± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 D Remote Terminal ADSL Line Driver D D D D D High Speed − Ideal for Both Full Rate ADSL and G.Lite − Compatible With 1:1 Transformer Ratio Low 2.7 pA/√Hz Noninverting Current Noise − Reduces Noise Feedback Through Hybrid Into Downstream Channel Wide Supply Voltage Range ± 5 V to ± 15 V − Ideal for ± 12-V Operation Wide Output Swing − 42 Vpp Differential Output Voltage, RL = 200 Ω, ± 12-V Supply High Output Current − 175 mA (typ) D D D D D THS6052 SOIC (D) AND SOIC PowerPAD (DDA) PACKAGE (TOP VIEW) D1 OUT D1 IN− D1 IN+ VCC− 1 8 2 7 3 6 4 5 − 110 MHz (−3 dB, G=8, ± 12 V) − 1500 V/µs Slew Rate (G = 8, ± 12 V) Low Distortion, Single-Ended, G = 8 − −83 dBc (250 kHz, 2 Vpp, 100-Ω load) Low Power Shutdown (THS6053) − 300-µA Total Standby Current Thermal Shutdown and Short Circuit Protection Standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD Package Evaluation Module Available THS6053 SOIC (D) AND TSSOP PowerPAD (PWP) PACKAGE (TOP VIEW) D1 OUT D1 IN− D1 IN+ VCC− N/C GND N/C VCC+ D2 OUT D2 IN− D2 IN+ 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC+ D2 OUT D2 IN− D2 IN+ N/C SHUTDOWN N/C description The THS6052/3 is a high-speed line driver ideal for driving signals from the remote terminal to the central office in asymmetrical digital subscriber line (ADSL) applications. It can operate from ±12-V supply voltages while drawing only 5.2 mA of supply current per channel. It offers low –83 dBc total harmonic distortion driving a 100-Ω load (2 Vpp). The THS6052/3 offers a high 42-Vpp differential output swing across a 200-Ω load from a ±12-V supply. The THS6053 features a low-power shutdown mode, consuming only 300 µA quiescent current per channel. The THS6052/3 is packaged in a standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD packages. +12 V THS6052 Driver 1 + _ VI+ 1:1 750 Ω 210 Ω VI− + _ RELATED PRODUCTS 50 Ω THS6052 Driver 2 50 Ω DEVICE 15.4 dBm Delivered to Telephone Line DESCRIPTION THS6042/3 350-mA, ±12 ADSL CPE line driver 100 Ω THS6092/3 275-mA, +12 V ADSL CPE line driver OPA2677 380-mA, +12 V ADSL CPE line driver THS6062 Low noise ADSL receiver 0.68 µF −12 V 750 Ω Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright 2001, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 AVAILABLE OPTION PACKAGED DEVICE EVALUATION MODULES TA SOIC-8 (D) SOIC-8 PowerPAD (DDA) SOIC-14 (D) TSSOP-14 (PWP) 0°C to 70°C THS6052CD THS6052CDDA THS6053CD THS6053CPWP THS6052EVM THS6053EVM −40°C to 85°C THS6052ID THS6052IDDA THS6053ID THS6053IPWP — absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VCC Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 mA Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table Operating free-air temperature, TA: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature, Tstg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6052 and THS6053 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. DISSIPATION RATING TABLE TA = 25°C TJ = 150°C POWER RATING PACKAGE θJA θJC D-8 38.3°C/W‡ 9.2°C/W‡ 1.32 W D-14 95°C/W‡ 45.8°C/W‡ 66.6°C/W‡ 26.9°C/W‡ 1.88 W PWP 37.5°C/W 1.4°C/W DDA 2.73 W 3.3 W ‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package. recommended operating conditions MIN Supply voltage, VCC+ to VCC− 2 MAX ±5 ±15 Single supply 10 30 0 70 −40 85 C-suffix Operating free-air temperature, TA NOM Dual supply I-suffix POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT V °C ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) dynamic performance PARAMETER TEST CONDITIONS G= 1, RF = 1 kΩ RL = 50 Ω BW G= 2, RF = 680 Ω G= 8, RF = 330 Ω Small-signal bandwidth (− 3 dB) G= 1, RF = 1 kΩ RL = 100 Ω G= 2, RF = 680 Ω G= 8, RF = 330 Ω MIN TYP VCC = ± 5 V 110 VCC = ±12 V 120 90 VCC = ± 5 V 150 VCC = ±12 V 170 110 650 VCC = ±15 V VCC = ±12 V VCC = ±15 V VCC = ±12 V 950 1500 VCC = ±15 V NOTE 2: Slew rate is defined from the 25% to the 75% output levels. VCC = ±15 V 1700 Slew rate (see Note 2), G=8 VO = 16 VPP MHz 135 VCC = ±5 V, ±12 V VCC = ± 5 V VCC = ±12 V SR UNIT 100 VCC = ±5 V, ±12 V VCC = ± 5 V VCC = ±12 V VO = 4 VPP MAX 850 V/µs noise/distortion performance PARAMETER THD TEST CONDITIONS Total harmonic distortion (single-ended configuration) Vn Input voltage noise In Input current noise XT Gain = 8, RL = 100 Ω, VCC = ±12 12 V, f = 250 kHz VO(pp) = 16 V −78 RL = 50 Ω, f = 250 kHz VO(pp) = 2 V −74 VO(pp) = 6 V −72 Gain = 8, VCC = ±5 5 V, f = 250 kHz, G = 2, VCC = ±5 V, VCC = ±12 V, VCC = ±15 V VCC = ±12 V, RL= 100 Ω f = 250 kHz, G = 2, VCC = ±5 V, RL= 50 Ω f = 10 kHz, −Input Crosstalk TYP −83 VCC = ±5 V, f = 10 kHz , ±12 V +Input MIN VO(pp) = 2 V POST OFFICE BOX 655303 2.1 MAX UNIT dBc nV/√Hz 2.7 pA/√Hz 10.7 VO = 2 Vp-p −79 VO = 2 Vp-p −71 dBc • DALLAS, TEXAS 75265 3 ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) (continued) dc performance PARAMETER TEST CONDITIONS Input offset voltage VOS VCC = ±12 V, VCC = ±6 V Differential offset voltage Offset drift − Input bias current IIB VCC = ±12 V, VCC = ±6 6V + Input bias current MAX TA = 25°C TA = full range 5 10 TA = 25°C TA = full range 3 UNIT 15 6 mV 8 TA = full range TA = 25°C 30 5 TA = full range TA = 25°C 2 µV/°C 10 12 5 6 5 TA = full range RL = 1 kΩ, VCC = ±12 V, VCC = ±6 V Open loop transimpedance TYP TA = full range TA = 25°C Differential input bias current ZOL MIN A µA 10 12 1 MΩ input characteristics PARAMETER TEST CONDITIONS VICR Input common-mode voltage range VCC = ±12 V VCC = ± 6 V CMRR Common-mode rejection ratio VCC = ±12 V, VCC = ±6 V RI Input resistance CI Input capacitance TA = 25°C TA = full range MIN TYP ±9.7 ±10.1 ± 3.8 ±4.2 59 66 MAX UNIT V dB 57 + Input 1.5 MΩ − Input 15 Ω 2 pF output characteristics PARAMETER TEST CONDITIONS RL = 50 Ω, VO Output voltage swing Single ended RL = 100 Ω RL = 25 Ω, IO Output current ISC Short-circuit current RL = 0 Ω, Output resistance Open loop 4 RL = 10 Ω, POST OFFICE BOX 655303 VCC = ± 6 V VCC = ±12 V MIN TYP ±4.2 ±4.6 ±10.1 ±10.5 VCC = ±6 V VCC = ±12 V ±4.4 ±4.8 150 175 VCC = ±6 V VCC = ±12 V 150 175 • DALLAS, TEXAS 75265 MAX UNIT V mA 250 mA 14 Ω ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) (continued) power supply PARAMETER TEST CONDITIONS Dual supply VCC ICC PSRR Operating range Single supply MIN TYP MAX ± 4.5 ± 16.5 9 33 VCC = ±12 V TA = 25°C TA = full range 5.2 7 VCC = ±6 V TA = 25°C TA = full range 4.5 6.5 VCC = ±12 V TA = 25°C TA = full range −64 −62 −61 − VCC = ±6 V TA = 25°C TA = full range −60 −70 Quiescent current (each driver) Power supply rejection ratio UNIT V 8 mA 7.5 dB −58 shutdown characteristics (THS6053 only) PARAMETER TEST CONDITIONS VIL(SHDN) Shutdown pin voltage for power up VCC = ±6 V, ±12 V GND = 0 V, (GND Pin as Reference) VIH(SHDN) Shutdown pin voltage for power down VCC = ±6 V, ±12 V, GND = 0 V, (GND Pin as Reference) ICC(SHDN) tDIS Total quiescent current when in shutdown state tEN IIL(SHDN) Enable time (see Note 3) IIH(SHDN) Shutdown pin input bias current for power down Disable time (see Note 3) Shutdown pin input bias current for power up MIN TYP 0.8 2 UNIT V V VGND = 0 V, VCC = ±6 V, ±12 V VCC = ±12 V 0.3 VCC = ±12 V VCC = ±6 V, ±12 V 0.4 VCC = ±6 V, ±12 V, V(SHND) = 3.3 V MAX 0.7 mA µs 0.1 µs 40 100 µA 50 100 µA NOTE 3: Disable/enable time is defined as the time from when the shutdown signal is applied to the SHDN pin to when the supply current has reached half of its final value. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 APPLICATION INFORMATION +12 V THS6052 Driver 1 VI+ 0.1 µF + 6.8 µF 50 Ω + _ 1:1 750 Ω 100 Ω Telephone Line 1 µF 210 Ω 499 Ω +12 V 0.68 µF 1 kΩ THS6052 Driver 2 VI− 0.1 µF 50 Ω + _ 499 Ω − + THS6062 Receiver 1 750 Ω 0.1 µF VO+ 499 Ω 6.8 µF + −12 V 1 kΩ 499 Ω − + VO− THS6062 Receiver 2 −12 V 0.01 µF Figure 1. THS6052 ADSL Application With 1:1 Transformer Ratio 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty THS6052CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS6052CDDA ACTIVE SO Power PAD DDA 8 75 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM THS6052CDDAG3 ACTIVE SO Power PAD DDA 8 75 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM THS6052CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS6052ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS6052IDDA ACTIVE SO Power PAD DDA 8 75 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM THS6052IDDAG3 ACTIVE SO Power PAD DDA 8 75 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM THS6052IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS6053CPWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS6053CPWPRG4 ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS6053ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS6053IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS6053IPWP ACTIVE HTSSOP PWP 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS6053IPWPG4 ACTIVE HTSSOP PWP 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2008 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device THS6053CPWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 14 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) THS6053CPWPR HTSSOP PWP 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated