® OPA2541 Dual High Power OPERATIONAL AMPLIFIER FEATURES DESCRIPTION ● OUTPUT CURRENTS TO 5A ● POWER SUPPLIES TO ±40V ● FET INPUT The OPA2541 is a dual power operational amplifier capable of operation from power supplies up to ±40V and output currents of 5A continuous. With two monolithic power amplifiers in a single package it provides unequaled functional density. ● ELECTRICALLY ISOLATED CASE The industry-standard 8-pin TO-3 package is isolated from all internal circuitry allowing it to be mounted directly to a heat sink without insulators which degrade thermal performance. Internal circuitry limits output current to approximately 6A. APPLICATIONS ● ● ● ● ● MOTOR DRIVER SERVO AMPLIFIER SYNCRO/RESOLVER EXCITATION VOICE COIL DRIVER BRIDGE AMPLIFIER The OPA2541 is available in both industrial and military temperature range versions. ● PROGRAMMABLE POWER SUPPLY ● AUDIO AMPLIFIER +VS (2) –In (4, 8) +In (3, 7) Out (5, 1) –VS (6) International Airport Industrial Park • Mailing Address: PO Box 11400 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • © SBOS157 1987 Burr-Brown Corporation • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 PDS-768B Printed in U.S.A. October, 1993 SPECIFICATIONS ELECTRICAL At TC = +25°C and VS = ±35VDC, unless otherwise noted. OPA2541AM PARAMETER CONDITIONS MIN OPA2541BM, SM TYP MAX ±2 ±20 ±2.5 ±20 Specified Temperature Range Specified Temperature Range MIN TYP MAX UNITS ±10 ±40 ±10 ±60 ±0.25 ±15 * * ±1 ±30 * * mV µV/°C µV/V µV/W 15 Note 1 50 * * * pA ±5 Note 1 ±30 * * * pA INPUT OFFSET VOLTAGE VOS vs Temperature vs Supply Voltage vs Power Specified Temperature Range VS = ±10V to ±VMAX INPUT BIAS CURRENT IB INPUT OFFSET CURRENT IOS INPUT CHARACTERISTICS Common-Mode Voltage Range Common-Mode Rejection Input Capacitance Input Impedance, DC Specified Temperature Range VCM = (|±VS| –6V) ±(|VS| –6) 95 ±(|VS| –3) 106 5 1 * * * * * * V dB pF 1012Ω RL = 6Ω 90 96 1.6 * * * dB MHz * * * * * 3 * * * * 3.5 V V V A A A * * * V/µs kHz µs GAIN CHARACTERISTICS Open Loop Gain at 10Hz Gain-Bandwidth Product OUTPUT Voltage Swing Current, Continuous IO = 5A IO = 2A IO = 0.5A +25°C +85°C +125°C (SM grade only) ±(|VS| –5.5) ±(|VS| –4.5) ±(|VS| –4.5) ±(|VS| –3.6) ±(|VS| –4) ±(|VS| –3.2) 5 7.0 4 5.0 AC PERFORMANCE Slew Rate Power Bandwidth Settling Time to 0.1% Capacitive Load Phase Margin Channel Separation 6 45 RL = 8Ω, VO = 20Vrms 2V Step Specified Temperature Range, G = 1 Specified Temperature Range, G >10 Specified Temperature Range, RL = 8Ω 1kHz, RL = 6Ω 8 55 2 * * 3.3 SOA * * 40 80 * * nF Degrees dB POWER SUPPLY Power Supply Voltage, ±VS Current, Quiescent ±10 Specified Temperature Range Total—Both Amplifiers ±30 40 ±35 50 0.8 0.9 1.25 1.4 30 1.0 1.2 1.5 1.9 * ±35 * ±40 * V mA * * * * * * * * * °C/W °C/W °C/W °C/W °C/W * +125 °C °C THERMAL RESISTANCE θJC, (Junction-to-Case) θJC θJC θJC θJA, (Junction-to-Ambient) Both Amplifiers(2), AC Output f > 60Hz Both Amplifiers(2), DC Output One Amplifier, AC Output f > 60Hz One Amplifier, DC Output No Heat Sink TEMPERATURE RANGE Case AM, BM SM –25 +85 * –55 *Specification same as OPA2541AM. NOTES: (1) Input bias and offset current approximately doubles for every 10°C increase in temperature. (2) Assumes equal dissipation in both amplifiers. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® OPA2541 2 ABSOLUTE MAXIMUM RATINGS CONNECTION DIAGRAM Supply Voltage, +VS to –VS .................................................................. 80V Output Current ............................................................................. see SOA Power Dissipation, Internal(1) ............................................................ 125W Input Voltage: Differential ..................................................................... ±VS Common-mode ............................................................. ±VS Temperature: Pin Solder, 10s ........................................................ +300°C Junction(1) ............................................................... +150°C Temperature Range: Storage .................................................... –65°C to +150°C Operating (Case) ..................................... –55°C to +125°C Top View TO-3 +VS +InA 2 3 1 OutB –InA 4 OutA 5 A B 8 –VS NOTE: (1) Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTTF. 6 –InB 7 +InB PACKAGE INFORMATION MODEL PACKAGE PACKAGE DRAWING NUMBER(1) TO-3 TO-3 TO-3 030 030 030 OPA2541AM OPA2541BM OPA2541SM NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. ORDERING INFORMATION MODEL PACKAGE TEMPERATURE RANGE OPA2541AM OPA2541BM OPA2541SM TO-3 TO-3 TO-3 –25°C to +85°C –25°C to +85°C –55°C to +125°C TYPICAL PERFORMANCE CURVES TA = +25°C and VS = ±35VDC, unless otherwise noted. INPUT BIAS CURRENT vs TEMPERATURE OPEN-LOOP GAIN AND PHASE vs FREQUENCY Voltage Gain (dB) 10 1 0.1 0.01 0.001 –25 0 25 50 75 100 125 110 100 90 80 70 60 50 40 30 20 10 0 –10 Phase Gain ZL = 3.3nF ZL = 2kΩ ZL = 3.3nF 1 Junction Temperature (°C) ZL = 2kΩ 0 –45 –90 –135 –180 Phase (Degrees) Input Bias Current (nA) 100 10 100 1k 10k 100k 1M 10M Frequency (Hz) ® 3 OPA2541 TYPICAL PERFORMANCE CURVES (CONT) TA = +25°C and VS = ±35VDC, unless otherwise noted. NORMALIZED QUIESCENT CURRENT vs TOTAL POWER SUPPLY VOLTAGE OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 1.3 6 1.2 5 (+VS) – VO |±VS| – |VOUT| (V) Normalized IQ 1.1 TC = –25°C 1.0 TC = +25°C 0.9 0.8 TC = +125°C 4 |–VS| – |VO| 3 2 1 0.7 0.6 0 20 40 30 50 60 70 80 0 90 1 2 3 6 8 7 9 10 10 1.0 THD + Noise (%) Voltage Noise Density (nV/√Hz) 5 TOTAL HARMONIC DISTORTION vs FREQUENCY VOLTAGE NOISE DENSITY vs FREQUENCY 1k 100 PO = 100mW 0.1 PO = 5W PO = 50W 0.01 0.001 10 1 10 100 1k 10k 10 100k 1k 100 10k 100k Frequency (Hz) Frequency (Hz) COMMON-MODE REJECTION vs FREQUENCY OUTPUT CURRENT vs TEMPERATURE 120 12 110 10 Output Current (A) 100 CMRR (dB) 4 IOUT (A) +VS + |–VS| (V) 90 80 70 8 IOUT– 6 IOUT+ 4 2 60 50 0 10 100 1k 10k 100k 1M –50 Frequency (Hz) 0 25 50 Case Temperature (°C) ® OPA2541 –25 4 75 100 125 TYPICAL PERFORMANCE CURVES (CONT) TA = +25°C and VS = ±35VDC, unless otherwise noted. DYNAMIC RESPONSE DYNAMIC RESPONSE ZLOAD = ∞, VS = ±35V, AV = +1 ZLOAD = 4700pF, VS = ±35V, AV = +1 INSTALLATION INSTRUCTIONS POWER SUPPLIES pation (total of both amplifiers) times the appropriate thermal resistance— The OPA2541 is specified for operation from power supplies up to ±40V. It can also be operated from an unbalanced or a single power supply so long as the total power supply voltage does not exceed 80V (70V for “AM” grade). The power supplies should be bypassed with low series impedance capacitors such as ceramic or tantalum. These should be located as near as practical to the amplifier’s power supply pins. Good power amplifier circuit layout is, in general, like good high-frequency layout. Consider the path of large power supply and output currents. Avoid routing these connections near low-level input circuitry to avoid waveform distortion and instability. ∆ TJC = (PD total) (θJC). Sufficient heat sinking must be provided to keep the case temperature within safe limits for the maximum ambient temperature and power dissipation. The thermal resistance of the heat sink required may be calculated by: θHS = (150°C – ∆ TJC – TA)/PD. Commercially available heat sinks usually specify thermal resistance. These ratings are often suspect, however, since they depend greatly on the mounting environment and air flow conditions. Actual thermal performance should be verified by measurement of case temperature under the required load and environmental conditions. Signal dependent load current can modulate the power supply voltage with inadequate power supply bypassing. This can affect both amplifiers’ outputs. Since the second amplifier’s signal may not be related to the first, this will degrade the inherent channel separation of the OPA2541. No insulating hardware is required when using the OPA2541. Since mica and other similar insulators typically add 0.7°C/W thermal resistance, this is a significant advantage. See Burr-Brown Application Note AN-83 for further details on heat sinking. HEAT SINKING Most applications will require a heat sink to prevent junction temperatures from exceeding the 150°C maximum rating. The type of heat sink required will depend on the output signals, power dissipation of each amplifier, and ambient temperature. The thermal resistance from junction-to-case, θJC, depends on how the power dissipation is distributed on the amplifier die. SAFE OPERATING AREA The Safe Operating Area (SOA) curve provides comprehensive information on the power handling abilities of the OPA2541. It shows the allowable output current as a function of the voltage across the conducting output transistor (see Figure 1). This voltage is equal to the power supply voltage minus the output voltage. For example, as the amplifier output swings near the positive power supply voltage, the voltage across the output transistor decreases and the device can safely provide large output currents demanded by the load. DC output concentrates the power dissipation in one output transistor. AC output distributes the power dissipation equally between the two output transistors and therefore has lower thermal resistance. Similarly, the power dissipation may be all in one amplifier (worst case) or equally distributed between the two amplifiers (best case). Thermal resistances are provided for each of these possibilities. The case-tojunction temperature rise is the product of the power dissi- ® 5 OPA2541 APPLICATIONS CIRCUITS The internal current limit will not provide short-circuit protection in most applications. When the amplifier output is shorted to ground, the full power supply voltage is impressed across the conducting output transistor. For instance, with VS = ±35V, a short circuit to ground would impress 35V across the conducting power transistor. The maximum safe output current at this voltage is 1.8A, so the internal current limit would not protect the amplifier. The unit-to-unit variation and temperature dependence of the internal current limit suggest that it be used to handle abnormal conditions and not activated in commonly encountered circuit operation. +VS 10µF + 0.1µF D1 L D2 SAFE OPERATING AREA 0.1µF 10 Inductiveor EMFGenerating Load TC = +25°C TC = +85°C 10µF * |IO| (A) + TC = +125°C –VS 1.0 D1 – D2: IN4003 FIGURE 2. Clamping Output for EMF-Generating Loads. *Depending on temperature, maximum output may be restricted by internal current limit. See output current specifications and typical curves. 0.1 1 10 +35V 0.1µF 100 |VS – VOUT| (V) R2 10kΩ FIGURE 1. Safe Operating Area. 30pF Reactive, or EMF generating loads such as DC motors can present demanding SOA requirements. With a purely reactive load, output voltage current occurs when the output voltage is zero and the voltage across the conducting transistor is equal to the full power supply voltage. See BurrBrown Application Note AN-123 for further information on evaluating SOA. VO 0.5Ω VIN R1 2.5kΩ 0.1µF AV = 1 + R2/R1 = 5 –35V Applications with inductive or EMF-generating loads which can produce “kick back” voltage surges to the amplifiers should include clamp diodes from the output terminals to the power supplies. These diodes should be chosen to limit the peak amplifier output voltage surges to less than 2V beyond the power supply rail voltage. Common 1A rated rectifier diodes will suffice in most applications. FIGURE 3. Isolating Capacitive Loads. R2 100kΩ 20pF R1 10kΩ AV = –R2/R1 = –10 VIN 0.1Ω A L 10kΩ Master 20pF 0.1Ω B Slave FIGURE 4. Paralleled Operation, Extended SOA. ® OPA2541 6 +60V 0.1µF 25kΩ 0-2mA DAC80-CBI-I VO 0-50V 0.1µF Protects DAC During Slewing –8V FIGURE 5. Programmable Voltage Source. +15V +35V + + 1µF 1µF Digital Word Input 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 18 23 100pF MSB 0.5Ω 1/2 OPA2541 VOUT = –30V to +30V DAC702 1µF + 21 –35V +15V FB ±1mA 10kΩ 17 + 1µF 10kΩ(1) LSB 7 20 19 + 6 1µF OPA27 2 3 4 –15V + NOTE: (1) TCR Tracking Resistors. 1µF 5kΩ(1) –15V FIGURE 6. 16-Bit Programmable Voltage Source. ® 7 OPA2541 VIN 10kΩ 10kΩ 10kΩ +35V 1/2 OPA2541 1/2 OPA2541 EMF 0.6Ω 0.1Ω –35V 5kΩ INA105KP 5kΩ 5 25kΩ 25kΩ 25kΩ 25kΩ 2 Regulation Adjust 6 1 7 +15V +VS 750mA Continuous (1) L –VS NOTE: (1) Midwest Components Inc. 288D01006 FIGURE 8. Limiting Output Current. ® OPA2541 4 –15V FIGURE 7. Bridge Amplifier Motor-Speed Controller. VIN 10kΩ PMI MOD907 8 3 PACKAGE OPTION ADDENDUM www.ti.com 17-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 18 Pb-Free (RoHS Exempt) NI Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) OPA2541AM NRND TO-3 LMF 8 N / A for Pkg Type OPA2541AM-BI NRND ZZ (BB) ZZ030 8 TBD Call TI OPA2541BM NRND TO-3 LMF 8 18 Pb-Free (RoHS Exempt) NI N / A for Pkg Type OPA2541SM NRND TO-3 LMF 8 18 Pb-Free (RoHS Exempt) NI N / A for Pkg Type OPA2541SMQ NRND TO-3 LMF 8 1 Pb-Free (RoHS Exempt) NI N / A for Pkg Type Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 ® PACKAGE DRAWING MMBC004 MECHANICAL DATA MMBC005 – APRIL 2001 LMF (O–MBCY–W8) METAL CYLINDRICAL PACKAGE 1.550 (39,37) 1.510 (38,35) 0.770 (19,56) ø 0.105 (2,67) 0.080 (2,03) 0.745 (18,92) 0.300 (7,62) 0.260 (6,60) Seating Plane 0.500 (12,70) 0.400 (10,16) ø 0.042 (1,07) 0.038 (0,97) 1.192 (30,28) 1.182 (30,02) 0.596 (15,14) 0.591 (15,01) ø 0.161 (4,09) 0.151 (3,84) 40° 2 1 8 3 4 1.020 (25,91) 0.980 (24,89) 5 7 6 ø 0.500 (12,70) 4202491/A 03/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Leads in true position within 0.010 (0,25) R @ MMC at seating plane. Pin numbers shown for reference only. Numbers may not be marked on package. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated