DATA SHEET GaAs INTEGRATED CIRCUIT μPG2150T5L SP3T SWITCH FOR Bluetooth TM AND 802.11b/g DESCRIPTION The μPG2150T5L is a GaAs MMIC SP3T switch which was developed for Bluetooth and wireless LAN. This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 12-pin plastic TSQFN (Thin Small Quad Flat Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operation frequency : fopt = 0.5 to 2.5 GHz • Control voltage : Vcont (H) = 2.3 to 3.6 V (2.85 V TYP.) : Vcont (L) = −0.2 to 0.2 V (0 V TYP.) • Low insertion loss : Lins3 = 0.50 dB TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) = 0 V : Lins6 = 0.60 dB TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) = 0 V • High isolation : ISL3 = 35 dB TYP. @ f = 2.5 GHz, ANT to RF3, On port ANT to RF1, 2, RF1 to RF3, On port ANT to RF1, Vcont (H) = 2.85 V, Vcont (L) = 0 V : ISL6 = 18 dB TYP. @ f = 2.5 GHz, ANT to RF1, On port ANT to RF2, 3, ANT to RF2, On port ANT to RF1, 3, Vcont (H) = 2.85 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) = 0 V : Pin (1 dB) = +25.0 dBm TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) = 0 V • High-density surface mounting : 12-pin plastic TSQFN package (2.0 × 2.0 × 0.37 mm) APPLICATIONS • Antenna switch for Bluetooth and 802.11b/g ORDERING INFORMATION Part Number Order Number Package Marking μPG2150T5L-E2 μPG2150T5L-E2-A 12-pin plastic TSQFN 2150 (Pb-Free) Supplying Form • Embossed tape 8 mm wide • Pin 10, 11, 12 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2150T5L Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10653EJ02V0DS (2nd edition) Date Published April 2007 NS CP(N) Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2007 μPG2150T5L PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 12 11 2 3 4 5 11 12 10 2150 1 (Bottom View) (Top View) 10 10 11 12 9 1 9 9 1 8 2 8 8 2 7 3 7 7 3 5 4 6 6 6 5 4 Pin No. Pin Name 1 ANT 2 GND 3 Vcont2 4 RF2 5 GND 6 RF3 7 Vcont3 8 GND 9 Vcont1 10 RF1 11 N.C. 12 N.C. Remark Exposed pad : GND TRUTH TABLE Vcont1 Vcont2 Vcont3 ANT−RF1 ANT−RF2 ANT−RF3 High Low Low ON OFF OFF Low High Low OFF ON OFF Low Low High OFF OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings −6.0 to +6.0 Unit Note Switch Control Voltage Vcont Input Power1 (ANT−RF1, ANT−RF2) Pin1 +31.5 dBm Input Power2 (ANT−RF3) Pin2 +25.5 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C V Note ⎪Vcont (H) − Vcont (L)⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit fopt 0.5 − 2.5 GHz Switch Control Voltage (H) Vcont (H) 2.3 2.85 3.6 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V Operating Frequency 2 Data Sheet PG10653EJ02V0DS μPG2150T5L ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.85 V, Vcont specified) Parameter (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise Symbol Pass ANT to RF1, 2 Test Conditions MIN. TYP. MAX. Unit f = 0.5 to 1.0 GHz − 0.40 0.55 dB Insertion Loss 1 Lins1 Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz − 0.45 0.60 dB Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz − 0.50 0.65 dB Insertion Loss 4 Lins4 f = 0.5 to 1.0 GHz − 0.45 0.60 dB Insertion Loss 5 Lins5 f = 1.0 to 2.0 GHz − 0.55 0.70 dB Insertion Loss 6 Lins6 f = 2.0 to 2.5 GHz − 0.60 0.75 dB Isolation 1 ISL1 f = 0.5 to 1.0 GHz 29 32 − dB f = 1.0 to 2.0 GHz 29 32 − dB f = 2.0 to 2.5 GHz 30 35 − dB f = 0.5 to 1.0 GHz 23 26 − dB f = 1.0 to 2.0 GHz 17 20 − dB f = 2.0 to 2.5 GHz 15 18 − dB ANT to RF3 ANT to RF3 On port ANT to Isolation 2 ISL2 RF1, 2 RF1 to RF3 Isolation 3 ISL3 On port ANT to RF1 Isolation 4 ISL4 ANT to RF1 On port ANT to Isolation 5 ISL5 RF2, 3 ANT to RF2 Isolation 6 ISL6 On port ANT to RF1, 3 Input Return Loss RLin ANT to RF1, 2, 3 f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RLout ANT to RF1, 2, 3 f = 0.5 to 2.5 GHz 15 20 − dB ANT to RF1, 2 f = 1.0 GHz +28.0 +31.0 − dBm f = 2.0 GHz +28.0 +31.0 − dBm f = 2.5 GHz +28.0 +31.0 − dBm f = 1.0 GHz +22.0 +25.0 − dBm f = 2.0 GHz +22.0 +25.0 − dBm f = 2.5 GHz +22.0 +25.0 − dBm 1 dB Loss Compression Input Power Pin (1 dB) Note ANT to RF3 Switch Control Current Icont ANT to RF1, 2, 3 RF None − 0.05 1.0 μA Switch Control Speed tSW ANT to RF1, 2, 3 50% CTL to − 50 − ns 90/10% RF Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Data Sheet PG10653EJ02V0DS 3 μPG2150T5L EVALUATION CIRCUIT RF1 56 pF 12 11 10 56 pF ANT 9 1 Vcont1 1 000 pF Vcont2 2 8 3 7 1 000 pF Vcont3 1 000 pF 4 5 6 56 pF 56 pF RF2 RF3 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10653EJ02V0DS μPG2150T5L MOUNTING PAD AND SOLDER PAD LAYOUT DIMENSIONS 12-PIN PLASTIC TSQFN (UNIT: mm) MOUNTING PAD 0.5 0.33 12–0.23 0.5 0.94 0.5 0.5 0.33 0.33 0.77 0.77 0.77 0.77 0.33 0.94 SOLDER PAD 0.28 0.5 0.5 0.5 0.28 0.5 12–0.18 0.49 0.77 0.77 0.77 0.77 0.28 0.28 0.49 <R> Solder thickness : 0.08 mm Remark The mounting pad and solder pad layouts in this document are for reference only. Data Sheet PG10653EJ02V0DS 5 μPG2150T5L PACKAGE DIMENSIONS 12-PIN PLASTIC TSQFN (UNIT: mm) 0.37+0.03 –0.05 2.0±0.1 2.0±0.1 (Bottom View) 0.50±0.06 0.23+0.07 –0.05 0.94±0.1 (C 0.17±0.07) 0.23±0.1 0.94±0.1 Remark ( ) : Reference value 6 Data Sheet PG10653EJ02V0DS μPG2150T5L RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10653EJ02V0DS 7 μPG2150T5L Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of April, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 8 Data Sheet PG10653EJ02V0DS μPG2150T5L Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.