bq20z90 www.ti.com SLUS778 – JULY 2007 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™ TECHNOLOGY FOR USE WITH THE bq29330 FEATURES 1 • 2 • • • • • • • • • • • • • • • 2 Lifetime Data Logging 30-Pin TSSOP (DBT) APPLICATIONS • • • Notebook PCs Medical and Test Equipment Portable Instrumentation DESCRIPTION The bq20z90 SBS-compliant gas gauge IC, incorporating patented Impedance Track™ technology, is designed for battery-pack or in-system installation. The bq20z90 measures and maintains an accurate record of available charge in Li-ion or Li-polymer batteries using its integrated high-performance analog peripherals. The bq20z90 monitors capacity change, battery impedance, open-circuit voltage, and other critical parameters of the battery pack, and reports the information to the system host controller over a serial-communication bus. It is designed to work with the bq29330 analog front-end (AFE) protection IC to maximize functionality and safety, and minimize component count and cost in smart battery circuits. The Impedance Track technology continuously analyzes the battery impedance, resulting in superior gas-gauging accuracy. This enables remaining capacity to be calculated with discharge rate, temperature, and cell aging all accounted for during each stage of every cycle. AVAILABLE OPTIONS PACKAGE TA 30-PIN TSSOP (DBT) Tube 30-PIN TSSOP (DBT) Tape & Reel –40°C to 85°C bq20z90DBT (1) bq20z90DBTR (2) (1) A single tube quantity is 50 units. (2) A single reel quantity is 2000 units Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. IMPEDANCE TRACK is a trademark of Texas Instruments. • 1 Patented Impedance Track™ Technology Accurately Measures Available Charge in Li-Ion and Li-Polymer Batteries Better than 1% Error Over Lifetime of the Battery Instant Accuracy – No Learning Cycle Required Automatically adjusts for battery aging, battery self discharge and temperature inefficiencies Supports the Smart Battery Specification SBS V1.1 Works With the TI bq29330 Analog Front-End (AFE) Protection IC to Provide Complete Pack Electronics Solution Full Array of Programmable Voltage, Current, and Temperature Protection Features Integrated Time Base Removes Need for External Crystal with Optional Crystal Input Electronics for 7.2-V, 10.8-V or 14.4-V Battery Packs With 50% Fewer External Components Based on a Powerful Low-Power RISC CPU Core With High-Performance Peripherals Integrated Field Programmable FLASH Memory Eliminates the Need for External Configuration Memory Measures Charge Flow Using a High-Resolution, 16-Bit Integrating Delta-Sigma Converter – Better Than 0.65 nVh of Resolution – Self-Calibrating Uses 16-Bit Delta-Sigma Converter for Accurate Voltage and Temperature Measurements Extensive Data Reporting Options For Improved System Interaction Optional Pulse Charging Feature for Improved Charge Times Drives 3-, 4- or 5-Segment LED Display for Remaining Capacity Indication Supports SHA-1 Authentication • • PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated bq20z90 www.ti.com SLUS778 – JULY 2007 SYSTEM PARTITIONING DIAGRAM Discharge / Charge / Pre-Charge FETs Fuse Pack + Host Interface & Data Management System Interface 2k Bytes of Data Flash 2k Bytes of RAM 6k x 22 Mask ROM 24k x 22 Program Flash Nch FET Drive (Charge Pumps) 32.768kHz Watchdog & Protection Timing I2C System Interface RAM Configuration, Status and Control Registers TOUT and LEDOUT Power Support T1 Standard Delta-Sigma A to D Converter Analog Output Drive Integrating Delta-Sigma A to D Converter 2-Tier Over Current Protection Precharge Control Cell, Bat and Pack Voltage Translation Reset 32kHz Oscillator and 8MHz System Clock SMBus HDQ LDO + Reset 2.5V / 3.3V (LED) Cell Balancing Drive 16 Dig GPIO & Peripherals 8 Dig GPIO or Analog GPI Pack - TSSOP (DBT) (TOP VIEW) NC XALERT SDATA 1 2 3 SCLK CLKOUT TS1 TS2 PRES PFIN SAFE 4 5 SMBD NC SMBC DISP NC 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 VCELLVCELL+ NC RBI VCC VSS MRST SRN SRP *VSS 19 LED5 LED4 18 17 16 LED3 LED2 LED1 NC - No internal connection 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 bq20z90 www.ti.com SLUS778 – JULY 2007 TERMINAL FUNCTIONS TERMINAL NO. (1) NAME I/O (1) DESCRIPTION 1 NC – Not used— leave floating 2 XALERT I Input from bq29330 XALERT output. 3 SDATA I/O Data transfer to and from bq29330 4 SCLK I/O Communication clock to the bq29330 5 CLKOUT O 32.768-kHz output for the bq29330. This pin should be directly connected to the AFE. 6 TS1 I 1st Thermistor voltage input connection to monitor temperature 7 TS2 I 2nd Thermistor voltage input connection to monitor temperature 8 PRES I Active low input to sense system insertion and typically requires additional ESD protection 9 PFIN I Active low input to detect secondary protector output status and allows the bq20z90 to report the status of the 2nd level protection output Active high output to enforce additional level of safety protection; e.g., fuse blow. 10 SAFE O 11 SMBD I/OD 12 NC – 13 SMBC I/OD SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z90 14 DISP I Display control for the LEDs. This pin is typically connected to bq29330 REG via a 100-kΩ resistor and a push-button switch to VSS. SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z90 Not used— leave floating 15 NC – Not used— leave floating 16 LED1 O LED1 display segment that drives an external LED depending on the firmware configuration 17 LED2 O LED2 display segment that drives an external LED depending on the firmware configuration 18 LED3 O LED3 display segment that drives an external LED depending on the firmware configuration 19 LED4 O LED4 display segment that drives an external LED depending on the firmware configuration 20 LED5 O LED5 display segment that drives an external LED depending on the firmware configuration 21 VSS – Connected I/O pin to VSS 22 SRP IA Connections to the top of a small-value sense resistor to monitor the battery charge- and discharge-current flow 23 SRN IA Connections to the bottom of a small-value sense resistor to monitor the battery charge- and discharge-current flow 24 MRST I Master reset input that forces the device into reset when held low. Must be held high for normal operation 25 VSS P Negative Supply Voltage 26 VCC P Positive Supply Voltage 27 RBI P Backup power to the bq20z90 data registers during periods of low operating voltage. RBI accepts a storage capacitor or a battery input. 28 NC – Not used— leave floating 29 VCELL+ I Input from bq29330 used to read a scaled value of individual cell voltages 30 VCELL- I Input from bq29330 used to read a scaled value of individual cell voltages I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 3 bq20z90 www.ti.com SLUS778 – JULY 2007 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) RANGE VCC relative to VSS Supply voltage range V(IOD) relative to VSS Open-drain I/O pins VI relative to VSS Input voltage range to all other pins TA Operating free-air temperature range –40°C to 85°C Tstg Storage temperature range –65°C to 150°C (1) –0.3 V to 2.75 V –0.3 V to 6 V –0.3 V to VCC + 0.3 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER VCC ICC TEST CONDITIONS Supply voltage MIN TYP MAX 2.4 2.5 2.6 No flash programming Operating mode current I(SLP) Low-power storage mode current 400 V (1) bq20z90 + bq29330 475 Sleep mode 8 (1) bq20z90 + bq29330 UNIT μA μA 51 Output voltage low SMBC, SMBD, SDATA, SCLK, SAFE IOL = 0.5 mA 0.4 V LED1 – LED5 IOL = 10 mA 0.4 V VOH Output high voltage, SMBC, SMBD, SDATA, SCLK, SAFE IOH = –1 mA VIL Input voltage low SMBC, SMBD, SDATA, SCLK, XALERT, PRES, PFIN –0.3 0.8 DISP –0.3 0.8 Input voltage high SMBC, SMBD, SDATA, SCLK, XALERT, PRES, PFIN 2 6 DISP 2 VOL VIH CIN VCC – 0.5 Input capacitance V VCC + 0.3 5 V(AI1) Input voltage range VCELL+, VCELL-,TS1, TS2 V(AI2) Input voltage range SRN, SRP V V V V pF - 0.2 0.8XVCC – 0.20 0.20 V Z(AI2) Input impedance VCELL+, VCELL-, TS1, TS2 0 V–1 V 8 MΩ Z(AI1) Input impedance SRN, SRP 0 V–1 V 2.5 MΩ (1) 4 This value does not include the bq29330 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 bq20z90 www.ti.com SLUS778 – JULY 2007 POWER-ON RESET VCC = 2.4V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) MIN TYP MAX VIT– Negative-going voltage input PARAMETER TEST CONDITIONS 1.7 1.8 1.9 UNIT V VHYS Power-on reset hysteresis 50 125 200 mV MAX UNIT POWER ON RESET BEHAVIOR VS FREE-AIR TEMPERATURE Power-On Reset Negative-Going Voltage - V 1.81 1.8 1.79 1.78 1.77 1.76 -40 -20 0 20 40 60 80 TA - Free-Air Temperature - °C INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS VCC = 2.4V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER V(SR) Input voltage range, V(SRN) and V(SRP) V(SROS) Input offset INL Integral nonlinearity error TEST CONDITIONS V(SR) = V(SRN) – V(SRP) MIN TYP –0.2 0.2 μV 10 0.007% V 0.034% OSCILLATOR VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 4.194 MHz HIGH FREQUENCY OSCILLATOR f(OSC) Operating Frequency f(EIO) Frequency Error (1) (2) TA = 20°C to 70°C t(SXO) Start-up Time (3) -3% 0.25% 3% -2% 0.25% 2% 2.5 5 ms LOW FREQUENCY OSCILLATOR f(LOSC) Operating Frequency f(LEIO) Frequency Error (2) (4) (1) (2) (3) (4) The The The The 32.768 TA = 20°C to 70°C KHz -2.5% 0.25% 2.5% -1.5% 0.25% 1.5% frequency error is measured from 4.194 MHz. frequency drift is included and measured from the trimmed frequency at VCC = 2.5 V, TA = 25°C. start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency. frequency error is measured from 32.768 kHz. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 5 bq20z90 www.ti.com SLUS778 – JULY 2007 OSCILLATOR (continued) VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER t(LSXO) Start-up time (5) TEST CONDITIONS MIN TYP (5) MAX UNIT 500 μs The start-up time is defined as the time it takes for the oscillator output frequency to be ± 3%. DATA FLASH MEMORY CHARACTERISTICS VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Data retention See (1) 10 Flash programming write-cycles See (1) 20,000 t(WORDPROG) Word programming time See (1) I(DDdPROG) See (1) tDR (1) Flash-write supply current TYP MAX UNIT Years Cycles 2 ms 5 10 mA TYP MAX UNIT 1500 nA Assured by design. Not production tested REGISTER BACKUP VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER I(RB) RB data-retention input current TEST CONDITIONS MIN V(RB) > V(RBMIN), VCC < VITV(RB) > V(RBMIN), VCC < VIT-, TA = 0°C to 50°C V(RB) (1) 6 RB data-retention voltage (1) 40 1.7 160 V Specified by design. Not production tested. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 bq20z90 www.ti.com SLUS778 – JULY 2007 SMBus TIMING SPECIFICATIONS VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN fSMB SMBus operating frequency Slave mode, SMBC 50% duty cycle fMAS SMBus master clock frequency Master mode, no clock low slave extend tBUF Bus free time between start and stop tHD:STA Hold time after (repeated) start tSU:STA Repeated start setup time tSU:STO Stop setup time TYP 10 MAX 100 51.2 kHz 4.7 4 μs 4.7 4 Receive mode 0 Transmit mode 300 tHD:DAT Data hold time tSU:DAT Data setup time tTIMEOUT Error signal/detect tLOW Clock low period tHIGH Clock high period See (2) tLOW:SEXT Cumulative clock low slave extend time See (3) 25 tLOW:MEXT Cumulative clock low master extend time See (4) 10 tF Clock/data fall time (VILMAX – 0.15 V) to (VIHMIN + 0.15 V) tR Clock/data rise time 0.9 VCC to (VILMAX – 0.15 V) (1) (2) (3) (4) UNIT ns 250 See (1) 25 35 4.7 4 50 300 1000 ms μs ms ns The bq20z90 times out when any clock low exceeds tTIMEOUT. tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z90 that is in progress. tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop. tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop. SMBus TIMING DIAGRAM Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 7 bq20z90 www.ti.com SLUS778 – JULY 2007 FEATURE SET Primary (1st Level) Safety Features The bq20z90 supports a wide range of battery and system protection features that can easily be configured. The primary safety features include: • • • • • • • • Battery cell over/under voltage protection Battery pack over/under voltage protection 2 independent charge overcurrent protection 3 independent discharge overcurrent protection Short circuit protection Over temperature protection AFE Watchdog Host Watchdog Secondary (2nd Level) Safety Features The secondary safety features of the bq20z90 can be used to indicate more serious faults via the SAFE (pin 10) pin. This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or discharging. The secondary safety features include: • • • • • • • • • • • • Safety over voltage Battery cell imbalance 2nd level protection IC input Safety over current Safety over temperature Open thermistor Charge FET and Zero-Volt Charge FET fault Discharge FET fault Fuse blow failure detection AFE Communication error AFE Verification error Internal flash data error Charge Control Features The bq20z90 charge control features include: • • • • • • • Report the appropriate charging current needed for constant current charging and the appropriate charging voltage needed for constant voltage charging to a smart charger using SMBus broadcasts. Determine the chemical state of charge of each battery cell using Impedance Track™. Using cell balancing algorithm, gradually decrease the differences in the cells' state of charge in a fully charged state. This prevents high cells from overcharging, causing excessive degradation and also increases the usable pack energy by preventing early charge termination. Support Pre-charging/Zero-volt charging Support Fast charging Support Pulse charging Support Charge Inhibit and Charge Suspend modes Report charging faults and also indicate charging status via charge and discharge alarms. Gas Gauging The bq20z90 uses the Impedance Track™ Technology to measure and calculate the available charge in battery cells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no full charge-discharge learning cycle required. 8 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 bq20z90 www.ti.com SLUS778 – JULY 2007 See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364) for further details. LED Display The bq20z90 can drive a 3-, 4-, or 5- segment LED display for remaining capacity indication. The LED drive current can be adjusted to 3mA, 4mA and 5mA digitally. LifeTime Data Logging Features The bq20z90 offers a lifetime data logging array, where all important measurements are stored for warranty and analysis purposes. The data monitored include: • • • • • • • • • • • • • Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime Lifetime maximum temperature minimum temperature maximum battery cell voltage minimum battery cell voltage maximum battery pack voltage minimum battery pack voltage maximum charge current maximum discharge current maximum charge power maximum discharge power maximum average discharge current maximum average discharge power average temperature Authentication The bq20z90 supports authentication by the host using SHA-1. Power Modes The bq20z90 supports 3 different power modes to reduce power consumption: • • • In Normal Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates in 1 second intervals. Between these intervals, the bq20z90 is in a reduced power stage. In Sleep Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates in adjustable time intervals. Between these intervals, the bq20z90 is in a reduced power stage. In Shutdown Mode the bq20z90 is completety disabled. CONFIGURATION Oscillator Function The bq20z90 fully integrates the system and processor oscillators and, therefore, requires no pins or components for this feature. System Present Operation The bq20z90 periodically verifies the PRES pin and detects that the battery is present in the system via a low state on a PRES input. When this occurs, bq20z90 enters normal operating mode. When the pack is removed from the system and the PRES input is high, the bq20z90 enters the battery-removed state, disabling the charge, discharge and ZVCHG FETs. The PRES input is ignored and can be left floating when non-removal mode is set in the data flash. BATTERY PARAMETER MEASUREMENTS The bq20z90 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a second delta-sigma ADC for individual cell and battery voltage, and temperature measurement. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 9 bq20z90 www.ti.com SLUS778 – JULY 2007 Charge and Discharge Counting The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage drop across a small-value sense resistor between the SRP and SRN pins. The integrating ADC measures bipolar signals from -0.25 V to 0.25 V. The bq20z90 detects charge activity when VSR = V(SRP)-V(SRN)is positive and discharge activity when VSR = V(SRP)-V(SRN) is negative. The bq20z90 continuously integrates the signal over time, using an internal counter. The fundamental rate of the counter is 0.65 nVh. Voltage The bq20z90 updates the individual series cell voltages through the bq29330 at one second intervals. The bq20z90 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin of the bq29330, which is required to be connected to VIN of the bq20z90. The internal ADC of the bq20z90 measures the voltage, scales it, and calibrates itself appropriately. This data is also used to calculate the impedance of the cell for the Impedance Track™ gas-gauging. Current The bq20z90 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current using a 5 mΩ to 20 mΩ typ. sense resistor. Wake Function The bq20z90 can exit sleep mode, if enabled, by the presence of a programmable level of current signal across SRP and SRN. Auto Calibration The bq20z90 provides an auto-calibration feature to cancel the voltage offset error across SRP and SRN for maximum charge measurement accuracy. The bq20z90 performs auto-calibration when the SMBus lines stay low continuously for a minimum of a programmable amount of time. Temperature The bq20z90 TS1 and TS2 inputs, in conjunction with two identical NTC thermistors (default are Semitec 103AT), measure the battery environmental temperature. The bq20z90 can also be configured to use its internal temperature sensor. COMMUNICATIONS The bq20z90 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS specification. SMBus On and Off State The bq20z90 detects an SMBus off state when SMBC and SMBD are logic-low for ≥ 2 seconds. Clearing this state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available. SBS Commands Table 1. SBS COMMANDS SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value 0x00 R/W ManufacturerAccess hex 2 0x0000 0xffff — 0x01 R/W RemainingCapacityAlarm unsigned int 2 0 65535 300 mAh or 10mWh 0x02 R/W RemainingTimeAlarm unsigned int 2 0 65535 10 min 0x03 R/W BatteryMode hex 2 0x0000 0xe383 — 0x04 R/W AtRate signed int 2 -32768 32767 — mA or 10mW 0x05 R AtRateTimeToFull unsigned int 2 0 65534 — min 0x06 R AtRateTimeToEmpty unsigned int 2 0 65534 — min 10 Submit Documentation Feedback Unit Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 bq20z90 www.ti.com SLUS778 – JULY 2007 Table 1. SBS COMMANDS (continued) SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value Unit 0x07 R AtRateOK unsigned int 2 0 65535 — 0x08 R Temperature unsigned int 2 0 65535 — 0.1°K 0x09 R Voltage unsigned int 2 0 65535 — mV 0x0a R Current signed int 2 -32768 32767 — mA 0x0b R AverageCurrent signed int 2 -32768 32767 — mA 0x0c R MaxError unsigned int 1 0 100 — % 0x0d R RelativeStateOfCharge unsigned int 1 0 100 — % 0x0e R AbsoluteStateOfCharge unsigned int 1 0 100+ — % 0x0f R/W RemainingCapacity unsigned int 2 0 65535 — mAh or 10mWh 0x10 R FullChargeCapacity unsigned int 2 0 65535 — mAh or 10mWh 0x11 R RunTimeToEmpty unsigned int 2 0 65534 — min 0x12 R AverageTimeToEmpty unsigned int 2 0 65534 — min 0x13 R AverageTimeToFull unsigned int 2 0 65534 — min 0x14 R ChargingCurrent unsigned int 2 0 65534 — mA 0x15 R ChargingVoltage unsigned int 2 0 65534 — mV 0x16 R BatteryStatus unsigned int 2 0x0000 0xdbff — 0x17 R/W CycleCount unsigned int 2 0 65535 — 0x18 R/W DesignCapacity unsigned int 2 0 65535 4400 mAh or 10mWh 0x19 R/W DesignVoltage unsigned int 2 0 65535 14400 mV 0x1a R/W SpecificationInfo hex 2 0x0000 0xffff 0x0031 0x1b R/W ManufactureDate unsigned int 2 — — 01-Jan-1980 0x1c R/W SerialNumber hex 2 0x0000 0xffff 0x0001 0x20 R/W ManufacturerName String 11+1 — — Texas Inst. ASCII 0x21 R/W DeviceName String 7+1 — — bq20z90 ASCII 0x22 R/W DeviceChemistry String 4+1 — — LION ASCII 0x23 R/W ManufacturerData String 14+1 — — — ASCII 0x2f R/W Authenticate String 20+1 — — — ASCII 0x3c R CellVoltage4 unsigned int 2 0 65535 — mV 0x3d R CellVoltage3 unsigned int 2 0 65535 — mV 0x3e R CellVoltage2 unsigned int 2 0 65535 — mV 0x3f R CellVoltage1 unsigned int 2 0 65535 — mV ASCII Table 2. EXTENDED SBS COMMANDS SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value Unit 0x45 R AFEData String 11+1 — — — ASCII 0x46 R/W FETControl hex 1 0x00 0x1e — 0x4f R StateOfHealth unsigned int 1 0 100 — 0x50 R SafetyAlert hex 2 0x0000 0xffff — 0x51 R SafetyStatus hex 2 0x0000 0xffff — 0x52 R PFAlert hex 2 0x0000 0x9fff — 0x53 R PFStatus hex 2 0x0000 0x9fff — 0x54 R OperationStatus hex 2 0x0000 0xf7f7 — 0x55 R ChargingStatus hex 2 0x0000 0xffff — % Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 11 bq20z90 www.ti.com SLUS778 – JULY 2007 Table 2. EXTENDED SBS COMMANDS (continued) SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value 0x57 R ResetData hex 2 0x0000 0xffff — 0x58 R WDResetData unsigned int 2 0 65535 — 0x5a R PackVoltage unsigned int 2 0 65535 --- mV 0x5d R AverageVoltage unsigned int 2 0 65535 — mV 0x60 R/W UnSealKey hex 4 0x00000000 0xffffffff — 0x61 R/W FullAccessKey hex 4 0x00000000 0xffffffff — 0x62 R/W PFKey hex 4 0x00000000 0xffffffff — 0x63 R/W AuthenKey3 hex 4 0x00000000 0xffffffff — 0x64 R/W AuthenKey2 hex 4 0x00000000 0xffffffff — 0x65 R/W AuthenKey1 hex 4 0x00000000 0xffffffff — 0x66 R/W AuthenKey0 hex 4 0x00000000 0xffffffff — 0x70 R/W ManufacturerInfo String 8+1 — — — ASCII 0x71 R/W SenseResistor unsigned int 2 0 65535 — μΩ 0x77 R/W DataFlashSubClassID hex 2 0x0000 0xffff — 0x78 R/W DataFlashSubClassPage1 hex 32 — — — 0x79 R/W DataFlashSubClassPage2 hex 32 — — — 0x7a R/W DataFlashSubClassPage3 hex 32 — — — 0x7b R/W DataFlashSubClassPage4 hex 32 — — — 0x7c R/W DataFlashSubClassPage5 hex 32 — — — 0x7d R/W DataFlashSubClassPage6 hex 32 — — — 0x7e R/W DataFlashSubClassPage7 hex 32 — — — 0x7f R/W DataFlashSubClassPage8 hex 32 — — — 12 Submit Documentation Feedback Unit Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): bq20z90 PACKAGE OPTION ADDENDUM www.ti.com 3-Dec-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ20Z90DBT-V150 ACTIVE TSSOP DBT 30 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z90DBT-V150G4 ACTIVE TSSOP DBT 30 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z90DBTR-V150 ACTIVE TSSOP DBT 30 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ20Z90DBTR-V150G4 ACTIVE TSSOP DBT 30 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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