
dB
dB
µPC3225TB
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY
(TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
Parameter
Output intercept point
Symbol
OIP3
Test Conditions
Reference Value
Unit
f = 0.95 GHz
21.0
dBm
f = 2.15 GHz
16.0
Data Sheet PU10500EJ01V0DS
5
µPC3225TB
TEST CIRCUIT
C2
6
1
GND
OUT
5
L1
15 nH
100 pF
50 Ω
2
GND
GND
C4
1 000 pF
C3
1 000 pF
C1
4
330 pF
3
IN
VCC
VCC
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Value
Maker
Type code
C1
330 pF
Murata
GMR36CH
C2
100 pF
Murata
GMR36CH
C3
1 000 pF
Murata
GMR39CH
C4
1 000 pF
Murata
GMR36B
L1
15 nH
Susumu
TFL0816
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 24.5 mA, to output medium power. To supply current for output
transistor, connect an inductor between the VCC pin (pin 3) and output pin (pin 1). Select inductance, as the value
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin. Capacitors of 330 pF for the
input pin and 100 pF for the output pin are recommendable as the coupling capacitors.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
6
Data Sheet PU10500EJ01V0DS
µPC3225TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
5
6
C1
3
2
C4 L1
4
1
C2
C3
COMPONENT LIST
Value
C1
C2
C3, C4
L1
330 pF
100 pF
1 000 pF
Notes
1.
30 × 30 × 0.4 mm double sided copper clad polyimide board.
2.
Back side: GND pattern
3.
Solder plated on pattern
4.
: Through holes
15 nH
Data Sheet PU10500EJ01V0DS
7
µPC3225TB
TYPICAL CHARACTERISTICS (VCC = 5.0 V, TA = +25°C, unless otherwise specified)
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
CIRCUIT CURRENT
vs. SUPPLY VOLTAGE
35
26.0
VCC = 5.0 V
25
20
15
10
TA = − 40°C
+25°C
+85°C
5
0
VCC = 5.0 V
25.5
Circuit Current ICC (mA)
Circuit Current ICC (mA)
30
1
2
4
3
5
6
25.5
24.5
24.5
23.5
23.0
22.5
− 60 − 40 − 20
7
Supply Voltage VCC (V)
30
28
28
1.0
2.0
3.0
26
0
4.0
1.0
− 15
− 25
− 25
− 35
− 45
1.0
2.0
3.0
4.0
ISOLATION vs. FREQUENCY
− 15
− 55
2.0
Frequency f (GHz)
Isolation ISL (dB)
Isolation ISL (dB)
100
30
ISOLATION vs. FREQUENCY
VCC = 4.5 V
5.0 V
5.5 V
3.0
4.0
TA = − 40°C
+25°C
+85°C
VCC = 5.0 V
− 35
− 45
− 55
− 65
0
1.0
2.0
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
8
80
32
Frequency f (GHz)
− 65
0
60
TA = − 40°C
+25°C
+85°C
VCC = 5.0 V
34
Power Gain GP (dB)
Power Gain GP (dB)
32
26
0
40
POWER GAIN vs. FREQUENCY
36
VCC = 4.5 V
5.0 V
5.5 V
34
20
Operating Ambient Temperature TA (°C)
POWER GAIN vs. FREQUENCY
36
0
Data Sheet PU10500EJ01V0DS
3.0
4.0
INPUT RETURN LOSS vs. FREQUENCY
0
0
VCC = 4.5 V
5.0 V
5.5 V
−4
−8
− 12
− 16
Output Return Loss RLout (dB)
− 20
0
1.0
3.0
2.0
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY
−8
− 12
− 16
0
1.0
3.0
2.0
4.0
Frequency f (GHz)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
OUTPUT RETURN LOSS vs. FREQUENCY
−4
−4
VCC = 4.5 V
5.0 V
5.5 V
−8
− 12
− 16
− 20
− 24
0
1.0
3.0
2.0
TA = − 40°C
+25°C
+85°C
−8
− 12
− 16
− 20
VCC = 5.0 V
− 24
0
1.0
4.0
35
38
VCC = 4.5 V
5.0 V
5.5 V
f = 950 MHz
37
34
VCC = 4.5 V
5.0 V
5.5 V
f = 1 500 MHz
Power Gain GP (dB)
36
33
32
31
30
29
35
34
33
32
31
28
30
27
29
26
− 40
4.0
POWER GAIN vs. INPUT POWER
POWER GAIN vs. INPUT POWER
36
3.0
2.0
Frequency f (GHz)
Frequency f (GHz)
Power Gain GP (dB)
TA = − 40°C
+25°C
+85°C
VCC = 5.0 V
−4
− 20
4.0
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
µPC3225TB
− 35
− 30
− 25
− 20
− 15
− 10
−5
28
− 40
− 35
− 30
− 25
− 20
− 15
− 10
−5
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10500EJ01V0DS
9
µPC3225TB
POWER GAIN vs. FREQUENCY
36
OUTPUT POWER vs. INPUT POWER
VCC = 4.5 V
5.0 V
5.5 V
35
Output Power Pout (dBm)
34
Power Gain GP (dB)
18
33
32
31
30
29
28
VCC = 5.0 V
12
6
0
−6
f = 950 MHz
1 500 MHz
2 150 MHz
27
f = 2 150 MHz
26
− 40 − 35 − 30
− 25
− 20
− 15
− 10
−5
− 12
− 45
Input Power Pin (dBm)
− 20
VCC = 4.5 V
5.0 V
5.5 V
− 15 − 10
−5
Output Power Pout (dBm)
18
f = 950 MHz
16
14
12
10
8
6
4
2
0
−2
−4
−6
−8
− 40 − 35 − 30
Input Power Pin (dBm)
− 20
VCC = 4.5 V
5.0 V
5.5 V
− 15 − 10
−5
Output Power Pout (dBm)
18
f = 1 500 MHz
16
14
12
10
8
6
4
2
0
−2
−4
−6
−8
− 40 − 35 − 30
Input Power Pin (dBm)
− 20
− 15
− 10
−5
TA = − 40°C
+25°C
+85°C
− 25
− 20
− 15
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
10
− 25
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
− 25
TA = − 40°C
+25°C
+85°C
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
18
f = 1 500 MHz
16
14
12
10
8
6
4
2
0
−2
−4
−6
−8
− 40 − 35 − 30
−5
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
− 25
− 15
− 25
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
18
f = 950 MHz
16
14
12
10
8
6
4
2
0
−2
−4
−6
−8
− 40 − 35 − 30
− 35
Data Sheet PU10500EJ01V0DS
− 10
−5
µPC3225TB
18
f = 2 150 MHz
16
14
12
10
8
6
4
2
0
−2
−4
−6
−8
− 40 − 35 − 30
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
− 25
− 20
VCC = 4.5 V
5.0 V
5.5 V
− 15 − 10
−5
18
f = 2 150 MHz
16
14
12
10
8
6
4
2
0
−2
−4
−6
−8
− 40 − 35 − 30
Input Power Pin (dBm)
TA = − 40°C
+25°C
+85°C
− 25
− 20
− 15
− 10
−5
Input Power Pin (dBm)
Output Power (2 tones) Pout/tone (dBm)
OUTPUT POWER (2 TONES)
vs. INPUT POWER
20
VCC = 5.0 V, ∆ f = 1 MHz
f = 950/951 MHz
: OIP3 = 21.0 dBm
f = 1 500/1 501 MHz : OIP3 = 18.2 dBm
f = 2 150/2 151 MHz : OIP3 = 16.0 dBm
10
0
− 10
− 20
− 30
− 40
− 50
− 60
− 45
− 40
− 35
− 30
− 25
f = 950 MHz
1 500 MHz
2 150 MHz
− 20 − 15 − 10
Input Power Pin/tone (dBm)
20
OUTPUT POWER (2 TONES)
vs. INPUT POWER
f = 950/951 MHz
10
0
− 10
− 20
− 30
− 40
− 50
VCC = 4.5 V
5.0 V
5.5 V
− 60
− 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Output Power (2 tones) Pout/tone (dBm)
Output Power (2 tones) Pout/tone (dBm)
OUTPUT POWER (2 TONES)
vs. INPUT POWER
20
f = 950/951 MHz
10
0
− 10
− 20
− 30
− 40
− 50
TA = − 40°C
+25°C
+85°C
− 60
− 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Input Power Pin/tone (dBm)
Input Power Pin/tone (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10500EJ01V0DS
11
µPC3225TB
f = 1 500/1 501 MHz
10
0
− 10
− 20
− 30
− 40
− 50
VCC = 4.5 V
5.0 V
5.5 V
− 60
− 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Output Power (2 tones) Pout/tone (dBm)
20
20
f = 1 500/1 501 MHz
10
0
− 10
− 20
− 30
− 40
− 50
TA = − 40°C
+25°C
+85°C
− 60
− 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Input Power Pin/tone (dBm)
Input Power Pin/tone (dBm)
OUTPUT POWER (2 TONES)
vs. INPUT POWER
OUTPUT POWER (2 TONES)
vs. INPUT POWER
f = 2 150/2 151 MHz
10
0
− 10
− 20
− 30
− 40
− 50
VCC = 4.5 V
5.0 V
5.5 V
− 60
− 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Output Power (2 tones) Pout/tone (dBm)
Output Power (2 tones) Pout/tone (dBm)
20
OUTPUT POWER (2 TONES)
vs. INPUT POWER
Output Power (2 tones) Pout/tone (dBm)
OUTPUT POWER (2 TONES)
vs. INPUT POWER
20
f = 2 150/2 151 MHz
10
0
− 10
− 20
− 30
− 40
− 50
TA = − 40°C
+25°C
+85°C
− 60
− 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5
Input Power Pin/tone (dBm)
Input Power Pin/tone (dBm)
NOISE FIGURE vs. FREQUENCY
5.0
4.8
Noise Figure NF (dB)
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0
0
500
1 000
1 500
VCC = 4.5 V
5.0 V
5.5 V
2 000
2 500 3 000
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
12
Data Sheet PU10500EJ01V0DS
µPC3225TB
S-PARAMETERS (TA = +25°C, VCC = Vout = 5.0 V)
S11−FREQUENCY
START : 100.000 000 MHz
STOP : 3 000.000 000 MHz
1
3
2
1 : 950 MHz
100.41 Ω − 31.537 Ω
2 : 1 600 MHz 58.686 Ω − 47.725 Ω
3 : 2 150 MHz 39.938 Ω − 24.401 Ω
5.3124 pF
2.0843 pF
3.0338 pF
S22−FREQUENCY
START : 100.000 000 MHz
STOP : 3 000.000 000 MHz
1
3
2
1 : 950 MHz
60.637 Ω 32.730 Ω
2 : 1 600 MHz 70.195 Ω − 20.405 Ω
3 : 2 150 MHz 44.370 Ω − 14.407 Ω
Data Sheet PU10500EJ01V0DS
5.4835 nH
4.8754 pF
5.1383 pF
13
µPC3225TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
2.0±0.2
1.25±0.1
14
Data Sheet PU10500EJ01V0DS
0.15+0.1
–0.05
0 to 0.1
0.7
0.9±0.1
0.1 MIN.
µPC3225TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10500EJ01V0DS
15
µPC3225TB
• The information in this document is current as of December, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
16
Data Sheet PU10500EJ01V0DS
µPC3225TB
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: [email protected] (sales and general)
[email protected] (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: [email protected] (sales, technical and general)
FAX: +852-3107-7309
TEL: +852-3107-7303
Hong Kong Head Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Taipei Branch Office
FAX: +82-2-558-5209
TEL: +82-2-558-2120
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0406