PSL22-M thru PSL24-M SILICON EPITAXIAL PLANER TYPE Low VF Chip Schottky Diodes SOD-123 0.154(3.9) 0.138(3.5) 0.012(0.3) Typ . 0.071(1.8) 0.055(1.4) 0.126(3.2) 0.110(2.8 ) 0.067(1.7) 0.051(1.3) 0.035(0.9) Typ . 0.035(0.9) Typ . Dimensions in inches and (millimeters) FEATURES MECHANICAL DATA Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Ufizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of ML-S-19500/228 Low leakage current Case JEDEC SOD-123/MINI-SMA molded plastic Terminals Solder plated, solderable per MIL-STD-750, Method 2026 Polarity Indicated by cathode band Mounting Position Any Weight 0.04gram MAXIMUM RATINGS (at TA=25 C unless otherwise noted) o PARAMETER CONDITIONS SYMBOL Forward rectified current See Fig.2 Forward surge current 8.3ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method) Reverse current VR=VRRM TA=250C Typ. Max. UNITS IO 2.0 A IFSM 50 A 1.0 mA Min. IR 0 VR=VRRM TA=100 C 10 RJA Thermal resistance Junction to ambient Diode junction capacitance F=1MHz and applied 4vDC reverse voltage Storage temperature *1 *2 *3 -55 *4 VRMS (V) VR (V) PSL22-M L22 20 14 20 0.38 PSL23-M L23 30 21 30 0.40 PSL24-M L24 40 28 40 0.40 www.paceleader.tw 1 pF +150 VRRM (V) *1 Repetitive peak reverse peak reverse *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage C/W 160 CJ TSTG MARKING CODE SYMBOLS mA 0 70 VF (V) 0 C Operating Temperature (0C) -55 to + 125 PSL22-M thru PSL24-M SILICON EPITAXIAL PLANER TYPE Crownpo Technology www.paceleader.tw 2